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CN-117774519-B - Consumable chip assembly and consumable box

CN117774519BCN 117774519 BCN117774519 BCN 117774519BCN-117774519-B

Abstract

The invention discloses a consumable chip component and a consumable box, wherein the consumable chip component comprises an original chip, a plurality of first electric contact parts are arranged on the original chip, first welding areas are formed on the first electric contact parts, diversion grooves are formed in at least part of edges of the first welding areas or in the first welding areas, and projections of the first welding areas in a second direction are completely staggered. Compared with the prior art, the invention has the advantages that the diversion trench is formed on the first electric contact part of the original chip and is used for accommodating the welding tin flowing in the later stage of the original chip, when the transfer chip is welded on the first welding area of the original chip, the molten tin flows into the diversion trench or is blocked in the diversion trench, so that the molten tin cannot flow onto the adjacent first electric contact parts, and the welding short circuit phenomenon caused by too small space between a plurality of adjacent first electric contact parts in the original chip is effectively prevented.

Inventors

  • HUANG CHAOMING

Assignees

  • 极海微电子股份有限公司

Dates

Publication Date
20260512
Application Date
20240124
Priority Date
20231012

Claims (10)

  1. 1. A consumable chip assembly, comprising: the chip comprises an original chip, wherein a plurality of first electric contact parts are arranged on the original chip, the first electric contact parts are arranged at intervals along a first direction, and the projections of at least two first electric contact parts in a second direction have overlapped parts; the first electric contact parts are provided with first welding areas, the first electric contact parts are provided with diversion trenches at least at partial edges of the first welding areas, or the first welding areas are internally provided with diversion trenches, the projections of the first welding areas and the adjacent first welding areas in the second direction are completely staggered, or overlapping parts exist between the first welding areas and the projections of the adjacent first welding areas in the second direction, and the diversion trenches are at least partially arranged at the edges of at least one first electric contact part corresponding to the overlapping parts, and the second direction is perpendicular to the first direction; the switching chip, be equipped with a plurality of second electric contact portion on the first face of switching chip, a plurality of second electric contact portion and a plurality of first electric contact portion correspond the setting, the second face of switching chip is equipped with a plurality of second welding area, second electric contact portion with second welding area electricity intercommunication, second welding area welded connection in first welding area on the first electric contact portion.
  2. 2. The consumable chip assembly of claim 1, wherein the flow guide groove is disposed at an edge of the first welding region, and a head end and a tail end of the flow guide groove are connected to each other to form the first welding region.
  3. 3. The consumable chip assembly of claim 1, wherein the flow guide groove is disposed at an edge of the first soldering region, and the flow guide groove is disposed at least on a side of the plurality of first electrical contact portions where the first electrical contact portions are adjacent to each other.
  4. 4. The consumable chip assembly of claim 1, wherein a projection of the second welding region in a third direction that is perpendicular to both the first and second directions falls within or coincides with the first welding region.
  5. 5. The consumable chip assembly of claim 4, wherein the flow guide groove is disposed in the first bonding region, and a projection of the flow guide groove in the third direction falls in the second bonding region.
  6. 6. The consumable chip assembly of claim 1, wherein the shape profile of at least one of the first electrical contacts differs from the shape profile of the corresponding second electrical contact, wherein at least one of the first electrical contacts comprises a protrusion that overlaps with the projection of an adjacent at least one of the first electrical contacts in the second direction, and wherein the projections of a plurality of the second electrical contacts in the second direction are completely staggered.
  7. 7. The consumable chip assembly of claim 6, wherein a plurality of the second electrical contacts extend in the second direction, the second electrical contacts extending no more than a lowest point of the projections of the first electrical contacts in the second direction; Or alternatively, the first and second heat exchangers may be, The plurality of second electric contact parts extend along the second direction, the extending height of the second electric contact parts exceeds the lowest point of the protruding parts of the first electric contact parts in the second direction, and the protruding parts of the first electric contact parts are completely staggered in a third direction, and the third direction is perpendicular to both the first direction and the second direction.
  8. 8. The consumable chip assembly of claim 6, wherein the first electrical contact forms a solder resist area in a peripheral direction of the first solder resist area, the second surface of the interposer chip is provided with a plurality of interposer electrical contacts, the second solder resist area is formed on a plurality of interposer electrical contacts, the interposer electrical contacts form a spacer in a peripheral direction of the second solder resist area, a height of the second solder resist area in the second direction does not exceed a lowest point of the protrusion in the second direction, the spacer covers the solder resist area in a third direction, and a projection of the solder resist area in the third direction falls on the spacer, and the third direction is perpendicular to both the first direction and the second direction.
  9. 9. The consumable chip assembly of claim 1, wherein the adapter chip is a thin flexible board structure and the original chip is a rigid PCB board.
  10. 10. A consumable cartridge comprising the consumable chip assembly of any one of claims 1-9.

Description

Consumable chip assembly and consumable box Technical Field The invention relates to the technical field of printing consumables, in particular to a consumable chip assembly and a consumable box. Background In the field of printing material recovery, an original printing material container is often recovered, and an adapter chip is grafted on an original chip to achieve the purpose of repairing, so that a great number of recovered products appear in the market at present, and the recovered products are welded in a solder paste welding mode. And melting the solder paste by heating, and electrically connecting the original chip and the transfer chip by cooling and solidifying. In the prior art, most of original chips are consistent with the conventional FPC products, PI films are arranged around each welding point to cover the welding points, namely, the welding positions are lower than the surfaces of the chips, and therefore melted solder paste can be well kept at the welding positions. However, the surface of the original chip of the container product of the printing material is not covered by any PI film, the space between the electric contact part and the adjacent electric contact part is very small, and only 0.1mm of space is available, so that solder paste is not blocked, and the solder paste flows everywhere after being melted by a little uneven solder paste, a welding jig, a welding head, the original chip and the like, so that the two electric contact parts without electric connection are in welding short circuit, the yield of welding processing is greatly reduced, and the production cost is increased. Among the above-mentioned original chips, since the space between the electric contact portions is very small and only 0.1mm is available, the effect of providing the solder resist on the space is not good in general by using the chemical treatment, and some of the original chips are often recovered together with the printing material for the solder-grafted chips, and it is difficult to perform the processes of immersing, heating, and the like, and therefore, the technical scheme of providing the solder resist on the original chips in the latter stage is not optimal. Disclosure of Invention The invention aims to provide a consumable chip assembly and a consumable box, which are used for solving the technical problem of welding short circuit caused by too small space between a plurality of adjacent first electric contact parts in an original chip in the prior art. In a first aspect, the present invention provides a consumable chip assembly comprising: the chip comprises an original chip, wherein a plurality of first electric contact parts are arranged on the original chip, the first electric contact parts are arranged at intervals along a first direction, and the projections of at least two first electric contact parts in a second direction have overlapped parts; the first electric contact parts are provided with first welding areas, the first electric contact parts are provided with diversion trenches at least at partial edges of the first welding areas, or the first welding areas are internally provided with diversion trenches, the projections of the first welding areas and the adjacent first welding areas in the second direction are completely staggered, or overlapping parts exist between the first welding areas and the projections of the adjacent first welding areas in the second direction, and the diversion trenches are at least partially arranged at the edges of at least one first electric contact part corresponding to the overlapping parts, and the second direction is perpendicular to the first direction; the switching chip, be equipped with a plurality of second electric contact portion on the first face of switching chip, a plurality of second electric contact portion and a plurality of first electric contact portion correspond the setting, the second face of switching chip is equipped with a plurality of second welding area, second electric contact portion with second welding area electricity intercommunication, second welding area welded connection in first welding area on the first electric contact portion. In the consumable chip assembly described above, preferably, the diversion trench is disposed at an edge of the first welding area, and a head end and a tail end of the diversion trench are connected to each other so as to form the first welding area. In the consumable chip assembly described above, preferably, the flow guiding groove is disposed at an edge of the first welding area, and the flow guiding groove is disposed at least on one side of the plurality of first electrical contact portions, where the first electrical contact portions are close to each other. In one consumable chip assembly described above, preferably, the projection of the second welding area in a third direction falls within or coincides with the first welding area, and the third direction is perpendicular to bot