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CN-118250907-B - Manufacturing method of printed circuit boards with different height differences

CN118250907BCN 118250907 BCN118250907 BCN 118250907BCN-118250907-B

Abstract

The application relates to a method for manufacturing printed circuit boards with different height differences. The method comprises the steps of determining the number of bonding sheets corresponding to a test board to be manufactured according to the reference filling number of filling equipment, obtaining bonding sheets the same as the number of the bonding sheets, and manufacturing the test board comprising a plurality of recessed areas with different depths according to each bonding sheet. By adopting the method, the application scenes of the test board can be enriched, and the test efficiency of the filling equipment is further improved.

Inventors

  • WANG XUMING
  • WANG MINGZHEN

Assignees

  • 九江明阳电路科技有限公司

Dates

Publication Date
20260512
Application Date
20240301

Claims (9)

  1. 1. A method of manufacturing a test panel, the method comprising: determining the number of bonding sheets corresponding to a test board to be manufactured according to the reference filling number of filling equipment, wherein the reference filling number represents the number of bonding sheets in the test board supported by the filling equipment to be filled; Obtaining bonding sheets with the same number as the bonding sheets; Sequencing the bonding sheets to obtain the windowing sequence of the bonding sheets; sequentially opening windows on the bonding sheets based on the window opening sequence of the bonding sheets; And superposing and pressing the bonding sheets with the windows to obtain a test board, wherein the next bonding sheet in the adjacent bonding sheets in the test board is provided with windows with the same positions and numbers as those of the previous bonding sheet, the other positions of the next bonding sheet are provided with a preset number of new windows, and the test board comprises a plurality of recessed areas with different depths.
  2. 2. The method according to claim 1, wherein the step of superposing and laminating the adhesive sheets with the windows to obtain the test board comprises: the method comprises the steps of obtaining a substrate of the test board, wherein the size of the substrate is larger than or equal to that of each bonding sheet; And sequentially pressing the bonding sheets onto the substrate from bottom to top according to the sequence of the number of the windows on the bonding sheets from small to large to obtain the test board.
  3. 3. A filling apparatus testing method, the method comprising: controlling filling equipment to fill recessed areas with different depths on a test board, wherein the test board is manufactured according to the method of claim 1 or 2; And determining the filling performance of the filling equipment according to the flatness of the filled test board.
  4. 4. A method according to claim 3, wherein said determining the filling performance of the filling device based on the flatness of the filled test board comprises: acquiring flatness corresponding to each concave area on the test board through image recognition; And comparing each flatness with a flatness threshold value, and determining the deepest concave depth larger than the flatness threshold value as the filling performance of the filling equipment.
  5. 5. A test panel manufacturing apparatus, the apparatus comprising: The device comprises a determining module, a filling device and a filling module, wherein the determining module is used for determining the number of bonding sheets corresponding to a test board to be manufactured according to the reference filling number of the filling device; The acquisition module is used for acquiring the bonding sheets with the same number as the bonding sheets; The manufacturing module is used for sequencing the bonding sheets to obtain the windowing sequence of the bonding sheets, sequentially windowing the bonding sheets based on the windowing sequence of the bonding sheets, superposing and pressing the bonding sheets with the windowed bonding sheets to obtain a test board, wherein windows with the same positions and numbers as those of the previous bonding sheet are arranged on the next bonding sheet in the adjacent bonding sheets in the test board, a preset number of new windows are arranged on other positions of the next bonding sheet, and the test board comprises a plurality of concave areas with different depths.
  6. 6. A filling apparatus testing device, the device comprising: The filling module is used for controlling filling equipment to fill the concave areas with different depths on the test board, and the test board is manufactured according to the method of claim 1 or 2; And the test module is used for determining the filling performance of the filling equipment according to the flatness of the filled test board.
  7. 7. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of any of claims 1 to 4 when the computer program is executed.
  8. 8. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 4.
  9. 9. A computer program product comprising a computer program, characterized in that the computer program, when executed by a processor, implements the steps of the method of any of claims 1 to 4.

Description

Manufacturing method of printed circuit boards with different height differences Technical Field The application relates to the technical field of printed board manufacturing, in particular to a method for manufacturing printed circuit boards with different height differences. Background In the process of manufacturing a printed circuit board (Printed Circuit Board, PCB), the surface of the laminated board is often uneven due to the effect of the cover of the adhesive sheet. In this case, it is often necessary to fill the PCB with a filling device, so that the surface of the PCB is smoother. In the related art, in order to test the filling capability of different filling devices, various test boards need to be manufactured, and the filling performance of each filling device is determined according to the filling effect of the filling device on the corresponding test board. However, the test board manufactured in the related art has a problem of single application scene, which affects the test efficiency of the filling device. Disclosure of Invention Based on the above, it is necessary to provide a method for manufacturing printed circuit boards with different height differences to enrich the application scenarios of the test board and further improve the test efficiency of the filling device. In a first aspect, the present application provides a method for manufacturing a test board, including: determining the number of bonding sheets corresponding to the test board to be manufactured according to the reference filling number of the filling equipment; Obtaining bonding sheets with the same number as the bonding sheets; and manufacturing a test board according to each bonding sheet, wherein the test board comprises a plurality of recessed areas with different depths. In one embodiment, a test panel is made from each adhesive sheet, comprising: sequencing all the bonding sheets to obtain the windowing sequence of all the bonding sheets; sequentially opening windows on the bonding sheets based on the window opening sequence of the bonding sheets; and generating a test board according to each bonding sheet after the window is formed. In one embodiment, the opening of the windows on each bonding sheet is sequentially performed based on the opening sequence of each bonding sheet, including: Opening a preset number of windows on the first bonding sheet based on the window opening sequence of each bonding sheet; And opening windows for the rest bonding sheets in each bonding sheet according to the window formed in the first bonding sheet and a preset adjacent bonding sheet window forming rule. In one embodiment, the adjacent bonding sheet window opening rule includes: The next bonding sheet in the adjacent bonding sheets is provided with windows with the same positions and the same number as those of the previous bonding sheet, and other positions of the next bonding sheet are provided with new windows with preset numbers. In one embodiment, the method for generating the test board according to each bonding sheet after opening the window comprises the following steps: The method comprises the steps of obtaining a substrate of a test board, wherein the size of the substrate is larger than or equal to that of each bonding sheet; And sequentially pressing the bonding sheets onto the substrate from bottom to top according to the sequence of the number of the windows on the bonding sheets from small to large to obtain the test board. In a second aspect, the present application further provides a method for testing filling equipment, the method comprising: Controlling filling equipment to fill recessed areas with different depths on a test board, wherein the test board is manufactured according to the method in any embodiment of the first aspect; and determining the filling performance of the filling equipment according to the flatness of the filled test board. In a third aspect, the present application also provides a test board manufacturing apparatus, including: the determining module is used for determining the number of bonding sheets corresponding to the test board to be manufactured according to the reference filling number of the filling equipment; The acquisition module is used for acquiring the bonding sheets with the same number as the bonding sheets; and the manufacturing module is used for manufacturing the test board according to each bonding sheet, and the test board comprises a plurality of recessed areas with different depths. In a fourth aspect, the present application also provides a filling device testing apparatus, including: The filling module is used for controlling filling equipment to fill the concave areas with different depths on the test board; and the test module is used for determining the filling performance of the filling equipment according to the flatness of the filled test board. In a fifth aspect, the present application also provides a computer device comprising a memory storing a com