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CN-117672085-B - Display module, preparation method thereof and display device

CN117672085BCN 117672085 BCN117672085 BCN 117672085BCN-117672085-B

Abstract

The invention belongs to the technical field of display, and discloses a display module, a preparation method thereof and a display device. The display module comprises a micro display screen body, a flexible circuit board, a metal boss and an adhesive piece, wherein the micro display screen body comprises a first substrate, a display area is arranged on the first substrate, a plurality of PADs which are parallel to each other and are arranged at intervals are arranged on one side of the display area, the PADs are concavely embedded on the first substrate, the flexible circuit board comprises a second substrate, a plurality of golden fingers which are parallel to each other are arranged on the second substrate, the golden fingers are in one-to-one correspondence with the PADs, the metal boss is provided with a plurality of golden fingers, the first end of the metal boss is abutted to the PADs, the second end of the metal boss protrudes out of the first substrate, and the adhesive piece is used for connecting the second end of the metal boss with the golden fingers. The invention also provides a preparation method of the display module, and the preparation efficiency of the metal boss is improved. The invention also provides a display device which comprises the display module and has higher use reliability.

Inventors

  • PAN FEI
  • ZHOU WENBIN
  • LI GAOMIN
  • SUN JIAN

Assignees

  • 昆山梦显电子科技有限公司

Dates

Publication Date
20260508
Application Date
20231206

Claims (7)

  1. 1. Display module, its characterized in that includes: the micro display screen body (100) comprises a first substrate (110), wherein a display area (120) is arranged on the first substrate (110), a plurality of PADs (130) which are parallel to each other and are arranged at intervals are arranged on one side of the display area (120), the PADs (130) are concavely embedded on the first substrate (110), and a Dummy area (140) is arranged on one side, far away from the display area (120), of the PADs (130); The flexible circuit board (200) comprises a second substrate (210), wherein a plurality of mutually parallel golden fingers (220) are arranged on the second substrate (210), and the golden fingers (220) and the PADs (130) are in one-to-one correspondence; The metal bosses (300) are arranged, the metal bosses (300) and the PADs (130) are in one-to-one correspondence, the first ends of the metal bosses (300) are abutted to the PADs (130), and the second ends of the metal bosses (300) are arranged to protrude out of the first substrate (110); the bonding pieces (400) are arranged in a plurality, the bonding pieces (400) and the golden fingers (220) are in one-to-one correspondence, and the bonding pieces (400) are used for connecting the second ends of the metal bosses (300) and the golden fingers (220).
  2. 2. The display module according to claim 1, wherein the adhesive member (400) is a conductive adhesive.
  3. 3. A method for manufacturing a display module according to claim 1 or 2, the method comprising: providing a micro display screen body (100), wherein the micro display screen body (100) comprises a first substrate (110), a display area (120) is arranged on the first substrate (110), a plurality of PADs (130) which are parallel to each other and are arranged at intervals are arranged on one side of the display area (120), the PADs (130) are concavely embedded on the first substrate (110), and a Dummy area (140) is arranged on one side, far away from the display area (120), of the PADs (130); Coating a first photoresist (500), exposing and developing, coating the first photoresist (500) on the micro display screen body (100), exposing and developing, transferring a pattern on a first mask onto the first photoresist (500), and forming a windowing pattern at the position of the metal boss (300); electroplating, wherein the micro display screen body (100) is immersed in electroplating liquid, and the metal boss (300) is formed at the position of windowing; and removing photoresist and removing the first photoresist (500).
  4. 4. A method of manufacturing a display module according to claim 3, characterized in that before coating the first photoresist (500) and exposing and developing, further comprising: Sputtering, namely bombarding the micro display screen body (100) by high-speed ions, and sputtering a target material to the surface of the micro display screen body (100) to form a bottom metal layer (600).
  5. 5. The method of manufacturing a display module according to claim 4, further comprising, after removing the first photoresist (500): Coating a second photoresist (700), exposing and developing, coating the second photoresist (700) on the surfaces of the bottom metal layer (600) and the metal boss (300), exposing and developing, and transferring the pattern on the second mask plate onto the second photoresist (700) to form a protection pattern for the metal boss (300); Etching to remove the bottom metal layer (600) located on the circumferential side of the metal boss (300); And removing photoresist and removing the second photoresist (700).
  6. 6. The method of claim 4, wherein the micro-display screen (100) is cleaned prior to the sputtering.
  7. 7. A display device, characterized in that the display device comprises a display module according to claim 1 or 2.

Description

Display module, preparation method thereof and display device Technical Field The invention relates to the technical field of display, in particular to a display module, a preparation method thereof and a display device. Background With the development of display technology and the rise of metauniverse concepts in recent years, microdisplay technology has received extensive attention and research. However, as display panels shrink, many process difficulties are emerging, including process challenges due to the miniaturization of pixels, brightness loss due to CF (Color filters) during colorization, challenges to the module process during panel miniaturization, and the like. The FPC (Flexible Printed Circuit) is a flexible circuit board connected with the micro display screen body and the drive, and a typical FPC binding process is to make a PAD (PAD) exposed at the screen body end correspond to golden fingers on the FPC one by one and use conductive adhesive for binding. In the field of micro display, because the attaching precision of the existing module manufacturing process cannot meet the increasingly miniaturized screen process, abnormal display caused by PAD short circuit occurs in the FPC binding process. For example, as shown in fig. 1-3, since the alignment and lamination precision of the module bonding process is generally ±20 μm, and the distance between the PAD110' of the micro display screen body 100' and the Dummy area 120' (the semiconductor structure without function) is generally set to 20 μm, during the manufacturing process, the gold finger 210' on the flexible circuit board 200' is easily overlapped to the Dummy area 120', and the width of the metal strip in the Dummy area 120' is often larger than that of one PAD110', so that the adjacent gold finger 210' is overlapped to cause abnormal display, resulting in low module yield. Therefore, a display module, a manufacturing method thereof and a display device are needed to solve the above technical problems. Disclosure of Invention The invention aims to provide a display module, a preparation method thereof and a display device, and aims to solve the problem that in the prior art, when a golden finger on an FPC is bound with a PAD on a micro display screen body, the golden finger on the FPC is very easy to be connected to a Dummy area on the micro display screen body, so that the adjacent golden finger is short-circuited to cause abnormal display, the contact between the golden finger and the Dummy area is avoided, and the yield of the display module is effectively improved. To achieve the purpose, the invention adopts the following technical scheme: A display module, comprising: The micro display screen body comprises a first substrate, wherein a display area is arranged on the first substrate, a plurality of PADs which are parallel to each other and are arranged at intervals are arranged on one side of the display area, the PADs are concavely embedded on the first substrate, and a Dummy area is arranged on one side of the PADs, which is far away from the display area; The flexible circuit board comprises a second substrate, wherein a plurality of mutually parallel golden fingers are arranged on the second substrate, and the golden fingers and the PADs are in one-to-one correspondence; The first ends of the metal bosses are abutted to the PADs, and the second ends of the metal bosses are protruded out of the first substrate; The bonding parts are provided with a plurality of bonding parts, the bonding parts correspond to the golden fingers one by one, and the bonding parts are used for connecting the second ends of the metal bosses with the golden fingers. Optionally, the adhesive is a conductive adhesive. A method for preparing a display module, which is used for preparing the display module according to any one of the above schemes, the method for preparing the display module comprises the following steps: Providing a micro display screen body, wherein the micro display screen body comprises a first substrate, a display area is arranged on the first substrate, a plurality of PADs which are parallel to each other and are arranged at intervals are arranged on one side of the display area, the PADs are concavely embedded on the first substrate, and a Dummy area is arranged on one side of the PADs, which is far away from the display area; Coating a first photoresist, exposing and developing, coating the first photoresist on the micro display screen body, exposing and developing, transferring a pattern on a first mask plate to the first photoresist, and forming a windowing pattern at the position of a metal boss; electroplating, namely immersing the micro display screen body into electroplating liquid, and forming the metal boss at the position of windowing; And removing photoresist and removing the first photoresist. Optionally, before the coating the first photoresist and exposing and developing, the method further comprises: Sputtering, na