CN-118159812-B - Temperature measuring device and temperature measuring system for non-invasive temperature measurement

Abstract

The invention relates to a temperature measuring device (10) for non-invasively measuring the temperature (17) of a medium (14) in a pipe (12). The temperature measurement device (10) comprises a sensor holder (30) and a thermal coupling element (20) configured for creating a thermal conduction path (47) from a wall (16) of the pipe (12) to the first temperature sensor (32). According to the invention, the thermal coupling element (20) is configured as a layered design with components made of different materials for adjusting the thermal conduction path (47). Alternatively or additionally, the thermal coupling element (20) has at least in sections an arcuate contour (29) for axially reversing the heat conduction path (47). The invention also relates to a temperature measurement system (50) comprising such a temperature measurement device (10). The invention also relates to a computer program product (60) adapted to simulate the operation behaviour of such a temperature measuring device (10).

Inventors

• Thomas Bill Weiler
• ENS WOLFGANG
• Marcus Hilsendergen
• Ralph hooker
• Valentin Rigoni
• Tim Shirrell
• Stefan von Dosco

Assignees

• 西门子股份公司

Dates

Publication Date

20260512

Application Date

20220811

Priority Date

20211022

Claims (14)

1. 1. A temperature measuring device (10) for non-invasively measuring a temperature (17) of a medium (14) in a pipe (12), comprising a first temperature sensor (32), a sensor mount (30) and a thermal coupling element (20) which is implemented for producing a thermal conduction path (47) from a pipe wall (16) of the pipe (12) to the first temperature sensor (32), the first temperature sensor being implemented for providing a first temperature measurement value (41), characterized in that the thermal coupling element (20) has an arcuate profile (29) at least locally for adjusting the thermal conduction path (47) for the purpose of axially reversing the thermal conduction path (47), wherein the axial reversal is related to an axial direction defined by an extension direction of the pipe (12).
2. 2. The temperature measurement device (10) according to claim 1, characterized in that, for adjusting the heat conduction path (47), the thermal coupling element (20) is implemented as a layered design with components composed of different materials.
3. 3. The temperature measurement device (10) according to claim 1 or 2, characterized in that the thermal coupling element (20) has a C-shaped profile, an S-shaped profile, a Z-shaped profile or a meandering profile.
4. 4. The temperature measurement device (10) according to claim 1 or 2, characterized in that the temperature measurement device (10) has a second temperature sensor (34).
5. 5. The temperature measurement device (10) according to claim 4, characterized in that the first temperature sensor (32) is arranged in a first axial portion (22) of the thermal coupling element (20) for obtaining a first temperature measurement value (41) and the second temperature sensor (34) is arranged in a second axial portion (24) of the thermal coupling element (20) for obtaining a second temperature measurement value (43).
6. 6. The temperature measurement device (10) according to claim 1 or 2, characterized in that the thermal coupling element (20) is at least partially formed by a metal alloy having a value of up to 0.025 (W/(m) K) Temperature dependent thermal conductivity gradient) of C.
7. 7. The temperature measurement device (10) according to claim 6, wherein the material is stainless steel.
8. 8. The temperature measurement device (10) according to claim 1 or 2, characterized in that a side (28) of the thermal coupling element (20) facing the pipe (12) is embodied as a dovetail.
9. 9. Temperature measuring device (10) according to claim 1 or 2, characterized in that a recess (21) for threading a fastening means (31) is implemented in the region of the thermal coupling element (20) facing the pipe (12).
10. 10. The temperature measurement device (10) according to claim 4, characterized in that the thermal coupling element (20) has an end axial portion (38) positioned along the thermally conductive path (47) downstream of the first and/or second temperature sensor (34).
11. 11. The temperature measurement device (10) according to claim 4, characterized in that the first and/or second temperature sensor (32, 34) is mountable along a radial direction (18) of the pipe (12).
12. 12. The temperature measurement device (10) according to claim 4, characterized in that the first temperature sensor and/or the second temperature sensor is mountable along an axial direction (19) of the pipe (12).
13. 13. A temperature measurement system (50) comprising a temperature measurement device (10) coupled with an evaluation unit (40), characterized in that the temperature measurement device (10) is implemented according to any one of claims 1 to 12.
14. 14. A computer program product (60) for simulating the operation of a temperature measuring device (10) mounted on a pipe (12) for measuring the temperature (17) of a medium (14) located in the pipe, characterized in that the temperature measuring device (10) is implemented according to any one of claims 1 to 12, wherein the computer program product (60) is implemented as a digital twin of the temperature measuring device (10).

Description

Temperature measuring device and temperature measuring system for non-invasive temperature measurement Technical Field The present invention relates to a temperature measuring device for non-invasive temperature measurement. The invention also relates to a temperature measuring system with such a temperature measuring device. The invention also relates to a computer program product for simulating the operation behaviour of such a temperature measuring device. Background International patent application WO 2019/0631519 A1 discloses a temperature measuring device that can be mounted on a pipe. The temperature measuring device comprises two temperature sensors which can be mounted with their measuring tips at different radial distances from the pipe wall of the pipe. Here, the measuring tip of the temperature sensor is installed in the insulation layer so as to minimize errors caused by heat loss. From reference WO 2017/131546 A1 a temperature measuring device is known, which comprises two temperature sensors, which produce individual measured values from which the temperature of the medium in the pipe can be calculated. Here, the thermal resistance values of the different components are considered. Non-invasive temperature measurements are increasingly being used in various fields of application, i.e. for example in the processing industry. Thus, improved measurement accuracy, reliability, and cost effectiveness are sought. Installation friendliness is likewise sought in order to be able to retrofit existing installations quickly. The invention is based on the object of providing a temperature measuring device which provides an improvement in at least one of the described aspects. Disclosure of Invention This object is achieved by the temperature measuring device according to the invention, which is designed for non-invasive measurement of the temperature of a medium located in a pipe. The medium can be, for example, a liquid, a gas, a vapor, mixtures thereof or a viscous substance. Here, the direction in which the conduit extends defines an axial direction. The temperature measuring device comprises a sensor holder which is fixed in the installed state at the thermal coupling element. The thermal coupling element is configured for producing a thermally conductive contact to a wall of the pipe. The thermal coupling element is configured to be at least partially thermally conductive in itself and is adapted to define a thermally conductive path. The temperature measuring device further has a first temperature sensor, which is designed to provide a first temperature measurement value. For this purpose, the first temperature sensor can be connected to the thermal coupling element in a thermally conductive manner. The thermal coupling element is configured for establishing a thermal conduction path from the wall of the conduit to the first temperature sensor. Here, the heat conduction path is a part of and/or at the heat coupling element along which the heat flow flowing from the pipe wall into the heat coupling element essentially propagates. For example, heat loss from the thermal coupling element to the environment should not be attributed to the heat conduction path from the tube wall to the first temperature sensor. Such heat loss can be minimized or kept constant, for example, by an insulating layer. According to the invention, the thermal coupling element is designed to regulate the thermal conduction path from the pipe wall to the first temperature sensor. The adjustment includes that the thermal conduction resistance of the thermal conduction path or its thermal conductivity is structurally preset by the thermal coupling element. According to the invention, the thermal coupling element is designed for reversing the heat transfer path in the axial direction, i.e. in relation to the axial direction. By reversing the axial direction, the heat conduction paths extend in substantially opposite directions at different locations. For this purpose, the thermal coupling element has an arcuate contour at least in some regions. The contour is to be understood here in particular as the shape of the thermal coupling element as seen from the side. The axial deflection is achieved by extending the heat conduction path along the sections of the profile, i.e. through them essentially along the main structural axis there. This enables an extension of the heat conduction path between the pipe wall and the first temperature sensor compared to prior art solutions. Thus, the thermal resistance present along the thermally conductive path can be adjusted to allow for accurate measurement of the temperature of the medium. In particular, by designing the thermal coupling element to extend in the axial direction, the thermal conduction path can be extended in a space-saving manner in the radial direction. At the same time, the extension of the heat conduction path achieved in this way can be achieved in a particularly compact mann