CN-117565417-B - Encapsulating device of printed board assembly with lead-out cable

CN117565417BCN 117565417 BCN117565417 BCN 117565417BCN-117565417-B

Abstract

The invention discloses a filling and sealing device of a printed board assembly with a lead-out cable, which belongs to the field of filling and sealing matched devices and comprises a base, limiting assemblies, a solenoid with a core and a cover plate assembly, wherein a first mounting hole is formed in the center of the base and used for horizontally suspending the printed board assembly, a plurality of limiting assemblies are uniformly distributed on the base and used for positioning the printed board assembly, one side of each limiting assembly is provided with the solenoid with the core, the solenoid with the core is electrically connected with an external function generator, the cover plate assembly is positioned right above the base, a magnet corresponding to the solenoid with the core is embedded in a pressing plate of the cover plate assembly, and an aluminum sheet is arranged at the lower end of the magnet. The printed board assembly is arranged in the first mounting hole, is positioned by the limiting assembly, is provided with an outer cover plate after glue filling, is arranged on the base, and is used for introducing signals to the solenoid with the iron core through the external function generator to generate electromagnetic force to adsorb the magnet of the cover plate assembly, so that the pressing plate is used for pressing the outer cover plate. The invention solves the problem of encapsulation quality of the printed board assembly with the lead-out cable.

Inventors

MA XIAORONG
JIANG YONGHUI
WANG SHUANG
WANG KANG
YANG WEIWEI
SHA TING
ZHAO LIN
DONG JIWEI

Assignees

西安长峰机电研究所

Dates

Publication Date: 20260508
Application Date: 20231017

Claims (10)

1. The encapsulating device of the printed board assembly with the lead-out cable is characterized by comprising a base (1), a limiting assembly (2), a solenoid (3) with a core and a cover plate assembly (4); The base (1) is positioned at the bottom of the encapsulating device, and a first mounting hole (11) is formed in the center of the base (1) and used for horizontally suspending the printed board assembly (5); The limiting assemblies (2) are circumferentially and uniformly distributed on the base (1) along the first mounting holes (11), and the limiting directions of the limiting assemblies are arranged facing the first mounting holes (11) and are used for clamping and positioning the printed board assemblies (5); One side of each limiting component (2) is provided with a solenoid (3) with an iron core, and the solenoid (3) with the iron core is electrically connected with an external function generator; The cover plate assembly (4) comprises a pressing plate (41), magnets (42) and aluminum sheets (43), wherein the pressing plate (41) is positioned right above the base (1), the magnets (42) which are in one-to-one correspondence with the iron core solenoids (3) on the base (1) are embedded and installed on the pressing plate (41), and the aluminum sheets (43) are positioned at the lower ends of the magnets (42) and are coaxially embedded and installed on the pressing plate (41) with the magnets (42); The connecting body (51) of the printed board assembly (5) is embedded and installed in the first installation hole (11), the lower end face of the assembly shell (52) is horizontally arranged on the base (1), the lead-out cable (53) penetrates through the first installation hole (11) to be suspended, the printed board assembly (5) is positioned through the limiting assembly (2), glue solution is poured into the printed board assembly (5), the outer cover plate (54) is assembled, the cover plate assembly (4) is arranged on the base (1), signals are introduced into the iron core solenoid (3) through the external function generator, the iron core solenoid (3) generates electromagnetic force to adsorb the magnet (42) of the cover plate assembly (4), the outer cover plate (54) of the printed board assembly (5) is pressed through the pressing plate (41), the size of a magnetic field generated in the iron core solenoid is changed through applying a disturbance waveform to the iron core solenoid, when the changed magnetic field passes through an aluminum sheet, the size of the aluminum sheet is changed, the aluminum sheet is subjected to the action of Lorentz force in the magnetic field, ultrasonic wave is generated, and the ultrasonic wave is guided into the glue solution through the pressing plate.
2. The encapsulating device of the printed board assembly with the outgoing cables, which is characterized in that the base (1) comprises a base plate (12), a cross beam (13), upright posts (14) and a supporting plate (15), a plurality of upright posts (14) are fixed below the base plate (12) and used for supporting the base plate (12) to be horizontally suspended, the plurality of cross beams (13) are sequentially connected and enclosed on the periphery of the base plate (12), the base plate (12) and the cross beam (13) form an accommodating cavity together, the supporting plate (15) is horizontally arranged in the accommodating cavity, the lower end face of the supporting plate (15) is fixed with the base plate (12), the peripheral side wall of the supporting plate (15) is in contact with the inner side wall of the cross beam (13), the first mounting hole (11) is located in the center of the supporting plate (15) and penetrates through the base plate (12), and the solenoid with iron core (3) and the limiting assembly (2) are mounted on the supporting plate (15).
3. The potting device of the printed board assembly with the outgoing cable according to claim 2, wherein the first mounting hole (11) is matched in size with the outer diameter of the connector (51) of the printed board assembly (5).
4. The encapsulating device of the printed board assembly with the lead-out cable according to claim 2, wherein the supporting plate (15) is provided with a plurality of second mounting holes uniformly distributed in the circumferential direction of the first mounting holes (11) for mounting the solenoid with iron core (3).
5. The potting device of the printed board assembly with the outgoing cable according to claim 4, wherein the solenoid with iron core (3) comprises a coil (31), an iron core (32) and a transparent plastic shell (33), the iron core (32) is vertically arranged in a second mounting hole of the supporting board (15), the coil (31) is wound on the outer diameter of the iron core (32), and the plastic shell (33) is wrapped on the outer side of the coil (31).
6. The potting apparatus of a printed board assembly with an outgoing cable according to claim 5, wherein the coil (31) is electrically connected to a function generator, and a power amplifier is connected in series between the function generator and the coil (31), and the function generator is supplied with power by a power supply.
7. The encapsulating device of the printed board assembly with the outgoing cable according to claim 2, wherein the limiting assembly (2) comprises a guide rail (21), a sliding block (22) and a screw (23), the guide rail (21) is fixed on the upper end face of the supporting plate (15), the central axis of the guide rail (21) is perpendicularly intersected with the axis of the first mounting hole (11), sliding ways (211) parallel to the central axis of the guide rail are arranged on two sides of the guide rail (21), the sliding block (22) is sleeved on the guide rail (21) and is in sliding connection with the sliding ways (211), the screw (23) penetrates through the sliding block (22), the end portion of the screw extends to the sliding way (211) and is used for limiting the axial position of the sliding block (22) on the guide rail (21), and one face of the sliding block (22) facing the first mounting hole (11) is in contact with the outer side face of the assembly shell (52).
8. The encapsulating device of the printed board assembly with the lead-out cable according to claim 2, wherein the pressing plate (41) and the supporting plate (15) are polytetrafluoroethylene plates.
9. The encapsulating device of the printed board assembly with the outgoing cable, as claimed in claim 2, is characterized in that the cross beam (13) and the base plate (12) are both 45 steel plates.
10. The potting device of the printed board assembly with the outgoing cable according to claim 2, wherein the upright (14) is hot rolled equilateral 45 steel, and the upright (14) is fixed with the base plate (12) in a welding mode.

Description

Encapsulating device of printed board assembly with lead-out cable Technical Field The invention belongs to the field of filling and sealing matched devices, and particularly relates to a filling and sealing device for a printed board assembly with an outgoing cable. Background The printed board assembly with the lead-out cable has larger working voltage, risk of breakdown in the process of environmental mechanical test, higher height of components and parts and smaller safety clearance. Therefore, the printed board assembly needs to be subjected to potting treatment before being subjected to an environmental mechanical test. The encapsulation can strengthen the integrity of the electronic device, improve the resistance to external impact and vibration, improve the insulation between internal elements and circuits, be beneficial to the miniaturization and the light weight of the device, avoid the direct exposure of the elements and the circuits, improve the waterproof and dampproof performances of the device, and improve the use performance and the stability parameters. The printed board assembly with the outgoing cable comprises the outgoing cable, an assembly shell and an outer cover plate, wherein the outgoing cable and the assembly shell are installed through screws and then assembled with the outer cover plate to form the printed board assembly. The length of the outgoing cable is longer, the connecting part of the outgoing cable and the component shell is a connecting body of the outgoing cable, and the connecting body is heavy and protrudes out of the component shell. The printed board assembly cannot be placed on the horizontal plane smoothly due to the protrusion of the connecting body, and the cable needs to be in a suspended state in the process of encapsulating the printed board assembly. Considering the structural specificity of the printed board assembly, the outer cover plate is adhered to the assembly shell by means of the pouring sealant, and the outer cover plate needs to be fixed by external force under the condition that the sealant is not solidified so as to avoid warping. In the prior art, the printed board assembly with the lead-out cable is encapsulated, a plastic bracket is generally adopted for supporting the assembly shell, and a 3M adhesive tape is adopted for fixing the outer cover plate after encapsulation. The method has the following defects that firstly, the 3M adhesive tape is used for fixing the outer cover plate, the efficiency is low, the fixing effect is poor, the end face of the outer cover plate bulges outwards due to expansion of the adhesive solution, and the adhesive tape can damage the plating layer of the outer cover plate. Secondly, the component shell adopts a plastic bracket to support, the weight of the printed board component after encapsulation is increased, the supporting strength of the plastic bracket is insufficient and the plastic bracket is not placed smoothly, and the risk of glue overflow exists. And if the printed board assembly is not stably placed or the outer cover plate is not tightly pressed, the potting adhesive is unevenly distributed in the printed board assembly, gaps among components in the high-voltage area are not filled with the adhesive, the printed board assembly can be broken down in the process of power-on operation, the risk of high-voltage breakdown still exists, and the potting effect is not achieved. Therefore, it is necessary to design a potting device suitable for a printed board assembly with an outgoing cable, and the potting quality is ensured. Disclosure of Invention The technical problems to be solved are as follows: In order to avoid the defects of the prior art, the invention provides a potting device of a printed board assembly with an outgoing cable, wherein a through hole is arranged in the center of a base to accommodate a connector of the outgoing cable, the outgoing cable is suspended, a shell assembly is horizontally arranged on the base and positioned through a limiting assembly arranged on the base, a solenoid with a iron core is arranged around the base, the solenoid with the iron core is externally connected with a function generator, and an outer cover plate of the potted printed board assembly is fixed under the action of electromagnetic force by matching with a cover plate assembly. The invention solves the problems of difficult stable placement, overflow of the potting adhesive, tilting deformation of the outer cover plate, damage of the cover plate plating layer, uneven distribution of the potting adhesive and potting quality of air bubbles caused by poor fixing effect of the outer cover plate when the printed board assembly with the lead-out cable is potted in the prior art. The technical scheme of the invention is that the encapsulating device of the printed board assembly with the lead-out cable comprises a base, a limiting assembly, a solenoid with a core and a cover plate assembly; The base is posi