CN-117500142-B - Circuit board with embedded element and manufacturing method thereof

CN117500142BCN 117500142 BCN117500142 BCN 117500142BCN-117500142-B

Abstract

The invention provides an embedded element circuit board capable of enhancing heat radiation capacity, which comprises at least two heat radiation substrates arranged in a stacked mode, a bonding layer positioned between two adjacent heat radiation substrates, an insulating layer covered on the surface of the outermost heat radiation substrate and a plurality of heat radiation columns embedded in the insulating layer. Each heat dissipation substrate comprises a heat dissipation insulating layer, a first circuit layer, a second circuit layer, a conductive structure, an embedded structure and a plurality of heat dissipation columns, wherein the embedded structure comprises an electronic element electrically connected with the conductive structure, a conductive material connected with the conductive structure and an insulating heat conduction material connected with the electronic element and the heat dissipation insulating layer. The first circuit layer comprises a plurality of heat dissipation pads, and each heat dissipation post is connected with the heat dissipation pad. The invention also provides a manufacturing method of the embedded element circuit board.

Inventors

YANG YONGQUAN
LAN ZHICHENG

Assignees

鹏鼎控股(深圳)股份有限公司
宏启胜精密电子(秦皇岛)有限公司

Dates

Publication Date: 20260508
Application Date: 20220726

Claims (10)

1. A circuit board with embedded components, comprising: a plurality of heat dissipation insulating layers stacked on each other; The plurality of first circuit layers are respectively arranged on one surface of the heat dissipation insulating layer; the plurality of second circuit layers are opposite to the first circuit layers and are respectively arranged on the other sides of the heat dissipation insulating layers, one layer of the first circuit layers and one layer of the second circuit layers are respectively positioned on two opposite sides of each of the heat dissipation insulating layers, and the first circuit layers comprise a plurality of heat dissipation pads; The plurality of conductive structures are positioned in the heat dissipation insulating layer and are connected with the second circuit layer and the first circuit layer; a plurality of embedded structures respectively disposed within the heat dissipation insulating layer, each of the embedded structures comprising: A plurality of electronic components; A plurality of conductive materials positioned between the conductive structure and the electronic element and electrically connected with the electronic element and the conductive structure; a plurality of insulating and heat conducting materials positioned between the heat dissipation insulating layer and the electronic element and directly contacted with the heat dissipation insulating layer and the electronic element; a plurality of sealing materials for coating the electronic element; At least one bonding layer, wherein each of the bonding layers is disposed between adjacent two of the heat dissipation insulating layers; Two insulating layers respectively disposed on the outermost two of the first circuit layers, and The heat dissipation columns are arranged in the insulating layer and connected with the heat dissipation pads.
2. The embedded component circuit board of claim 1, wherein the insulating layer does not cover a surface of the heat spreader pillars that is remote from the heat spreader pads.
3. The embedded component circuit board of claim 1, wherein each of the heat spreading insulating layers has an opening and the embedded structure is located in the opening, wherein a surface of the conductive structure is aligned with a sidewall of the opening.
4. The embedded component circuit board of claim 1, wherein each of the insulating and thermally conductive materials is located between adjacent ones of the electrically conductive materials.
5. The embedded component circuit board of claim 1, wherein a thickness of each of the electronic components is no greater than a total thickness of one of the heat dissipation insulating layers and one of the second wiring layers.
6. A method of manufacturing a circuit board with embedded components, comprising: forming a plurality of heat dissipating substrates, wherein the step of forming each of the heat dissipating substrates comprises, Forming a first circuit layer and a second circuit layer on a heat dissipation insulating layer, wherein the heat dissipation insulating layer is clamped between the first circuit layer and the second circuit layer, and the first circuit layer comprises a plurality of heat dissipation pads; Forming a plurality of conductive holes in the heat dissipation insulating layer, wherein the conductive holes are electrically connected with the first circuit layer and the second circuit layer; Removing a portion of the heat dissipation insulating layer, a portion of the first circuit layer, a portion of the second circuit layer, and a portion of each of the conductive vias to form an opening, wherein the opening has a sidewall and a remaining portion of each of the conductive vias forms a conductive structure exposed to the sidewall; forming an insulating layer on the first circuit layer, wherein the insulating layer covers the opening; after the insulating layer is formed, a plurality of electronic components are arranged in the opening and are electrically connected with the conductive structure, and Filling a sealing material in the opening after the electronic component is arranged; Stacking and bonding the heat dissipation substrates, and After stacking and bonding the heat dissipating substrates, a plurality of heat dissipating studs are formed within the insulating layer of the heat dissipating substrate, wherein each of the heat dissipating studs connects the heat dissipating pad.
7. The method of claim 6, further comprising disposing a plurality of insulating and thermally conductive materials in the opening, wherein each of the insulating and thermally conductive materials is located between two of the electrically conductive structures and directly contacts the sidewall.
8. The method of claim 7, wherein the electronic component is brought into direct contact with the insulating and thermally conductive material after the electronic component is disposed.
9. The method of claim 6, wherein electrically connecting each of the electronic components to the conductive structure comprises: providing a plurality of conductive materials on the conductive structures, respectively, and After the electronic component is disposed, the electronic component is connected with the conductive material.
10. The method of claim 6, wherein the step of forming a plurality of the heat-dissipating studs comprises: Forming a plurality of openings in the insulating layer of the heat dissipation substrates, and And electroplating the blind holes in the open holes.

Description

Circuit board with embedded element and manufacturing method thereof Technical Field The present invention relates to a circuit board, and more particularly to a circuit board with embedded components. Background Under the current development of technology, a circuit board is capable of integrating a plurality of electronic components with high density distribution, and the technology of embedding the components can arrange the electronic components in the grooves of the circuit board. However, since the contact area between the circuit board pad and the electronic device is small, the circuit board pad and the electronic device must be precisely aligned and electrically connected. In addition, the electronic component is generally covered by the molding material, and the thermal conductivity of the molding material is generally low, so that the thermal energy generated by the electronic component is accumulated in the groove, which tends to reduce the service life of the electronic component. Disclosure of Invention Therefore, the invention provides the embedded element circuit board and the manufacturing method thereof, so as to increase the heat dissipation efficiency of the circuit board and reduce the mounting difficulty of the electronic element. The invention provides an embedded component circuit board which comprises at least two heat dissipation insulating layers, first circuit layers, second circuit layers, a plurality of conductive structures and a plurality of embedded structures, wherein the heat dissipation insulating layers are stacked and arranged, the first circuit layers are respectively arranged on one surface of each heat dissipation insulating layer, the first circuit layers further comprise a plurality of heat dissipation pads, the second circuit layers are respectively arranged on the other surface of the corresponding heat dissipation insulating layer relative to each first circuit layer, the conductive structures are positioned in the heat dissipation insulating layers and connected with the first circuit layers and the second circuit layers, and the embedded structures are respectively arranged in the heat dissipation insulating layers. Each embedded structure comprises a plurality of electronic elements, a plurality of conductive materials, a plurality of insulating heat conducting materials, a plurality of sealing materials and a plurality of sealing materials, wherein the conductive materials are positioned between the conductive structures and the electronic elements and are electrically connected with the electronic elements and the conductive structures, the insulating heat conducting materials are positioned between the heat dissipation insulating layer and the electronic elements and are directly contacted with the heat dissipation insulating layer and the electronic elements, and the sealing materials cover the electronic elements. The embedded element circuit board also comprises at least one jointing layer, two insulating layers and a plurality of heat dissipation columns, wherein each jointing layer is arranged between two adjacent heat dissipation insulating layers, the two insulating layers are respectively arranged on the two outermost heat dissipation insulating layers in the first circuit layer, and the heat dissipation columns are arranged in the insulating layers, and each heat dissipation column is connected with each heat dissipation pad. The insulating layer does not cover a surface of the heat dissipation post, which is far away from the heat dissipation pad. In at least one embodiment of the present invention, each of the heat dissipation insulating layers has an opening, and the embedded structure is located in the opening, and a surface of the conductive structure is aligned with a sidewall of the opening. In at least one embodiment of the present invention, each of the insulating and thermally conductive materials is located between adjacent ones of the electrically conductive materials. In at least one embodiment of the present invention, a thickness of each of the electronic components is not greater than a total thickness of one heat dissipation insulating layer and one second circuit layer. The invention also provides a manufacturing method of the embedded element circuit board, which comprises the step of forming at least two heat dissipation substrates. The method comprises the steps of forming each radiating substrate, forming a first circuit layer and a second circuit layer on a radiating insulating layer, wherein the radiating insulating layer is clamped between the first circuit layer and the second circuit layer, the first circuit layer further comprises a plurality of radiating pads, forming a plurality of conducting holes in the radiating insulating layer, wherein the conducting holes are electrically connected with the first circuit layer and the second circuit layer, removing a part of the radiating insulating layer, a part of the first ci