CN-117912367-B - Supporting mechanism and display module

Abstract

The application discloses a supporting mechanism and a display module, wherein the supporting mechanism comprises a bending area and a non-bending area at least positioned at one side of the bending area, the supporting mechanism comprises a supporting plate, a conductive layer and conductive particles, the supporting plate is positioned at the bending area and the non-bending area and comprises a first surface and a second surface which are oppositely arranged, the conductive layer is positioned at one side of the first surface of the supporting plate and positioned at the non-bending area, at least one opening is arranged on the first surface of the supporting plate, at least part of the at least one opening is positioned at the bending area, the conductive particles are filled in the opening, and the conductive particles are electrically connected with the conductive layer. Through the mode, the application can lighten the electrostatic interference, thereby improving the display effect of the display module.

Inventors

• LI JIAOYANG
• YUAN BO

Assignees

• 昆山国显光电有限公司

Dates

Publication Date

20260508

Application Date

20240105

Claims (20)

1. 1. A support mechanism comprising a inflection region and a non-inflection region located at least to one side of the inflection region, the support mechanism comprising: the support plate is positioned in the bending area and the non-bending area and comprises a first surface and a second surface which are arranged in opposite directions; the conductive layer is positioned on one side of the first surface of the supporting plate and is positioned in the non-bending area; The first surface of the supporting plate is provided with at least one opening, at least part of the at least one opening is located in the bending area, conductive particles are filled in the opening, the conductive particles are electrically connected with the conductive layer, part of the at least one opening is located in the non-bending area, orthographic projection of the conductive layer on the supporting plate is overlapped with the opening located in the non-bending area, the opening located in the non-bending area is communicated with the opening located in the bending area through a groove, the conductive particles are filled in the groove, and the conductive particles in the groove are electrically connected with the conductive particles in the opening.
2. 2. The support mechanism of claim 1, wherein an orthographic projection of the conductive layer on the support plate covers the opening at the non-inflection region.
3. 3. The support mechanism of claim 2, wherein the depth of the recess is less than the depth of the aperture.
4. 4. A support mechanism according to claim 3, wherein the grooves have a depth in the range 100 nm to 1 micron.
5. 5. The support mechanism of claim 1, wherein the support mechanism further comprises: The antistatic layer is arranged on one side of the first surface of the supporting plate and at least positioned in the bending area, the supporting plate is connected with the conductive layer, and the conductive particles in the openings are electrically connected with the conductive layer through the antistatic layer.
6. 6. The support mechanism of claim 5, wherein the material of the antistatic layer comprises conductive nanoparticles.
7. 7. The support mechanism of claim 6, wherein the conductive nanoparticles comprise at least one of metal nanoparticles and carbon nanotubes.
8. 8. The support mechanism of claim 5, wherein the support mechanism comprises a support member, The antistatic layer extends from the first surface of the supporting plate to the surface of the conductive layer, which is away from the supporting plate, through the side surface of the conductive layer.
9. 9. The support mechanism of claim 8, wherein an orthographic projection of the antistatic layer on the support plate covers an orthographic projection of the conductive layer on the support plate.
10. 10. The support mechanism of claim 8, wherein an orthographic projection of the antistatic layer on the support plate covers the support plate.
11. 11. The support mechanism of claim 1, wherein the at least one aperture is evenly distributed across the support plate.
12. 12. The support mechanism of claim 11, wherein the at least one aperture is arranged in an array.
13. 13. The support mechanism of claim 11, wherein the openings are blind holes or the openings are through holes extending through the support plate.
14. 14. The support mechanism of claim 11, wherein the aperture is a circular aperture.
15. 15. The support mechanism of claim 11 wherein the apertures have a radius in the range of 1 to 10 microns.
16. 16. The support mechanism of claim 1, wherein the conductive particles comprise at least one of metal, carbon nanotubes.
17. 17. The support mechanism of claim 1, wherein the support plate is in contact with the conductive layer.
18. 18. The support mechanism of claim 17, wherein the material of the support plate comprises carbon fiber.
19. 19. The support mechanism of claim 17, wherein the conductive layer comprises copper foil.
20. 20. The support mechanism of claim 17, wherein the non-inflection regions are located on either side of the inflection region.

Description

Supporting mechanism and display module Technical Field The application relates to the technical field of display, in particular to a supporting mechanism and a display module. Background At present, the display panel cannot avoid the damage caused by an electrostatic field (STATIC ELECTRIC FIELD) and an electrostatic current (ESD current) in the production and transportation processes. The failure manifestations of electrostatic hazards are largely divided into two categories, sudden failure and potential failure. The applicant of the application discovers that potential failure caused by static electricity can cause problems of dead spots, brightness failure and the like of the display panel, and the product quality of the display panel is affected. Disclosure of Invention The application mainly solves the technical problem of providing a supporting mechanism and a display module, which can reduce electrostatic interference so as to improve the display effect of the display module. In order to solve the technical problems, the technical scheme includes that the supporting mechanism comprises a bending area and a non-bending area at least located at one side of the bending area, the supporting mechanism comprises a supporting plate and a conductive layer, the supporting plate is located at the first surface side of the supporting plate and located at the non-bending area, the supporting plate is located at the bending area and the non-bending area and comprises a first surface and a second surface which are oppositely arranged, the conductive layer is located at one side of the first surface of the supporting plate and located at the non-bending area, at least one opening is formed in the first surface of the supporting plate, at least one part of the at least one opening is located at the bending area, conductive particles are filled in the opening, and the conductive particles are electrically connected with the conductive layer. Wherein a part of the openings in the at least one opening are located in the non-bending region, an orthographic projection of the conductive layer on the supporting plate overlaps the openings in the non-bending region, the openings in the non-bending region are communicated with the openings in the bending region through grooves, the grooves are filled with conductive particles, the conductive particles in the grooves are electrically connected with the conductive particles in the openings, and preferably, the orthographic projection of the conductive layer on the supporting plate covers the openings in the non-bending region. The depth of the groove is smaller than that of the opening, and preferably, the depth of the groove ranges from 100 nanometers to 1 micrometer. The supporting mechanism further comprises an antistatic layer which is arranged on one side of the first surface of the supporting plate and at least positioned in the bending area, the supporting plate is connected with the conductive layer, and the conductive particles in the openings are electrically connected with the conductive layer through the antistatic layer. Preferably, the conductive nano particles comprise at least one of metal nano particles and carbon nano tubes. The antistatic layer extends from the first surface of the supporting plate to the surface of the conductive layer, which faces away from the supporting plate, through the side surface of the conductive layer, preferably, the orthographic projection of the antistatic layer on the supporting plate covers the orthographic projection of the conductive layer on the supporting plate, preferably, the orthographic projection of the antistatic layer on the supporting plate covers the supporting plate. The at least one opening is uniformly distributed on the supporting plate, preferably the at least one opening is arranged in an array, preferably the opening is a blind hole or a through hole penetrating through the supporting plate, preferably the opening is a circular opening, and preferably the radius of the opening is in the range of 1-10 micrometers. Wherein the conductive particles comprise at least one of metal and carbon nanotubes. The support plate is in contact connection with the conductive layer, preferably the material of the support plate comprises carbon fibers, preferably the conductive layer comprises copper foil, and preferably the non-bending area is located on two sides of the bending area. In order to solve the technical problems, the application adopts another technical scheme that the display module comprises the supporting mechanism and the display panel, wherein the display panel is positioned on one side of the second surface of the supporting plate and is supported by the supporting plate. The application has the beneficial effects that the bending region of the supporting plate is provided with the open holes, conductive particles are filled in the open holes, and the conductive particles are electrically connected with