CN-117900916-B - Wafer edge multi-pole magnetic field controllable magnetic shear thickening polishing device and method

CN117900916BCN 117900916 BCN117900916 BCN 117900916BCN-117900916-B

Abstract

The invention relates to the field of precision and ultra-precision machining, and particularly discloses a wafer edge multi-magnetic-pole magnetic field controllable magnetic shear thickening polishing device and method aiming at defects such as sharp corners, cracks, scratches, burrs and the like after chamfering of the edge of an existing wafer. The wafer edge multi-magnetic-pole magnetic-field controllable magnetic shear thickening polishing device can form various controllable coupling magnetic fields in a polishing area by changing the arrangement mode of three groups of magnetic poles, and can realize wafer edge polishing with different size and angle requirements by combining high-performance magnetic shear thickening polishing media.

Inventors

TIAN YEBING
YUAN XIANGYU
QIAN CHENG
WU GUANGYI

Assignees

山东理工大学

Dates

Publication Date: 20260508
Application Date: 20240318

Claims (4)

1. The wafer edge multi-pole magnetic field controllable magnetic shear thickening polishing device is characterized by comprising a machine tool (1-1), a vacuum chuck (1-2), a magnetic field generating device (1-3) and a medium circulating device (1-4), wherein the magnetic field generating device (1-3) comprises a lower magnetic pole wheel motor (2-1), a long transmission shaft (2-2), a hollow gear shaft (2-3), a left magnetic pole wheel magnetic pole (2-4), a lower magnetic pole wheel magnetic pole (2-5), a right magnetic pole wheel magnetic pole (2-6), a short transmission shaft (2-7), a right magnetic pole wheel motor (2-8), a right magnetic pole wheel (2-9), a lower magnetic pole wheel (2-10), a left magnetic pole wheel (2-11), a left magnetic pole wheel motor (2-12) and a shell (2-13), the lower magnetic pole wheel motor (2-1) is connected with the lower magnetic pole wheel (2-10) through spline fit, the left magnetic pole wheel (2-4) is arranged in a groove inside the left magnetic pole wheel (2-11), the right magnetic pole wheel motor is connected with the right magnetic pole wheel (2-11) through spline fit by the spline fit, the right magnetic pole wheel magnetic pole (2-6) is arranged in a groove in the right magnetic pole wheel (2-9), the left magnetic pole wheel motor (2-12) is meshed with the gear teeth of the hollow gear shaft (2-3) through a gear, the hollow gear shaft (2-3) is connected with the left magnetic pole wheel (2-10), the hollow gear shaft (2-3) is fixed on the long rotating shaft (2-2) through a mode of internally nesting sliding bearings, the lower magnetic pole wheel magnetic pole (2-5) is arranged in the groove in the lower magnetic pole wheel (2-10), the medium circulation device (1-4) is fixed in a hollow position below the lower magnetic pole wheel (2-10), the magnetic field generating device (1-3) and the medium circulation device (1-4) are supported through the shell (2-13), the shell (2-13) is fixedly connected to a moving platform of the machine tool (1-1), and the wafer (1-5) is clamped on a main shaft of the machine tool (1-1) through the vacuum chuck (1-2).
2. The wafer edge multi-pole magnetic field controllable magnetic shear thickening polishing device of claim 1, wherein: the magnetic field coupling effect in the polishing area is changed by changing the arrangement mode of the magnetic poles in the right magnetic pole wheel (2-9), the lower magnetic pole wheel (2-10) and the left magnetic pole wheel (2-11) in the magnetic field generating device (1-3), respectively regulating and controlling the rotation angles of the left magnetic pole wheel (2-11), the right magnetic pole wheel (2-9) and the lower magnetic pole wheel (2-10), further regulating and controlling the distribution of magnetic force lines and the magnetic field intensity in the polishing area, wherein the magnetizing directions of the magnetic poles of the left magnetic pole wheel (2-4) and the magnetic poles of the right magnetic pole wheel (2-6) are all axial, the magnetizing direction of the magnetic poles of the lower magnetic pole wheel (2-5) is radial, the magnetic poles of the left magnetic pole wheel (2-11) are alternately arranged with the N poles and the S poles, the magnetic poles of the right magnetic pole wheel (2-9) are alternately arranged with the S poles and the N poles, the magnetic poles of the lower magnetic pole wheel (2-10) are alternately arranged with the S poles and the N poles, the magnetic poles of the left magnetic pole wheel (2-4) are alternately arranged with the S poles and the N poles, the magnetic poles of the left magnetic pole wheel (2-10) are alternately arranged with the S poles and the N poles alternately arranged, the N poles of the left magnetic pole wheel magnetic pole (2-4) and the right magnetic pole wheel magnetic pole (2-6) face the polishing area, the S poles of the lower magnetic pole wheel magnetic pole (2-5) face the polishing area, magnetic lines of force which attract each other are generated in the polishing area to form a strong magnetic field area, or the rotation angles of the left magnetic pole wheel (2-11), the right magnetic pole wheel (2-9) and the lower magnetic pole wheel (2-10) are regulated, the N poles of the left magnetic pole wheel magnetic pole (2-4), the right magnetic pole wheel magnetic pole (2-6) and the lower magnetic pole wheel magnetic pole (2-5) face the polishing area, mutually exclusive magnetic lines of force are generated in the polishing area to form a weak magnetic field area, or the continuous rotation of the left magnetic pole wheel (2-11), the right magnetic pole wheel (2-9) and the lower magnetic pole wheel (2-10) is regulated, the N poles and the S poles of the left magnetic pole wheel magnetic pole (2-4), the right magnetic pole wheel magnetic pole (2-6) and the lower magnetic pole wheel magnetic pole (2-5) alternately face the polishing area, and alternating magnetic lines of force are generated in the polishing area.
3. The wafer edge multi-pole magnetic field controllable magnetic shear thickening polishing device according to claim 1, wherein gaps among the right pole wheel (2-9), the lower pole wheel (2-10) and the left pole wheel (2-11) can be adjusted according to the size of a polished wafer, the polishing magnetic field intensity and the distribution requirement of magnetic force lines.
4. The method for polishing a wafer edge multi-pole magnetic field controllable magnetic shear thickening polishing apparatus of claim 1, comprising the steps of: (1) Clamping wafers (1-5) to be processed with different sizes on a main shaft of a machine tool (1-1) through a vacuum chuck (1-2); (2) Determining the configuration modes of magnetic poles in the right magnetic pole wheel (2-9), the lower magnetic pole wheel (2-10) and the left magnetic pole wheel (2-11), and loading corresponding magnetic poles; (3) Starting a machine tool (1-1), moving the wafer (1-5) to a polishing area, adjusting the position of the edge of the wafer (1-5), and selecting a proper rotating speed according to the polishing technical index of the wafer (1-5); (4) Regulating and controlling the rotation angles of the left magnetic pole wheel (2-11), the right magnetic pole wheel (2-9) and the lower magnetic pole wheel (2-10) to enable the polishing area to generate weak magnetic field intensity, and conveying polishing media to the polishing area through the medium circulation device (1-4); (5) Regulating and controlling the rotation angles of the left magnetic pole wheel (2-11), the right magnetic pole wheel (2-9) and the lower magnetic pole wheel (2-10) to enable a polishing area to generate a required polishing magnetic field requirement for polishing; (6) Regulating and controlling the rotation angles of the left magnetic pole wheel (2-11), the right magnetic pole wheel (2-9) and the lower magnetic pole wheel (2-10) to enable the polishing area to generate weak magnetic field intensity, and opening the medium circulation device (1-4) to perform circulation replacement of polishing medium; (7) And (5) repeating the steps (5) and (6) to realize high-efficiency and high-quality polishing of the edges of the wafers (1-5).

Description

Wafer edge multi-pole magnetic field controllable magnetic shear thickening polishing device and method Technical Field The invention relates to precise and ultra-precise processing technology, and particularly provides a multi-magnetic-pole magnetic field controllable magnetic shear thickening polishing device and method for wafer edges. Background The chamfering polishing of the wafer edge is one of the key process steps in the semiconductor manufacturing, aims to optimize the smoothness and quality of the wafer edge, ensures the consistency and reliability in the device manufacturing process, improves the appearance quality of the wafer, and more importantly, improves the manufacturing efficiency and reliability of the device, and lays a solid foundation for the final chip product. However, during wafer edge chamfer polishing, problems typically occur in that edge damage, non-uniformity of chamfer, residual contaminants, etc. may affect the quality of the wafer and the final device performance. Therefore, new methods for chamfering the wafer edge are needed. At present, the wafer edge chamfering polishing method mainly comprises mechanical polishing, chemical mechanical polishing, magnetic field auxiliary polishing and the like. During mechanical polishing, stress concentration is easy to occur between the polishing pad and the edge of the wafer, and the temperature in a local polishing area rises, so that the surface of the edge of the wafer is thermally damaged. When polishing is performed by chemical mechanical polishing, chemical waste liquid exists at the edge of the wafer, and the chemical waste liquid needs to be further cleaned and pollutes the environment, which is contrary to the gist of green manufacturing. Compared with mechanical polishing and chemical mechanical polishing, the magnetic shear thickening polishing has the advantages of strong controllability of a magnetic shear thickening polishing medium, strong adaptability of a processing object, superior quality of a processing surface/subsurface, stable material removal function and the like, and can realize high-efficiency and high-quality polishing of wafer edge chamfer. The design of the magnetic shear thickening polishing device for the wafer edge provides an efficient and high-quality wafer edge chamfering polishing method which has important theoretical significance and practical application value. Disclosure of Invention The invention provides a wafer edge multi-magnetic-pole magnetic field controllable magnetic shear thickening polishing device and a wafer edge multi-magnetic-pole magnetic field controllable magnetic field generating device, wherein the magnetic field generating device is designed according to the polishing technical index of a wafer, and the magnetic force line distribution and the magnetic field intensity in a polishing area are further adjusted by adjusting and controlling the rotation angles of three groups of magnetic fields in the magnetic field generating device, so that the magnetic field coupling effect is changed, and the ultra-precise polishing of the wafer edges with different sizes is realized by combining high-performance magnetic shear thickening polishing media. The invention provides a wafer edge magnetic shear thickening polishing device with multiple magnetic pole magnetic fields, which comprises a machine tool, a vacuum chuck, a magnetic field generating device and a medium circulating device. The device comprises a machine tool, a vacuum chuck, a magnetic field generating device and a medium circulating device, wherein the magnetic field generating device comprises a lower magnetic pole wheel motor, a long transmission shaft, a hollow gear shaft, a left magnetic pole wheel magnetic pole, a lower magnetic pole wheel magnetic pole, a right magnetic pole wheel magnetic pole, a short transmission shaft, a right magnetic pole wheel motor, a right magnetic pole wheel, a lower magnetic pole wheel, a left magnetic pole wheel motor and a shell, the lower magnetic pole wheel motor is connected with the lower magnetic pole wheel through spline key groove matching by the long transmission shaft, the left magnetic pole wheel magnetic pole is arranged in a groove in the left magnetic pole wheel, the right magnetic pole wheel motor is connected with the right magnetic pole wheel through spline key groove matching by the short transmission shaft, the left magnetic pole wheel motor is meshed with gear teeth of a hollow gear shaft, the hollow gear shaft is connected with the left magnetic pole wheel, the hollow gear shaft is fixed on the long transmission shaft through an internal nested sliding bearing mode, the lower magnetic pole wheel magnetic pole is arranged in the groove in the lower magnetic pole wheel, the medium circulating device is fixed at a hollow position below the lower magnetic pole wheel, the left magnetic pole wheel is connected with the shell through spline key groove matching, and the medi