CN-117817487-B - Automatic ultra-fine grinding equipment for silicon wafers

CN117817487BCN 117817487 BCN117817487 BCN 117817487BCN-117817487-B

Abstract

The invention relates to the technical field of silicon wafer processing, in particular to automatic silicon wafer ultra-precise grinding equipment, which designs a plurality of silicon wafer fixing devices on a workbench, the space displacement device is used for driving the fine grinding device to be matched with each silicon wafer fixing device, so that the processing effect can be greatly improved. The position of the silicon wafer on the clamping tool relative to the fine grinding device is adjusted by utilizing the plane adjusting mechanism on each silicon wafer fixing device, the levelness of a surface to be ground, which is formed by edges of a plurality of stacked silicon wafers on the clamping tool, relative to the grinding plane of the fine grinding device is adjusted by utilizing the levelness adjusting mechanism, the smoothness of the edges of the silicon wafers is ensured, the situation that the silicon wafers are different in size in the same batch of silicon wafer processing is avoided, and the grinding direction of the length direction of the plurality of silicon wafers on the clamping tool relative to the fine grinding device is adjusted by utilizing the angle adjusting mechanism, so that the grinding quality is ensured.

Inventors

ZHOU YU
FU MINGQUAN
GUO XIANG

Assignees

广东金湾高景太阳能科技有限公司
四川高景太阳能科技有限公司

Dates

Publication Date: 20260505
Application Date: 20231221

Claims (8)

1. An automatic ultra-fine grinding device for silicon wafers, which is characterized by comprising: A frame on which a workbench is provided; The silicon wafer fixing device comprises a workbench, a plurality of silicon wafer fixing devices, a horizontal adjusting mechanism, an angle adjusting mechanism and a clamping tool, wherein the silicon wafer fixing devices are all arranged on the workbench, each silicon wafer fixing device comprises a plane adjusting mechanism and the horizontal adjusting mechanism, the bottom of the plane adjusting mechanism is slidably arranged on the workbench, and the plane adjusting mechanism can be locked with the workbench relatively; A spatial displacement device mounted on the frame; The fine grinding device is arranged on the adjusting end of the space displacement device and can grind all the silicon wafers on the clamping tool; the horizontal adjusting mechanism comprises a fixed shell and four lifting screws, wherein the four lifting screws can be respectively and rotatably arranged on four corners of the fixed shell, the angle adjusting mechanism is arranged at the top of the fixed shell, the lower ends of the four lifting screws are respectively abutted with the top of the plane adjusting mechanism, a plurality of sliding guide posts are arranged on the top of the plane adjusting mechanism, a plurality of sliding holes matched with the sliding guide posts are formed in the fixed shell, the fixed shell can slide on the sliding guide posts but cannot slide out from the top of the sliding guide posts, two groups of adjusting pieces are arranged on the fixed shell, and each group of adjusting pieces can be matched with two lifting screws and can respectively and independently adjust the extending amount of the lower end of any lifting screw; Each adjusting piece comprises an operation shaft and two worm gears movably sleeved on the operation shaft, two ends of the operation shaft can be rotatably arranged on two opposite inner side walls of the fixed shell, one end of the operation shaft movably penetrates through the fixed shell, the operation shaft can slide on the fixed shell along the axial direction of the operation shaft, one end of the operation shaft, which is positioned outside the fixed shell, forms an operation end, the two worm gears are respectively and independently meshed with the two lifting screws on the same side, two groups of friction plates are arranged on the region, which is positioned between the two worm gears, of the operation shaft, and when the operation shaft slides along any one end direction of the axes of the two worm gears, each group of friction plates can only be abutted with the side face on the worm gear on the corresponding end.
2. The automatic ultra-fine grinding equipment for silicon wafers according to claim 1, wherein a plurality of friction bars are arranged on one side of the friction plate, which is close to the worm wheel, in an outward protruding mode, and a plurality of grooves matched with the friction bars are arranged on one side of the worm wheel, which is close to the friction plate.
3. The automatic ultra-fine grinding device for silicon wafers according to claim 1, wherein both ends of the operating shaft are respectively sleeved with a fixing sleeve, one ends of the two fixing sleeves, which are opposite, are respectively rotatably installed on the inner side wall of the fixing shell, the two worm gears are respectively coaxially installed on the fixing sleeves, the two worm gears can rotate along with the corresponding fixing sleeves, and one ends of the two fixing sleeves, which are opposite, do not extend out of the corresponding side face of the opposite side of the worm gear.
4. The automatic ultra-fine grinding equipment for silicon wafers is characterized in that the angle adjusting mechanism comprises a base and a shaft column arranged on the base, the base is arranged on the top of the fixed shell, a mounting annular groove is formed in the periphery of the shaft column, a mounting spacer bush is arranged in the mounting annular groove, a bearing is sleeved on the mounting spacer bush, a rotating ring is sleeved on the outer ring of the bearing, a mounting seat is arranged on the rotating ring, the clamping tool can be detachably arranged on the mounting seat, a pushing arm is arranged on the outer wall of the rotating ring in an outward extending mode, a mounting block is arranged on the base in an outward extending mode, a limiting groove is formed in the mounting block, one end of the pushing arm, which is outwards, is arranged in the limiting groove, fine adjustment rods are arranged on two sides of the limiting groove in a penetrating mode, and one end, which is opposite to each fine adjustment rod, can be abutted to the side wall of the outer end of the pushing arm.
5. The automatic ultra-fine grinding equipment for the silicon wafer is characterized in that the plane adjusting mechanism comprises a sliding seat, a longitudinal sliding seat and a transverse sliding seat, the longitudinal sliding seat is arranged on the sliding seat in a sliding mode, the transverse sliding seat is arranged on the sliding rail of the workbench in a sliding mode, a locking knob is arranged on the sliding seat and can relatively lock the sliding seat and the sliding rail, the levelness adjusting mechanism is arranged on the transverse sliding seat, a first fixed block is arranged on one side of the longitudinal sliding seat, a first ejector block is arranged on the sliding seat, a first rotary rod is arranged on the first ejector block in a penetrating mode, one end of the first rotary rod is connected with the first fixed block in a rotating mode, a second ejector block is arranged on the longitudinal sliding seat in a sliding mode, a second fixed block is arranged on the second ejector block in a penetrating mode, and one end of the second rotary rod is connected with the second fixed block in a rotating mode.
6. The automatic ultra-fine grinding equipment for silicon wafers according to claim 1, wherein the spatial displacement device comprises a sliding rail installed on a frame, a sliding seat slidably installed on the sliding rail and a lifting rail installed on the sliding seat, a sliding motor is arranged on the frame, an output end of the sliding motor is rotationally connected with a screw nut on the sliding seat through a horizontal screw rod, a lifting seat is slidably installed on the lifting rail, the fine grinding device is installed on the lifting seat, a vertical screw rod is arranged on the sliding seat and connected with the lifting seat through the screw nut, and a lifting motor connected with one end of the vertical screw rod is arranged on the sliding seat.
7. The automatic ultra-fine grinding apparatus for silicon wafers according to claim 6, wherein the fine grinding means comprises a driving motor and a grinding wheel, the driving motor is mounted on the lifting base, a mounting plate is provided on the lifting base, a rotation shaft is rotatably mounted on the mounting plate, the grinding wheel is detachably mounted on one end of the rotation shaft, and the other end of the rotation shaft is engaged with an output end of the driving motor through a gear.
8. The automatic ultra-fine grinding device for silicon wafers according to claim 1, wherein the workbench is provided with an upper and lower feeding mechanical arm.

Description

Automatic ultra-fine grinding equipment for silicon wafers Technical Field The invention relates to the technical field of silicon wafer processing, in particular to automatic ultra-fine grinding equipment for silicon wafers. Background The silicon wafer can be subjected to a plurality of defective products due to collision and the like in the production process, particularly, the side surface of the silicon wafer is broken, hidden cracks and the like, and the thickness of the silicon wafer is very thin, generally only 100-170 microns, and most of the current industry is repaired by manual polishing, but the mode extremely depends on the operation proficiency of operators, the manual polishing speed is low, the polishing quality cannot be controlled, and even the defective products are damaged to waste products. In some similar fields, for example, patent publication No. CN111482865A discloses a wafer polishing apparatus, in which a first shaft body of a vacuum chuck shaft mechanism carries and drives a wafer to rotate, a pressing member of a pressing mechanism abuts against the wafer to press the wafer against the first shaft body, a positioning member of a positioning mechanism can perform secondary positioning on the wafer before the pressing mechanism performs pressing operation, a polishing machine of the polishing mechanism can move along an axial direction and a radial direction of the first shaft body, the wafer is driven to rotate by the first shaft body, and the polishing machine moves along the radial direction of the first shaft body to contact with an edge of the wafer, so that edge polishing of a round silicon wafer is realized. In the square wafer processing, patent publication CN116394102a discloses a silicon wafer edge grinder, which makes the equipment compatible with the edge grinding of round silicon wafers and square silicon wafers by optimizing the driving module of the grinding device. However, in this patent, the vacuum chuck shaft mechanism is fixed in position relative to the frame, and the vacuum chuck shaft mechanism can only adsorb a single wafer, so that the processing efficiency is low, and the polishing work of a plurality of wafers cannot be realized. Therefore, a common processing factory can replace a grinding clamp in a vacuum chuck shaft mechanism, such as a monocrystalline silicon wafer grinding clamp disclosed in patent publication No. CN218137314U, and the clamp can clamp a plurality of square wafers at the same time, which is beneficial to the fact that the clamps are generally fixedly installed relative to a frame and cannot be spatially adjusted, especially the adjustment between the grinding side edges of the square wafers and the processing plane of a grinding wheel is required, and the installation precision requirement on the grinding clamp and the precision requirement for clamping the wafers are higher. Therefore, after the clamps clamp a plurality of square wafers, the polishing surfaces formed by the needed processing edges of the square wafers together may have a slight inclination or inclination relative to the processing plane of the grinding wheel, if the grinding wheel directly polishes the clamped wafers, certain height difference of the polished wafers of the same batch relative to the processing plane of the grinding wheel may be caused, namely, the dimension specifications of the wafers are not uniform, and the processing quality of the wafers in the later stage is directly affected. Meanwhile, in the processing process, the polishing direction of the grinding wheel and the edge length direction of the wafer are generally parallel, so that the stress direction of the wafer can be effectively standardized, the situation that the wafer is laterally stressed to damage peripheral silicon wafers of a plurality of commonly clamped silicon wafer stacks is avoided, and the quality of the wafer is ensured. Disclosure of Invention In order to overcome one of the defects in the prior art, the invention aims to provide the automatic ultra-fine grinding equipment for the silicon wafers, which can accurately adjust the grinding angle and the grinding levelness of the silicon wafers and ensure the grinding quality. In order to solve the problems, the technical scheme adopted by the invention is as follows: An automatic ultra-fine grinding device for silicon wafers comprises A frame on which a workbench is provided; The silicon wafer fixing device comprises a workbench, a plurality of silicon wafer fixing devices, a horizontal adjusting mechanism, an angle adjusting mechanism and a clamping tool, wherein the silicon wafer fixing devices are all arranged on the workbench, each silicon wafer fixing device comprises a plane adjusting mechanism and the horizontal adjusting mechanism, the bottom of the plane adjusting mechanism is slidably arranged on the workbench, and the plane adjusting mechanism can be locked with the workbench relatively; A spatial displacement de