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CN-117995636-B - Mounting structure of remote plasma source and semiconductor process equipment

CN117995636BCN 117995636 BCN117995636 BCN 117995636BCN-117995636-B

Abstract

The invention provides a mounting structure of a remote plasma source and semiconductor process equipment, which comprises a mounting bracket and a lifting mechanism fixedly connected with the mounting bracket, wherein a first adjusting piece and a second adjusting piece are positioned below the remote plasma source and are fixedly connected with the remote plasma source, a first transmission structure is connected with the first adjusting piece and is connected with the second transmission structure through a linkage assembly, the second transmission structure is connected with the second adjusting piece, the first transmission structure is used for driving the first adjusting piece to lift under the driving action of a power source, and meanwhile, the second transmission structure drives the second adjusting piece to lift synchronously with the first adjusting piece under the linkage action of the linkage assembly. The installation structure of the remote plasma source and the semiconductor process equipment provided by the invention can stably drive the remote plasma source to lift and avoid the inclination of the remote plasma source in the movement process.

Inventors

  • YIN LINGFENG

Assignees

  • 北京北方华创微电子装备有限公司

Dates

Publication Date
20260512
Application Date
20221027

Claims (10)

  1. 1. A mounting structure of a remote plasma source is applied to semiconductor process equipment and is characterized by comprising a mounting bracket and a lifting mechanism fixedly connected with the mounting bracket, wherein the lifting mechanism comprises a driving assembly, a driven assembly and a linkage assembly, the driving assembly comprises a first adjusting piece and a first transmission structure, the driven assembly comprises a second adjusting piece and a second transmission structure, the first transmission structure is connected with the first transmission structure, The first adjusting piece and the second adjusting piece are positioned below the remote plasma source and fixedly connected with the remote plasma source; The first transmission structure is connected with the first adjusting piece, the first transmission structure is connected with the second transmission structure through the linkage assembly, the second transmission structure is connected with the second adjusting piece, the first transmission structure is used for driving the first adjusting piece to lift under the driving action of a power source, and meanwhile, the second transmission structure drives the second adjusting piece to lift synchronously with the first adjusting piece under the linkage action of the linkage assembly, wherein the first transmission structure and the second transmission structure adopt worm and gear transmission structures, the linkage assembly comprises a connecting rod and two couplers, and two ends of the connecting rod are respectively connected with the worms of the first transmission structure and the second transmission structure through two couplers in a coaxial manner.
  2. 2. The mounting structure according to claim 1, wherein the first transmission structure includes a first adjustment shaft, a first turbine, and a first worm, wherein the first adjustment shaft is disposed vertically, an upper end of the first adjustment shaft is screwed with the first adjustment member, and a lower end of the first adjustment shaft is coaxially connected with the first turbine; The first worm is horizontally arranged and is in transmission connection with the first turbine, the first worm is connected with the second transmission structure through the linkage assembly, and the first worm is used for rotating under the driving action of the power source and driving the first turbine and the first adjusting shaft to synchronously rotate, so that the first adjusting shaft drives the first adjusting piece to lift under the action of threaded fit.
  3. 3. The mounting structure according to claim 2, wherein the second transmission structure includes a second adjustment shaft, a second turbine, and a second worm, wherein the second adjustment shaft is vertically disposed, an upper end of the second adjustment shaft is screwed with the second adjustment member, and a lower end of the second adjustment shaft is coaxially connected with the second turbine; The second worm is in transmission connection with the second turbine and is in coaxial connection with the first worm through the linkage assembly, and the second worm is used for rotating under the linkage action of the linkage assembly and driving the second turbine and the second adjusting shaft to synchronously rotate, so that the second adjusting shaft drives the second adjusting piece and the first adjusting piece to synchronously lift under the action of threaded fit.
  4. 4.A mounting arrangement according to claim 3, wherein the two ends of the connecting rod are coaxially connected to the first worm and the second worm by means of two said couplings, respectively.
  5. 5. The mounting structure according to claim 3, wherein first key grooves are formed in bottoms of peripheral walls of the first adjusting shaft and the second adjusting shaft, second key grooves are formed in center hole walls of the first turbine and the second turbine correspondingly, lower ends of the first adjusting shaft and the second adjusting shaft are respectively arranged in center holes of the first turbine and the second turbine, and the first key grooves are in butt joint with the second key grooves to form a groove; The first transmission structure and the second transmission structure also comprise connecting keys, and the connecting keys are arranged in the grooves and matched with the grooves.
  6. 6. The mounting structure of claim 3, wherein the first and second adjustment members each comprise an adjustment member body having a threaded bore disposed therein, and wherein the top portions of the peripheral walls of the first and second adjustment shafts are each provided with external threads that mate with the threaded bores; The top of adjusting part main part is provided with flange, flange pass through a plurality of fastening screw with long-range plasma source fixed connection, a plurality of fastening screw is followed the circumference evenly distributed of screw hole is in around the screw hole.
  7. 7. The mounting structure of any one of claims 2-4, wherein the power source includes a manual rocker coupled to the first worm for manually driving the first worm into rotation.
  8. 8. The mounting structure according to any one of claims 2 to 4, wherein the power source includes a rotary drive source connected to the first worm for driving the first worm to rotate.
  9. 9. A semiconductor processing apparatus comprising a process chamber and a mounting structure disposed atop the process chamber, and a remote plasma source mounted on the mounting structure, wherein the mounting structure employs the mounting structure of any one of claims 1-8.
  10. 10. The semiconductor processing apparatus of claim 9, further comprising two gas inlet lines horizontally and coaxially disposed below the remote plasma source, and wherein the gas inlet ends of the two gas inlet lines are connected to the output end of the remote plasma source by a three-way line, and the gas outlet ends of the two gas inlet lines are open downward for connection to the gas inlet of the process chamber; The first adjusting piece and the second adjusting piece are symmetrically arranged on two sides of the air inlet pipeline along the direction perpendicular to the extending direction of the air inlet pipeline.

Description

Mounting structure of remote plasma source and semiconductor process equipment Technical Field The invention relates to the field of semiconductor manufacturing, in particular to a mounting structure of a remote plasma source and semiconductor process equipment. Background With the rapid development of the integrated circuit industry, the feature size is becoming smaller and smaller, and the choice of interconnect materials is also particularly important. Tungsten (W) is chemically and electrically stable, making it widely used in the semiconductor industry. The growth process of tungsten films generally includes the steps of infiltration (Soak), nucleation (Nucleation), and Bulk deposition (Bulk). At present, an atomic layer deposition (Atomic Layer Deposition, ALD) process is mainly adopted to realize a nucleation (Nucleation) step, a chemical vapor deposition (Chemical Vapor Deposition, CVD) process is adopted to realize a Bulk deposition (Bulk) step, and finally, the filling of metal tungsten in the groove is realized. The main principle of the ALD process and the CVD process is to react WF 6 with a reducing gas such as SiH 4、B2H6 and H 2 on the surface of a wafer (wafer) by using a heat source, and to form a metal tungsten thin film on the wafer. The completely seamless, void-free deposition or filling of low resistivity, low stress, low impurity content metal tungsten is finally achieved on the wafer surface or within the microstructure of the device. The ALD process and the CVD process are performed by introducing a process gas into a process chamber to react, and forming a metal tungsten film on a wafer, wherein the metal tungsten film is not only formed on the wafer but also attached to the surface of a part in the chamber, so that the interior of the chamber needs to be cleaned periodically to remove the tungsten film on the surface of the part in the chamber. For example, a process chamber is cleaned using a plasma generated by a Remote Plasma Source (RPS), the RPS is mounted above the chamber to facilitate the plasma entering the process chamber for cleaning, and the generated plasma flows out of an output below the RPS and into the process chamber through a conduit. When the RPS is installed or maintenance is needed, the RPS needs to be moved upwards or downwards, and after the RPS finishes operation, the connection between the output end of the RPS and a pipeline also needs to ensure the connection precision, so that leakage points are avoided. The existing Remote Plasma Source (RPS) is fixed on a bottom plate through bolt connection, lifting adjusting blocks are arranged at four corners of the bottom plate, a mounting bracket is arranged at the top of a process chamber, four lifting screws are respectively arranged at positions corresponding to the four lifting adjusting blocks on the mounting bracket, and the lifting screws are matched with the corresponding lifting adjusting blocks to adjust the height of the RPS. After the RPS height adjustment is completed, the base plate is secured to the mounting bracket using set screws. However, in the prior art, the lifting of the RPS is controlled by four lifting screws, and the four screws cannot ensure that the RPS can be lifted stably, so that the RPS is inclined to one side easily, and the risk of leakage of the RPS at the butt joint of the output end and the pipeline is caused. In addition, in the RPS lifting process, four lifting screws need to be operated in sequence, so that in order to prevent the RPS inclination from being too large, the movement amount of each lifting screw is not too large, and therefore the four lifting screws need to be operated for multiple times to be adjusted to an ideal position, and the efficiency of the operation process is low. Disclosure of Invention The invention aims to at least solve one of the technical problems in the prior art, and provides a remote plasma source mounting structure and semiconductor process equipment, which can stably drive the remote plasma source to lift and avoid the inclination of the remote plasma source in the motion process, so that the connection precision of the output end of the remote plasma source and a gas circuit can be improved, and the adjustment efficiency can also be improved. The invention provides a mounting structure of a remote plasma source, which is applied to semiconductor process equipment and comprises a mounting bracket and a lifting mechanism fixedly connected with the mounting bracket, wherein the lifting mechanism comprises a driving component, a driven component and a linkage component, the driving component comprises a first adjusting piece and a first transmission structure, the driven component comprises a second adjusting piece and a second transmission structure, the first transmission structure is connected with the first transmission structure, The first adjusting piece and the second adjusting piece are positioned below the remote plasma source and