Search

CN-117881537-B - Glasses frame comprising at least a portion of an electronic device encapsulated in at least one element thereof and method of encapsulating at least a portion of an electronic device in at least one element of a glasses frame

CN117881537BCN 117881537 BCN117881537 BCN 117881537BCN-117881537-B

Abstract

A spectacle frame (10) comprising at least a portion of an electronic device (20) enclosed inside at least one element (11) of said spectacle frame (10), wherein said at least one element (11) of said spectacle frame (10) consists of a plasticized cellulose acetate mixture, wherein said composition of said mixture is such that at least a portion (12) of said at least one element (11) in which at least a portion of said electronic device (20) is enclosed comprises at least a negligible mass percentage of at least one solvent. (FIG. 1).

Inventors

  • F. Borsoi
  • G. Vandera
  • D. Wenqiu Li
  • D. Michelin

Assignees

  • 陆逊梯卡有限公司

Dates

Publication Date
20260505
Application Date
20220830
Priority Date
20210902

Claims (10)

  1. 1. A method of packaging at least a portion of an electronic device (20) within at least one element (11) of a spectacles frame (10), Wherein said at least one element (11) of said frame (10) consists of a mixture of plasticized cellulose acetates suitable for being converted from a first composition to a second composition, Wherein said first composition of said plasticized cellulose acetate mixture comprises from 5 to 25% by weight of at least one solvent dissolved in the mixture, Wherein the softening point of the first composition is below 90 ℃ and below the softening point of the plasticized cellulose acetate, Wherein the second composition of the mixture is such that at least a portion (12) of the at least one element (11) comprising the at least a portion of the electronic device (20) therein comprises less than 2wt% of the at least one solvent, Wherein the method comprises: In a first step, said at least one element (11) of the frame (10) comprises two separate sheets (111, 112) consisting of said first composition of said mixture, A second step of inserting said at least one portion of said electronic device (20) between two separate sheets (111, 112), A third step of heating to the softening point of said first composition present in said at least one portion (12) of said at least one element (11) and applying a contact pressure between two separate sheets (111, 112) of between 1.5 and 5 bar, A fourth step of waiting for a time sufficient for two separate and partially softened sheets (111, 112) to encapsulate said at least a portion of said electronic device (20) therebetween, A fifth step of converting the composition of the mixture of said at least one part (12) of said at least one element (11) from a first composition to a second composition by performing sintering between two sheets (111, 112), evaporating said at least one solvent and encapsulating said at least one part of said electronic device (20) within said at least one part (12) of said at least one element (11).
  2. 2. The process according to claim 1, characterized in that the percentage of the at least one solvent in the first composition of the acetate mixture is 10-15wt%.
  3. 3. The process according to claim 1 or 2, characterized in that the at least one solvent comprises at least one of acetone, ethanol, ethyl acetate, ethyl lactate.
  4. 4. The method according to claim 1 or 2, characterized in that the softening point of the first composition is 30-50 ℃.
  5. 5. A method according to claim 1 or 2, characterized in that the third step of the method comprises compressing the two sheets (111, 112) to a pressure of 1.5-3 bar.
  6. 6. A method according to claim 1 or 2, characterized in that said fifth step comprises drying said at least one portion (12) of said at least one element (11) at a low temperature, i.e. a temperature lower than the softening temperature of the first composition of the mixture.
  7. 7. A method according to claim 6, characterized in that the method comprises a post-production step, wherein said at least one portion (12) of said at least one element (11) having the shape of a sheet is flattened during the drying of the fifth step, after said sheet has been deformed by the third and fourth steps of the method.
  8. 8. Method according to claim 7, characterized in that in said post-production step, said at least one portion (12) of said at least one component (11) is processed around the packaged electronic device (20) after drying to complete the component (11) of the frame (10).
  9. 9. Method according to claim 1 or 2, characterized in that said at least one element (11) of the spectacle frame (10) comprises a nose bridge, a nose bridge and a temple of the spectacle frame (10).
  10. 10. Method according to claim 1 or 2, characterized in that the electronic device (20) is covered with a protective material polyurethane before the second step of the method.

Description

Glasses frame comprising at least a portion of an electronic device encapsulated in at least one element thereof and method of encapsulating at least a portion of an electronic device in at least one element of a glasses frame Technical Field The present invention relates to an eyeglass frame comprising at least a portion of an electronic device encapsulated within at least one element thereof, and a method for encapsulating at least a portion of an electronic device within at least one element of an eyeglass frame. Background In the prior art, it is known that at least a part of the frame comprises eyeglasses of an electronic device. A known method of fitting an electronic device into a portion of a spectacle frame comprises first starting from two sheets of rigid cellulose acetate constituting the spectacle frame portion, wherein said sheets consist only of polymer, plasticizer and any additives. At least one of the two plastic surfaces of the two sheets is made hollow by removing material, forming a cavity capable of accommodating at least some electronic components of the electronic device. The electronic component is deposited into the cavity volume thus formed, and then the two sheets are joined together. The two-part cellulose acetate linkage may be carried out using different methods. As explained in US10088695B2, one such method involves applying a solvent, applying it to the surface of at least one of the two parts of the sheet to be joined, then applying pressure in a direction perpendicular to the plane of adhesion, and applying a temperature suitable for solvent evaporation and acetate sintering, thereby bonding the two sheets together. Other methods couple two sheets together by applying a sufficiently high temperature and pressure to bring the plastic material on the surfaces of the two sheets above the melting point. This allows the cellulose acetate to cure into a single block as the coupling end temperature is reduced. Disadvantageously, the packaged electronic device must withstand pressure and temperature stresses, but some components of the electronic device sometimes cannot withstand temperatures in excess of 100 ℃. Another suitable method is to pressurize the two-part material and apply radio frequency (e.g. microwave) to heat the plastic material. The latter method can more precisely heat only the surface layer region of the two-part sheet to be joined to the melting point. Disadvantageously, the encapsulation process of the electronic device leaves traces of delamination and poor aesthetics, which may lead to cracking and breakage of the eyeglass frame. Disclosure of Invention The object of the present invention is to obtain a spectacle frame in which at least a part of the electronic equipment is encapsulated in at least one element of the spectacle frame, a better encapsulation without leaving any marks, and in which the spectacle frame is more durable, more flexible and less prone to delamination. The invention also relates to a method for packaging at least a part of an electronic device in at least one element of an eyeglass frame, which overcomes the drawbacks of the prior art. This object is achieved according to the invention by the spectacle frame according to independent claim 1 and by the method according to independent claim 13. Further features are provided in the dependent claims. Drawings The features and advantages of the invention will be more apparent from the following description, which is to be understood as illustrative and not restrictive, with reference to the accompanying schematic drawings, in which: FIG. 1 is a side view of a portion of the components of the eyeglass frame of the present invention enclosing a portion of the electronic device of the present invention therein; FIG. 2 is a schematic illustration of one step of inserting the portion of the electronic device between two sheets that, once sintered, will form a portion of the eyeglass frame element within which the portion of the electronic device is contained; FIG. 3 is a schematic view of a rigid electronic card that is part of an electronic device (track, recess, interlock) mounted with a mechanically coupled metal core; FIG. 4 shows another Flexible Printed Circuit (FPC) bonded to a metal core; Fig. 5 shows an electronic card with a metal core. Detailed Description With reference to the above figures, a spectacle frame 10 is presented comprising at least a portion of an electronic device 20 encapsulated within an element 11 of the spectacle frame 10, formed by a method of encapsulating at least a portion of said electronic device 20 within at least an element 11 of the spectacle frame 10. For example, the element 11 refers to the nose pad, bridge or temple of the eyeglass frame 10. In the figure, the electronic device 20 comprises a portion enclosed within at least a portion 12 of the element 11 of the frame 10 and a portion 21 protruding at least partially outside. For example, the portion 2