CN-117658434-B - Automatic flame polishing method for quartz wafer

CN117658434BCN 117658434 BCN117658434 BCN 117658434BCN-117658434-B

Abstract

The invention provides an automatic flame polishing method of a quartz wafer, which comprises the steps of placing the quartz wafer to be polished in a clamp, wherein the clamp comprises a roller provided with a groove, the edge of the quartz wafer is placed in the groove, controlling a polishing gun to align to the surface of the quartz wafer, controlling the polishing gun to spray flame and automatically polish the quartz wafer according to a set moving track while driving the quartz wafer to operate by the roller, and compared with the traditional manual polishing, the automatic flame polishing method has the advantages of high efficiency, more stability in polishing, more uniform appearance and better consistency of the polished quartz wafer, thereby improving the processing yield, and avoiding the collision problem caused by repeated clamping in the polishing process of the quartz wafer by driving the quartz wafer to operate by the roller.

Inventors

ZHOU WENHUA
ZHOU WEIJUN
LV HONGBING
XIE DONGLEI
Yao Jiapeng

Assignees

上海强华实业股份有限公司

Dates

Publication Date: 20260508
Application Date: 20231207

Claims (7)

1. An automatic flame polishing method for a quartz wafer, comprising: Placing a quartz wafer to be polished in a clamp, wherein the clamp comprises a roller provided with a groove, and the edge of the quartz wafer is placed in the groove; Controlling a polishing gun to be aligned to the surface of the quartz wafer; Controlling the polishing gun to spray flame and automatically polishing the quartz wafer according to a set moving track while the roller is operated to drive the quartz wafer to operate; The rollers comprise sliding rollers, lifting rollers and fixed rollers; The sliding roller, the lifting roller and the fixed roller are sequentially arranged at intervals from left to right, grooves on the sliding roller and the fixed roller form a clamping area, and the edge of the quartz wafer is placed on the clamping area; the two opposite side surfaces of at least one groove are inclined surfaces, the contact between the inclined surfaces and the quartz wafer is point contact, and the opening size of the groove is gradually reduced along with the increase of the depth of the groove; the sliding roller and the fixed roller are matched to drive the quartz wafer to rotate; The lifting roller moves along the horizontal direction to limit the swing amplitude of the quartz wafer when rotating, and the horizontal direction intersects with the plane where the quartz wafer is positioned, or moves along the vertical direction through the lifting device to support the bottom of the quartz wafer; The two lifting rollers are arranged on the roller frame through roller shafts, the two lifting rollers can move in the horizontal direction along the roller shafts, the bottom of the roller frame is connected with a lifting device arranged in the operating platform, the roller frame moves in the vertical direction through the lifting device, the two separated lifting rollers are located on two opposite side surfaces of the quartz wafer and used for limiting the swing amplitude of the quartz wafer during rotation, and the two combined lifting rollers are located below the quartz wafer and used for supporting the quartz wafer.
2. The method of claim 1, wherein said controlling the polishing gun spray flame comprises: and adjusting the size of the flame sprayed by the polishing gun according to the thickness and the diameter of the quartz wafer.
3. The method of claim 1, wherein automatically polishing the quartz wafer according to the set movement trajectory comprises: And controlling the polishing gun to move inwards circle by circle along the diameter direction of the quartz wafer according to a preset time interval to automatically polish the quartz wafer.
4. The method of claim 1, wherein a spacing between the slide roller and the lift roller is adjustable.
5. The method of claim 1, wherein the height of the lifting roller is less than the height of the sliding roller or the height of the lifting roller is less than the height of the fixed roller.
6. The method of claim 1, wherein placing the quartz wafer to be polished prior to the fixture further comprises: Controlling the polishing gun to heat the clamp; And cleaning the quartz wafer to be polished.
7. The method of any one of claims 1-6, further comprising providing a first robotic arm, and/or a second robotic arm; The first mechanical arm is used for controlling the polishing gun; And the second mechanical arm is used for clamping the polished quartz wafer which is naturally cooled and placing a new quartz wafer on the clamp.

Description

Automatic flame polishing method for quartz wafer Technical Field The invention relates to the technical field of quartz processing, in particular to an automatic flame polishing method for a quartz wafer. Background In the quartz semiconductor industry, the quartz plate is used for manufacturing required parts, especially the quartz wafer, because of the shape characteristics, the quartz plate has ultrahigh requirements on a clamp and a polishing technology, an operator usually needs to repeatedly adjust a clamping part and polish by flame in the process to enable the appearance to reach the quality requirement of the crystal transmission close to zero flaws, the problems of low manual polishing efficiency and high cost exist, and because the operation is complex and the duration is long, the operator is easy to generate fatigue when performing flame polishing, the caused improper operation causes the polishing effect of the quartz wafer to be unsatisfactory, or the problem of appearance quality such as gaps, scratches and uneven polishing caused by repeated clamping or the deformation caused by the change of the plate after flame polishing can not be caused, and the plate can only be scrapped. Accordingly, there is a need for an automatic flame polishing method for quartz wafers to improve the above-mentioned problems. Disclosure of Invention The invention aims to provide an automatic flame polishing method for a quartz wafer, which is used for improving the polishing efficiency and uniformity of the quartz wafer and avoiding the collision problem caused by repeated clamping in the polishing process of the quartz wafer. In a first aspect, the present invention provides an automatic flame polishing method for a quartz wafer, comprising: Placing a quartz wafer to be polished in a clamp, wherein the clamp comprises a roller provided with a groove, and the edge of the quartz wafer is placed in the groove; Controlling a polishing gun to be aligned to the surface of the quartz wafer; And controlling the polishing gun to spray flame and automatically polishing the quartz wafer according to the set moving track while the roller is operated to drive the quartz wafer to operate. The method has the advantages that the quartz wafer to be polished is placed in the clamp, the clamp comprises the roller provided with the groove, the edge of the quartz wafer is placed in the groove, the polishing gun is controlled to be aligned to the surface of the quartz wafer, the polishing gun is controlled to spray flame and automatically polish the quartz wafer according to the set moving track while the roller is operated to drive the quartz wafer to operate, compared with the traditional manual polishing, the efficiency is high, the polishing is more stable, the appearance of the polished quartz wafer is more uniform, the consistency is better, the processing yield is improved, and the collision problem caused by repeated clamping in the polishing process of the quartz wafer can be avoided by using the roller to drive the quartz wafer to operate. Optionally, the controlling the polishing gun to spray flame includes: And adjusting the size of the flame sprayed by the polishing gun according to the thickness and the diameter of the quartz wafer. The polishing gun has the beneficial effects that the size of the spraying flame of the polishing gun is adjusted based on the thickness and the diameter of the quartz wafer, so that the polishing stability can be improved, and the processing yield can be improved. Optionally, the automatically polishing the quartz wafer according to the set movement track includes: And controlling the polishing gun to move inwards circle by circle along the diameter direction of the quartz wafer according to a preset time interval to automatically polish the quartz wafer. The polishing device has the beneficial effects that the polishing gun is controlled to move inwards along the diameter direction of the quartz wafer circle by circle according to the preset time interval to automatically polish the quartz wafer, so that polishing is more uniform, yield and efficiency are improved, and the product exchange period is shortened. Optionally, the rollers include a sliding roller, a lifting roller and a fixed roller; The sliding roller, the lifting roller and the fixed roller are sequentially arranged at intervals from left to right, grooves on the sliding roller and the fixed roller form a clamping area, and the edge of the quartz wafer is placed on the clamping area. The quartz wafer polishing device has the beneficial effects that the active sliding roller and the two driven fixed rollers are sequentially arranged from left to right at intervals, so that the collision problem caused by repeated clamping in the quartz wafer polishing process can be avoided, and the stability is high. Optionally, the interval between the sliding roller and the lifting roller is adjustable. The quartz wafer polishing device ha