CN-117500663-B - Laminated structure, cured product of resin layer in the laminated structure, electronic component, and method for forming cured product

Abstract

Provided are a laminated structure, a cured product of a resin layer in the laminated structure, an electronic component having the cured product, and a method for forming the cured product thereof, wherein the laminated structure is excellent in both peelability and adhesion of the resin layer to a 2 nd film even when the ambient temperature around the laminated structure is raised to a certain temperature (particularly, about 40 ℃). [ solution ] A laminated structure comprises, in order, a1 st film, a resin layer, and a 2 nd film, wherein the resin layer comprises (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin, and the peel strength of the 2 nd film and the resin layer is 0.4-1.5N/cm at an ambient temperature of 40 ℃.

Inventors

• SASAKI MASAYUKI
• YONEDA KAZUYOSHI

Assignees

• 太阳控股株式会社

Dates

Publication Date

20260508

Application Date

20220318

Priority Date

20210325

Claims (5)

1. 1.A laminated structure comprising, in order, a 1 st film, a resin layer, and a 2 nd film, The resin layer contains (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin, The 2 nd film is a film formed using a thermoplastic resin, An arithmetic average surface roughness Ra of a surface of the 2 nd film on the resin layer side is 0.1 [ mu ] m or less, The peel strength of the 2 nd film and the resin layer is 0.4-1.5N/cm at the temperature of 40 ℃, The melt viscosity of the alkali-soluble resin (A) at 90 ℃ is in the range of 100-1000 Pa.s, The alkali-soluble resin (A) having the melt viscosity comprises an alkali-soluble polyurethane resin having the melt viscosity, an acid-modified epoxy acrylate resin having the melt viscosity, or a combination thereof, The solid content of the alkali-soluble polyurethane resin having the melt viscosity, the solid content of the acid-modified epoxy acrylate resin having the melt viscosity, or a combination thereof is 5 to 50% by mass relative to 100% by mass of the solid content of the resin layer, The solid content of the (B) polyfunctional photopolymerizable monomer is 10 to 40 mass% relative to 100 mass% of the solid content of the resin layer, The content of the photopolymerization initiator (C) is 0.1 to 40% by mass relative to 100% by mass of the solid content of the resin layer, The equivalent ratio of the functional group of the alkali-soluble resin (A) to the functional group of the thermosetting resin (D) reacting with the functional group is 1:0.1-1:10.
2. 2. The laminated structure according to claim 1, wherein the thickness of the resin layer is 5 to 100 μm.
3. 3. A cured product obtained by curing the resin layer in the laminated structure according to claim 1 or 2.
4. 4. An electronic component comprising the cured product according to claim 3.
5. 5. A method for forming a cured product, comprising the steps of: a step of peeling the 2 nd film in the laminated structure according to claim 1 or 2, attaching the resin layer to a circuit-formed substrate, and disposing the 1 st film and the resin layer on the substrate; An exposure step of irradiating a predetermined portion of the resin layer with active energy rays while separating the 1 st thin film; a developing step of peeling the 1 st film and removing a region of the resin layer after the exposing step, the region not being irradiated with active energy rays, and And a cured product forming step of heating the resin layer after the developing step.

Description

Laminated structure, cured product of resin layer in the laminated structure, electronic component, and method for forming cured product Technical Field The present invention relates to a laminated structure, a cured product of a resin layer in the laminated structure, an electronic component having the cured product, and a method for forming the cured product. In particular, the present invention relates to a laminated structure having excellent releasability and adhesion between a resin layer and a2 nd film, a cured product of the resin layer in the laminated structure, an electronic component having the cured product, and a method for forming the cured product. Background An insulating film (solder resist layer) is formed on a printed circuit board used in various electronic devices. The insulating film is formed, for example, by using a laminated structure including a1 st thin film, a resin layer, and a2 nd thin film in this order. The method for forming the insulating film based on the laminated structure includes a step of peeling the 2 nd thin film from the laminated structure, and the insulating film is finally formed on the substrate on which the circuit is formed through the step. In comparative document 1, an adhesive sheet with a protective film is disclosed which defines the relationship between the peel strength of the protective film (film 2) to the resin composition layer and the peel strength of the support (film 1) to the resin composition layer. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2018-123331 Disclosure of Invention Problems to be solved by the invention However, in the case of the adhesive sheet with a protective film described in patent document 1, since the peel strength is small, when the adhesive sheet is formed into a roll, there is a concern that a problem may occur in that wrinkles are easily generated due to winding displacement. That is, there is still a problem in terms of adhesion (inadequate peel strength) of the resin layer to the 2 nd film. In addition, regarding the laminated structure, in consideration of the step of peeling the 2 nd film from the laminated structure, good peelability of the resin layer and the 2 nd film is required, and on the other hand, good adhesion of the resin layer and the 2 nd film is also required (for example, good adhesion of the laminated structure when they are formed into a roll). That is, it is important to obtain a laminated structure having both of these opposite properties. In particular, it is also important to obtain a laminated structure having good releasability and adhesion between the resin layer and the 2 nd film under such a condition that the ambient temperature around the laminated structure is raised to about 40 ℃. The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a laminated structure, a cured product of a resin layer in the laminated structure, an electronic component having the cured product, and a method for forming the cured product, in which both peelability and adhesiveness of the resin layer to a 2 nd film are excellent, particularly under a condition that an ambient temperature around the laminated structure rises to a certain temperature (particularly, about 40 ℃). Solution for solving the problem As a result of intensive studies, the present inventors have found that the above object can be achieved by setting the peel strength of a laminated structure comprising a1 st film, a resin layer containing a specific component, and a2 nd film to a specific range at an ambient temperature of 40 ℃. That is, the foregoing object can be attained by the laminated structure of the present invention, The laminated structure is characterized by comprising a1 st film, a resin layer and a 2 nd film in this order, The resin layer contains (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin, The peel strength of the 2 nd film and the resin layer is 0.4-1.5N/cm at 40 ℃ of the ambient temperature. According to a preferred embodiment of the laminated structure of the present invention, the thickness of the resin layer is 5 to 100 μm. According to another preferred embodiment of the laminated structure of the present invention, the arithmetic average surface roughness Ra of the surface on the resin layer side in the 2 nd film is 0.1 μm or less. According to still another preferred embodiment of the laminated structure of the present invention, the melt viscosity of the alkali-soluble resin (a) at 90 ℃ is in the range of 100 to 1000pa·s. According to still another preferred embodiment of the laminated structure of the present invention, the alkali-soluble resin (A) having the aforementioned melt viscosity comprises an alkali-soluble polyurethane resin having the aforementioned melt viscosity, an acid-modifie