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CN-118003752-B - Automatic semiconductor film tearing machine

CN118003752BCN 118003752 BCN118003752 BCN 118003752BCN-118003752-B

Abstract

The invention discloses an automatic semiconductor film tearing machine, which is characterized in that a main platform is sequentially provided with a feeding unit, a film tearing unit, a visual detection unit and a discharging unit, a first conveying platform, a second conveying platform, a first movable clamp and a second movable clamp are also arranged on the main platform, a feeding bin door and a discharging bin door are arranged on a rack arranged on the main platform, the automatic semiconductor film tearing machine does not need to be stopped and waited in the feeding and discharging process, the production efficiency is improved, the semiconductor panel can be preheated, the adhesive attachment fastness of the semiconductor substrate and the protective film is reduced, the film tearing is convenient, the incomplete film tearing and the residual situation are reduced, the visual detection unit is matched with the third manipulator, the qualified products and the unqualified products of the semiconductor substrate are sorted, the labor cost is reduced, the film lifting knife, the first clamping part and the second clamping part are matched, the stress area of the film is increased, meanwhile, the external force direction and the stress surface of the semiconductor substrate form an included angle, and the film tearing efficiency and the qualification rate are improved.

Inventors

  • YE SHIFENG
  • YU ZIQIANG

Assignees

  • 东屹半导体科技(江苏)有限公司

Dates

Publication Date
20260505
Application Date
20240301

Claims (7)

  1. 1. The automatic semiconductor film tearing machine is characterized by comprising a main platform (1), wherein a feeding unit (2), a film tearing unit (3), a visual detection unit (5) and a discharging unit (4) are sequentially arranged on the main platform (1), a first conveying platform (6), a second conveying platform (7), a first movable clamp (8) and a second movable clamp (9) are further arranged on the main platform (1), a frame (11) is arranged on the main platform (1), and a feeding bin door (12) and a discharging bin door (13) are arranged on the frame (11); The feeding unit (2) comprises a first conveying track (21), a second conveying track (22), a first manipulator (23), a second manipulator (24), a middle rotating platform (25) and four magazines (26), wherein the number of the magazines (26) is four, semiconductor panels (10) for preparing a tearing film are stored, and the semiconductor panels (10) comprise a semiconductor substrate (101) and a protective film (102); The first movable clamp (8) conveys the semiconductor panel (10) on the second conveying platform (7), the second movable clamp (9) conveys the semiconductor panel (10) on the first conveying platform (6), and the first movable clamp (8) and the second movable clamp (9) preheat the semiconductor panel (10) in the conveying process; the film tearing unit (3) comprises a third conveying track (31), a fourth conveying track (32), a first film tearing mechanism (33), a second film tearing mechanism (34) and a waste film part (35), wherein the first film tearing mechanism (33) comprises a film lifting knife (331), a first clamping part (332) and a second clamping part (333); The blanking unit (4) comprises a fifth conveying track (41), a third manipulator (42), a third conveying platform (43), a first swing table (44), a second swing table (45), a lifting table (46), a finished product material box (47), a finished product material box output platform (48) and an empty material box input platform (49); A moving track is arranged in the visual detection unit (5), the semiconductor substrate (101) on the first moving clamp (8) and the second moving clamp (9) are alternately scanned, and abnormal residues of the semiconductor substrate (101) after film tearing is finished are detected; The transfer platform (25) is used for positioning and correcting the semiconductor panel (10) so that the semiconductor panel (10) is parallel to the first movable clamp (8) and the second movable clamp (9), and the transfer platform (25) is used for preheating the semiconductor panel (10); The second manipulator (24) moves on the second conveying track (22) to grab and place the semiconductor panel (10) on the transfer platform (25) from the magazine (26), the first manipulator (23) moves on the first conveying track (21) to grab and place the semiconductor panel (10) on the transfer platform (25) alternately on the first moving clamp (8) and the second moving clamp (9), and the first manipulator (23) preheats the semiconductor panel (10) in the transfer process.
  2. 2. The automatic semiconductor film tearing machine according to claim 1, wherein the first film tearing mechanism (33) tears a semiconductor panel (10) on the second movable clamp (9), the second film tearing mechanism (34) tears a semiconductor panel (10) on the first movable clamp (8), the first film tearing mechanism (33) conveys waste films to the waste film part (35) through the third conveying track (31), and the second film tearing mechanism (34) conveys waste films to the waste film part (35) through the fourth conveying track (32).
  3. 3. The automatic semiconductor film tearing machine according to claim 1, wherein the first film tearing mechanism (33) and the second film tearing mechanism (34) are identical film tearing mechanisms, the film lifting knife (331) pre-separates the protective film (102) on the semiconductor panel (10), the first clamping part (332) clamps the edge and corner of the protective film (102), the semiconductor panel (10) moves right, and the second clamping part (333) clamps the vertical surface of the pulled protective film (102) so that the stress of the film is uniform.
  4. 4. The automatic semiconductor film tearing machine according to claim 1, wherein the third manipulator (42) conveys the semiconductor substrates (101) on the first moving clamp (8) and the second moving clamp (9) to the first swing table (44) and the second swing table (45) through the fifth conveying track (41), the first swing table (44) conveys the semiconductor substrates (101) into the finished product cartridge (47) through the third conveying platform (43), the empty cartridge input platform (49) is used for preparing an empty finished product cartridge (47) and conveying the empty finished product cartridge to the lifting table (46), and the lifting table (46) conveys the full finished product cartridge (47) to the finished product cartridge output platform (48).
  5. 5. The automatic semiconductor film tearing machine according to claim 4, wherein the third manipulator (42) places a qualified semiconductor substrate (101) on the first swing table (44) and places an unqualified semiconductor substrate (101) on the second swing table (45) by a scanning result of the semiconductor substrate (101) by the visual detection unit (5).
  6. 6. The automatic semiconductor film tearing machine according to claim 1, wherein the feeding and discharging processes of the feeding bin gate (12) and the discharging bin gate (13) are not interfered with the running state of the equipment, the feeding bin gate (12) and the empty magazine are simultaneously unlocked under the condition of replacing the magazine (26), the feeding bin gate (12) and the magazine (26) are simultaneously locked after the magazine (26) is filled, the discharging bin gate (13), the finished product bin output platform (48) and the empty bin input platform (49) are simultaneously unlocked under the condition of replacing the finished product bin (47), the empty bin input platform (49) is pulled out to put the empty finished product bin, the finished product bin output platform (48) is pulled out to be used for reserving space, and the feeding bin gate (13), the finished product bin output platform (48) and the empty bin input platform (49) are put into the locking state after the replacement.
  7. 7. The automatic semiconductor film tearing machine according to claim 1, wherein the empty material box input platform (49) and the finished material box output platform (48) are driven by a motor, the empty material box input platform (49) is conveyed from outside to inside, and the finished material box output platform (48) is conveyed from inside to outside.

Description

Automatic semiconductor film tearing machine Technical Field The invention relates to the technical field of semiconductor manufacturing equipment, in particular to an automatic semiconductor film tearing machine. Background A semiconductor is a material based on a conductor and an insulator at normal temperature, which is often used in the scientific fields of aviation, automobiles, artificial intelligence, communication systems and the like, wherein the common semiconductor material is silicon, germanium, gallium arsenide and the like, and silicon is one of the more important influence, but at the same time, the semiconductor is also one of the more precise materials, and in the daily semiconductor processing technology, in order to avoid the semiconductor panel from contacting with foreign matters, wire bonding process, fixing corner leading process, fixing seal, scratching the panel and other processes which are likely to damage the semiconductor panel, a layer of film with different process requirements is covered on the semiconductor material for different process requirements, and the protective film needs to be removed after the above processing process is completed. The traditional film tearing machine has the advantages of low automation degree, too relying on manual work, complex operation during manual sorting, higher labor cost, and meanwhile, the machine needs to be stopped for waiting in the feeding and discharging process, so that the production efficiency is greatly reduced, and the abnormal conditions of incomplete film tearing, residual and the like exist in the film tearing process, so that the product percent of pass is low. Disclosure of Invention The invention aims to solve the defects in the prior art and provide an automatic semiconductor film tearing machine. The automatic semiconductor film tearing machine comprises a main platform, wherein a feeding unit, a film tearing unit, a visual detection unit and a discharging unit are sequentially arranged on the main platform, a first conveying platform, a second conveying platform, a first movable clamp and a second movable clamp are also arranged on the main platform, a frame is arranged on the main platform, and a feeding bin door and a discharging bin door are arranged on the frame; the feeding unit comprises a first conveying track, a second conveying track, a first manipulator, a second manipulator, a transfer platform and four magazines, wherein semiconductor panels for preparing a tearing film are stored in the magazines, and each semiconductor panel comprises a semiconductor substrate and a protective film; The first moving clamp conveys the semiconductor panel on a second conveying platform, the second moving clamp conveys the semiconductor panel on the first conveying platform, and the first moving clamp and the second moving clamp preheat the semiconductor panel in the conveying process; the film tearing unit comprises a third conveying track, a fourth conveying track, a first film tearing mechanism, a second film tearing mechanism and a waste film part, wherein the first film tearing mechanism comprises a film lifting knife, a first clamping part and a second clamping part; The blanking unit comprises a fifth conveying track, a third manipulator, a third conveying platform, a first swing table, a second swing table, a lifting table, a finished product material box output platform and an empty material box input platform; The vision detection unit is internally provided with a moving track, and the semiconductor substrates on the first moving clamp and the second moving clamp are alternately scanned to detect abnormal residues of the semiconductor substrates after film tearing is finished. The invention further improves that the transfer platform performs positioning correction on the semiconductor panel, so that the semiconductor panel is parallel to the first moving clamp and the second moving clamp, and the transfer platform performs preheating on the semiconductor panel. The invention further improves that the second manipulator moves on the second conveying track to grab the semiconductor panel from the magazine and place the semiconductor panel on the transfer platform, the first manipulator moves on the first conveying track to grab the semiconductor panel from the transfer platform and place the semiconductor panel on the first moving clamp and the second moving clamp alternately, and the first manipulator preheats the semiconductor panel in the transferring process. The invention further improves that the first film tearing mechanism tears films on the semiconductor panel on the second movable clamp, the second film tearing mechanism tears films on the semiconductor panel on the first movable clamp, the first film tearing mechanism conveys waste films to the waste film part through the third conveying track, and the second film tearing mechanism conveys waste films to the waste film part through the fourth conveying