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CN-117802468-B - Continuous magnetron sputtering coating device

CN117802468BCN 117802468 BCN117802468 BCN 117802468BCN-117802468-B

Abstract

The invention relates to the field of coating, in particular to a continuous magnetron sputtering coating device. The device comprises a machine body and a coating mechanism arranged on the machine body, wherein the coating mechanism comprises a coating barrel, a substrate table, sputtering targets, baffle assemblies and a transmission assembly, the substrate table is arranged at the inner top of the coating barrel, the sputtering targets are arranged inside the coating barrel and are uniformly distributed along the circumferential direction of the coating barrel, the baffle assemblies comprise top baffles and vertical baffles, the top baffles are positioned above the sputtering targets, and the vertical baffles are arranged between two adjacent groups of top baffles. The top baffle plate corresponding to each sputtering target is divided into two sector plates, the two sector plates are opened to two sides during use, and the same surface of the sector plates is guaranteed to sputter only one target material, so that the targets on the same sputtering target are always sputtered on the same surface of the same sector plate during use, the surfaces of the sector plates sputtered among different sputtering targets are not overlapped, a coating layer is prevented from being polluted by other target materials, and the coating quality is improved.

Inventors

  • Li Gezhou

Assignees

  • 长沙韶光芯材科技有限公司

Dates

Publication Date
20260505
Application Date
20240131

Claims (10)

  1. 1. The continuous magnetron sputtering coating device is characterized by comprising a machine body and a coating mechanism arranged on the machine body, wherein the coating mechanism comprises a coating cylinder, a substrate table, a sputtering target, a baffle plate assembly and a transmission assembly; The substrate table is coaxially arranged at the inner top of the coating barrel, and the substrate is arranged on the substrate table; The sputtering targets are three groups, the three groups of sputtering targets are arranged in the coating cylinder and are uniformly distributed along the circumferential direction of the coating cylinder, the targets are arranged on the sputtering targets, and the sputtering targets are positioned below the substrate table and the upper ends of the sputtering targets are obliquely directed to the center of the coating cylinder; The baffle assembly comprises three groups of top baffles and vertical baffles, wherein the top baffles are in one-to-one correspondence with the sputtering targets, are positioned above the sputtering targets, and the vertical baffles are arranged between two adjacent groups of top baffles to separate each sputtering target; The transmission assembly is configured to control the two sector plates of any one set of top baffles to open upward to both sides until they are in engagement with adjacent sector plates.
  2. 2. The continuous magnetron sputtering coating device according to claim 1, further comprising an axle center cylinder coaxially arranged inside the coating cylinder, wherein vertical baffles are arranged on the peripheral wall of the axle center cylinder and uniformly distributed along the circumferential direction of the axle center cylinder, the top ends of the vertical baffles are provided with hinge shafts, two adjacent sector plates in two adjacent groups of top baffles are in relative rotation connection with the hinge shafts, torsion springs are arranged between the two sector plates and the hinge shafts, and the initial torsion springs enable all top baffles to be combined around a circle.
  3. 3. The continuous magnetron sputtering coating device according to claim 2, wherein a hinge is connected between two adjacent sector plates in two adjacent top baffle plates.
  4. 4. The continuous magnetron sputtering coating device according to claim 2, wherein the transmission assembly comprises a rotating shaft and a supporting piece, and the supporting piece is rotatably arranged at the top end of the vertical baffle and can push the two connected sector plates from the bottom; The rotating shaft is fixedly connected with the supporting piece, the rotating shaft penetrates through the side wall of the shaft center cylinder, the inner end of the rotating shaft extends into the shaft center cylinder, the inner end of the rotating shaft is coaxially connected with the gear, the rack is arranged in the shaft center cylinder and can rotate around the axis of the shaft center cylinder and slide up and down, and in an initial state, the rack is positioned below the gear.
  5. 5. The device of claim 4, wherein the support member comprises two arc plates and supporting rods, the two arc plates are arranged at intervals along the radial direction of the shaft center cylinder, the arc plates arch downwards, the supporting rods are arranged at two ends of the arc plates and are respectively connected with the two ends of the arc plates, the arc plates are rotatably arranged at the top ends of the vertical baffle plates, and the two supporting rods are respectively positioned below the corresponding sector plates.
  6. 6. The continuous magnetron sputtering coating device according to claim 4, wherein the mounting column capable of sliding up and down is arranged in the shaft core barrel, the rack is arranged at the top end of the mounting column and positioned at the outer edge of the mounting column, and the first driving rod is arranged in the shaft core barrel and used for driving the mounting column to move up and down along the shaft core barrel.
  7. 7. The continuous magnetron sputtering coating device according to claim 5, wherein a driving motor is further arranged in the shaft center cylinder, an output end of the driving motor is connected with the first driving rod, and the driving motor is used for driving the mounting column to rotate along the axis of the shaft center cylinder.
  8. 8. The continuous magnetron sputtering coating device according to claim 2, wherein the inner side wall of the coating barrel is provided with a positioning barrel which is obliquely arranged and gradually approaches to the axis of the coating barrel from bottom to top, the sputtering target is arranged on the positioning barrel and can slide along the axis of the positioning barrel, the inside of the coating barrel is provided with a supporting seat, the supporting seat and the coating barrel are relatively fixed, the axis barrel is slidably inserted in the supporting seat, a pressure spring is arranged between the axis barrel and the supporting seat, and in an initial state, the pressure spring has a tendency of enabling the axis barrel to move downwards.
  9. 9. The continuous magnetron sputtering coating device according to claim 1, wherein the substrate stage is movable up and down.
  10. 10. A continuous magnetron sputtering coating apparatus as in claim 1 wherein the substrate table is rotatable about its own axis.

Description

Continuous magnetron sputtering coating device Technical Field The invention relates to the field of coating, in particular to a continuous magnetron sputtering coating device. Background In modern industrial coating, magnetron sputtering is a common physical vapor deposition method, and is widely adopted because of the advantages of simple equipment, easy control, large coating area, strong adhesive force and the like. The magnetron sputtering coating equipment comprises a vacuum chamber, a vacuum system, a cathode target, a sputtering power supply, an air inlet system, a baffle plate and the like. When coating film, the vacuum system is used to pump out the gas in the vacuum chamber to make the pressure in the vacuum chamber reach the preset vacuum requirement, then the air inlet system is used to charge argon into the vacuum chamber, then the sputtering power supply is used to add high pressure to the argon in the vacuum chamber to generate glow discharge between the cathode and the anode, the argon molecules between the cathode and the anode are ionized to generate charged charges, the positive ions are accelerated under the influence of the negative potential of the cathode to move to strike the cathode target, so that the particles such as atoms in the positive ions are sputtered, and the sputtered atoms are deposited on the substrate positioned on the anode to form a film. With the continuous improvement of the performance of the thin film device, the line width is smaller and smaller, and the requirement on the magnetron sputtering film layer is higher and higher. The multi-cavity cluster type magnetic control coating equipment can avoid cross contamination among targets, but has high cost, most domestic scientific research institutions and enterprises are difficult to bear, and a method of replacing the multi-cavity cluster type magnetic control coating equipment with coating equipment integrating a plurality of magnetic control sputtering targets in one process chamber is continuously adopted. According to the method, a plurality of sputtering targets are positioned in the same process chamber, although each sputtering target is provided with an independent baffle plate, the protection of the sputtering targets can be realized to a certain extent, because each sputtering target is positioned at the same height, gaps are inevitably formed between the baffle plates and the sputtering targets, when other sputtering targets perform sputtering processes, irregular movement of target particles can be deposited on the surfaces of the targets through the gaps between the baffle plates and the sputtering targets, cross contamination is caused to the targets of the sputtering targets, and finally, the quality of a film layer is influenced, particularly when multi-target confocal sputtering is performed, each sputtering target deflects to the same center by a certain angle, and cross contamination is easier between the targets. The application publication number CN 106435499A discloses a magnetron sputtering coating machine, wherein a baffle plate component is arranged between two adjacent sputtering targets, so that the pollution of the sputtering targets from the side surfaces can be reduced, a rotary baffle plate component is arranged between the sputtering targets and a substrate table, a notch is formed on the rotary baffle plate component for a single sputtering target to carry out the sputtering process, the other sputtering targets are shielded, the pollution of the sputtering targets from the upper part can be reduced, the sputtering targets can be effectively protected under the cooperation of the baffle plate component and the rotary baffle plate component, the cross pollution between the targets is reduced, and the quality of a deposited film is improved. However, in the practical use process, the upper surface of the rotating baffle plate also can sputter a layer of target material, and due to the use of a plurality of target materials, the upper surface of the rotating baffle plate contains all target materials, the components and the structure are more complex, and after long-time accumulation, the target material layer on the baffle plate can also influence the coating quality in the subsequent use. The information disclosed in the background section of the application is only for enhancement of understanding of the general background of the application and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art. Disclosure of Invention According to the defects of the prior art, the invention provides a continuous magnetron sputtering coating device, which aims to solve the problem that the quality of the deposited film of the existing coating equipment integrating a plurality of magnetron sputtering targets is difficult to ensure. The invention relates to a continuous magnetron sputtering coati