CN-117954299-B - Installation adjusting device and semiconductor process equipment

CN117954299BCN 117954299 BCN117954299 BCN 117954299BCN-117954299-B

Abstract

The invention provides an installation adjusting device and semiconductor process equipment, which comprises an insulating fixing ring, an installation piece and an adjusting component, wherein the installation piece is used for fixing an upper electrode, the insulating fixing ring is arranged at the top of a process chamber of the semiconductor process equipment and is used for electrically insulating the installation piece and the upper electrode from a cavity of the process chamber, the installation piece is arranged in a space surrounded by the insulating fixing ring and is in liftable connection with the insulating fixing ring through the adjusting component, the upper electrode is arranged at the bottom of the installation piece, and the adjusting component is connected with the insulating fixing ring and is used for driving the installation piece to lift so as to adjust the vertical distance between the lower surface of the upper electrode and the upper surface of a base in the process chamber and also be used for adjusting the levelness of the lower surface of the upper electrode. The installation adjusting device and the semiconductor process equipment provided by the invention can realize the relative level of the upper electrode and the base and adjust the vertical distance between the upper electrode and the upper surface of the base according to the process requirement.

Inventors

Chi Wenkai
WANG YONGFEI
ZHAI HAO
WANG HONGBIAO

Assignees

北京北方华创微电子装备有限公司

Dates

Publication Date: 20260512
Application Date: 20221031

Claims (11)

1. A mounting and adjusting device is applied to semiconductor process equipment and is characterized by comprising an insulating fixing ring, a mounting piece for fixing an upper electrode and an adjusting component, wherein, The insulating fixing ring is arranged at the top of a process chamber of the semiconductor process equipment and is used for electrically insulating the mounting piece and the upper electrode from a cavity of the process chamber; The mounting piece is positioned in the space surrounded by the insulating fixing ring and is in liftable connection with the insulating fixing ring through the adjusting component; the upper electrode is arranged at the bottom of the mounting piece; the adjusting component is connected with the insulating fixing ring and is used for driving the mounting piece to lift so as to adjust the vertical distance between the lower surface of the upper electrode and the upper surface of the base in the process chamber and also used for adjusting the levelness of the lower surface of the upper electrode, Wherein the adjusting assembly comprises a plurality of adjusting structures uniformly distributed along the circumference of the insulating fixing ring; Each adjusting structure comprises a first adjusting piece and a second adjusting piece, wherein the first adjusting piece is in threaded connection with the insulating fixing ring, the second adjusting piece is in rotatable connection with the first adjusting piece, and the second adjusting piece is in threaded connection with the mounting piece; The first adjusting piece is used for lifting relative to the insulating fixing ring in threaded connection with the first adjusting piece when rotating, and driving the second adjusting piece and the mounting piece to synchronously lift; The second adjusting piece is used for lifting the mounting piece in threaded connection with the second adjusting piece when rotating.
2. The mounting adjustment device of claim 1, wherein the first adjustment member comprises a first ring body having a first external thread; The insulating fixing ring is provided with a supporting part extending into a space surrounded by the insulating fixing ring, and a first threaded hole is vertically formed in the supporting part; The second adjusting piece comprises a second ring body and an adjusting screw with second external threads, wherein the second ring body is nested in the first ring body and is fixedly connected with the first ring body, a second threaded hole is vertically formed in the mounting piece, the adjusting screw penetrates through the second ring body, the lower end of the adjusting screw is inserted into the second threaded hole, and the second external threads are matched with the second threaded hole.
3. The mounting adjustment device of claim 2, wherein the second adjustment member further comprises a third ring nested within and fixedly connected to the second ring; The adjusting screw penetrates through the third ring body, and a screw head of the adjusting screw is overlapped on the upper end face of the third ring body.
4. A mounting adjustment device according to any one of claims 1-3, characterized in that the insulating fixing ring comprises an annular body and an annular boss provided at the top of the annular body, the annular boss protruding towards the axis of the annular body with respect to the inner circumferential surface of the annular body; The installation adjusting device further comprises a telescopic annular sealing assembly, wherein the annular sealing assembly is located in a space surrounded by the insulating fixing ring, located between the lower surface of the annular boss and the upper surface of the installation piece and encircling the periphery of the adjusting assembly, and the annular sealing assembly is used for sealing the space between the lower surface of the annular boss and the upper surface of the installation piece.
5. The mounting adjustment device of claim 4, wherein the annular seal assembly comprises a bellows and upper and lower flanges disposed at upper and lower ends of the bellows, respectively, wherein the upper flange is sealingly connected to a lower surface of the annular boss and the lower flange is sealingly connected to an upper surface of the mounting member.
6. A mounting adjustment device according to any one of claims 1-3, characterized in that the upper surface of the mounting member is provided with a receiving recess; The installation adjusting device further comprises a heating component, wherein the heating component is arranged in the accommodating groove, and the heating component comprises a heating element and an insulating heat conduction component coated around the heating element.
7. The mounting adjustment device according to claim 6, wherein the insulating and heat conducting member comprises two insulating plates stacked on each other, the two insulating plates being bent to form a cladding space that houses the heating element therebetween.
8. The mounting adjustment device of claim 6, wherein the receiving recess is an annular recess; The heating assembly further comprises an annular supporting plate and an annular cover plate which is overlapped on the upper end face of the annular supporting plate, wherein at least one of the upper end face of the annular supporting plate and the lower end face of the annular cover plate is provided with a containing groove for containing the insulating heat conducting component and the heating element inside the insulating heat conducting component.
9. The mounting and adjusting device according to claim 8, wherein the heating element comprises a plurality of heating rods which are symmetrically distributed along the circumferential direction of the annular groove, and the number of the insulating heat conducting components is the same as that of the heating rods and is arranged in a one-to-one correspondence manner; The number of the accommodating grooves is the same as that of the heating rods, the accommodating grooves are arranged in a one-to-one correspondence manner, and at least one of the upper end face of the annular supporting plate and the lower end face of the annular cover plate is provided with a wiring groove for accommodating the wires of the heating rods.
10. The installation adjusting device according to claim 1, wherein an air inlet hole is formed in the side wall of the insulating fixing ring, the air inlet end of the air inlet hole is used for being connected with an air source of inert gas, and the air outlet end of the air inlet hole is communicated with a space surrounded by the insulating fixing ring.
11. The semiconductor process equipment comprises a process chamber, a mounting and adjusting device and an upper electrode, wherein a base for bearing a wafer is arranged in the process chamber, the upper electrode is arranged at the top of the process chamber, and the mounting and adjusting device is arranged above the upper electrode.

Description

Installation adjusting device and semiconductor process equipment Technical Field The invention relates to the field of semiconductor equipment manufacturing, in particular to a mounting and adjusting device and semiconductor process equipment. Background Along with the rapid development of the semiconductor industry, the Atomic layer deposition (Atomic LayerDeposition, ALD) technology is widely applied to the fields of low-temperature deposition, high film purity, good coverage rate and the like. However, as device structures become very sophisticated, conventional ALD techniques are difficult to meet current thin film deposition requirements. The plasma enhanced atomic layer deposition (PLASMAENHANCED ATOMIC LAYER DEPOSITION, PEALD) is to introduce radio frequency based on the traditional ALD technology, apply energy field by using radio frequency power to generate plasma, and generate high energy atoms, ions, molecules and other elements to participate in the reaction through the action of the plasma. The PEALD technology not only can be compatible with the traditional ALD technology, but also has the advantages of further reducing the process temperature required by depositing the film, improving the film quality and the like. For the PEALD technology, in order to improve the distribution uniformity of the plasma, the plasma is uniformly spread on the surface of the wafer to improve the process uniformity, the wafer carried by the upper electrode and the lower electrode mechanism (i.e. the base) is required to keep relative level, but the current PEALD equipment can only carry out level and centering adjustment on the lower electrode mechanism in the atmospheric environment, the levelness of the upper electrode mechanism cannot be adjusted, the upper electrode mechanism is easily influenced by the vacuum environment and expansion and contraction, and the relative level between the wafer carried by the upper electrode mechanism and the wafer carried by the lower electrode mechanism cannot be ensured, so that the quality of the deposited film in the PEALD process is also influenced, and the quality of the deposited film cannot be further improved. Disclosure of Invention The invention aims at solving at least one of the technical problems in the prior art, and provides a mounting and adjusting device and semiconductor process equipment, which not only can realize the relative level of an upper electrode and a base, but also can adjust the vertical distance between the lower surface of the upper electrode and the upper surface of the base according to the process requirement, thereby improving the process uniformity and the quality of film deposition. In order to achieve the object of the present invention, there is provided a mounting and adjusting device for use in semiconductor process equipment, comprising an insulating fixing ring, a mounting member for fixing an upper electrode, and an adjusting assembly, wherein, The insulating fixing ring is arranged at the top of a process chamber of the semiconductor process equipment and is used for electrically insulating the mounting piece and the upper electrode from a cavity of the process chamber; The mounting piece is positioned in the space surrounded by the insulating fixing ring and is in liftable connection with the insulating fixing ring through the adjusting component; the upper electrode is arranged at the bottom of the mounting piece; The adjusting component is connected with the insulating fixing ring and is used for driving the mounting piece to lift so as to adjust the vertical distance between the lower surface of the upper electrode and the upper surface of the base in the process chamber and also used for adjusting the levelness of the lower surface of the upper electrode. Optionally, the adjusting assembly includes a plurality of adjusting structures uniformly distributed along a circumference of the insulating fixing ring; Each adjusting structure comprises a first adjusting piece and a second adjusting piece, wherein the first adjusting piece is in threaded connection with the insulating fixing ring, the second adjusting piece is in rotatable connection with the first adjusting piece, and the second adjusting piece is in threaded connection with the mounting piece; The first adjusting piece is used for lifting relative to the insulating fixing ring in threaded connection with the first adjusting piece when rotating, and driving the second adjusting piece and the mounting piece to synchronously lift; The second adjusting piece is used for lifting the mounting piece in threaded connection with the second adjusting piece when rotating. Optionally, the first adjusting member includes a first ring body having a first external thread; The insulating fixing ring is provided with a supporting part extending into a space surrounded by the insulating fixing ring, and a first threaded hole is vertically formed in the supporting part; The second adjus