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CN-118280909-B - Wafer clamping mechanism for turret-type die bonding device

CN118280909BCN 118280909 BCN118280909 BCN 118280909BCN-118280909-B

Abstract

The invention discloses a wafer clamping mechanism for a turret-type die bonding device, which comprises a substrate (40), a lifting assembly (60) and a supporting ring (80), wherein the lifting assembly (60) comprises a lifting ring (61) and a second motor (62), the second motor (62) is fixedly arranged at one end of the substrate (40), the lifting ring (61) of the lifting assembly (60) is arranged on the front surface of the substrate (40), the lifting ring (61) can move in a lifting manner relative to the substrate (40) under the driving of the second motor (62), the supporting ring (80) is integrally cylindrical, the supporting ring (80) is positioned at the inner side of the lifting ring (61) along the radial direction, the supporting ring (80) is connected with the substrate (40), and the supporting ring (80) cannot move in a lifting manner relative to the substrate (40). The wafer clamping mechanism can achieve lifting movement and rotation of the wafer, and can achieve firm fixing of the flexible wafer in a mode of clamping along the edge and expanding the wafer.

Inventors

  • AI BING
  • QU JINGGUO
  • LI BO
  • SUN YIJUN

Assignees

  • 上海赢朔电子科技股份有限公司

Dates

Publication Date
20260512
Application Date
20240430

Claims (20)

  1. 1. The wafer clamping mechanism for the turret-type die bonding device is characterized by comprising a substrate (40) and a lifting assembly (60), wherein the lifting assembly (60) comprises a lifting ring (61) and a second motor (62), the second motor (62) is fixedly arranged at one end of the substrate (40), the lifting ring (61) of the lifting assembly (60) is arranged on the front surface of the substrate (40), and the lifting ring (61) can move in a lifting manner relative to the substrate (40) under the driving of the second motor (62); The lifting ring (61) is in a circular ring shape as a whole, the lifting ring (61) comprises a main ring body part (61-1), a plurality of shoulder parts (61-2), a plurality of lug parts (61-3) and a plurality of second V-shaped rollers (61-4), all the shoulder parts (61-2) are fixedly arranged on the outer circumferential surface of the main ring body part (61-1), all the shoulder parts (61-2) protrude outwards relative to the main ring body part (61-1) along the radial direction, one lug part (61-3) is fixedly arranged on the outer side surface of each shoulder part (61-2), all the lug parts (61-3) protrude outwards relative to the shoulder parts (61-2), one U-shaped groove (61-5) is arranged on the end surface of each shoulder part (61-2) far away from the base plate (40), one second V-shaped roller (61-4) is arranged in each U-shaped groove (61-5), and one circumferential roller part is arranged on the outer side surface of each second V-shaped roller (61-4).
  2. 2. The wafer clamping mechanism for a turret-type die bonding apparatus according to claim 1, wherein the lifting assembly (60) further comprises a second driving wheel (62-1), a fourth driving wheel (63), a fifth driving wheel (64), a plurality of guide wheels (65), two third guide rollers (66), a third endless belt (67), a fourth endless belt (68), and a plurality of lead screws (69), and the number of the guide wheels (65) is the same as the number of the lead screws (69).
  3. 3. The wafer clamping mechanism for the turret-type die bonder according to claim 2, wherein an output shaft of the second motor (62) is fixedly connected with the second driving wheel (62-1), a fourth driving wheel (63) is arranged on the front surface of the substrate (40), a fifth driving wheel (64) is arranged on the back surface of the substrate (40), the fourth driving wheel (63) and the fifth driving wheel (64) are respectively fixedly arranged at two ends of the same central shaft, so that the fourth driving wheel (63), the fifth driving wheel (64) and the central shaft thereof can synchronously rotate relative to the substrate (40), and the common central shaft of the fourth driving wheel (63) and the fifth driving wheel (64) is vertically arranged on the substrate (40); All the guide wheels (65) and two third guide rollers (66) are arranged on the back surface of the substrate (40), the central axes of all the guide wheels (65) and the two third guide rollers (66) are fixedly arranged on the substrate (40), the extending directions of the central axes of all the guide wheels (65) and the two third guide rollers (66) are perpendicular to the substrate (40), and all the guide wheels (65) and the two third guide rollers (66) can rotate around the central axes of the guide wheels.
  4. 4. The wafer clamping mechanism for a turret-type die bonder according to claim 3, wherein teeth are formed on inner side surfaces of the third endless belt (67), teeth are formed on outer side circumferential surfaces of wheel body portions of the second driving wheel (62-1) and the fourth driving wheel (63), the inner side surfaces of the third endless belt (67) encircle portions of outer side circumferential surfaces of the second driving wheel (62-1) and the fourth driving wheel (63), teeth on outer side circumferential surfaces of the second driving wheel (62-1) and the fourth driving wheel (63) can be meshed with teeth on inner side surfaces of the third endless belt (67), the third endless belt (67) is stretched by the second driving wheel (62-1) and the fourth driving wheel (63), and an output shaft of the second motor (62) can drive the second driving wheel (62-1) to rotate, and the second driving wheel (62-1) drives the fourth driving wheel (63) to rotate again by means of the third endless belt (67).
  5. 5. The wafer clamping mechanism for a turret-type die bonder according to claim 4, wherein teeth are provided on an inner side surface of a fourth endless belt (68), teeth are provided on outer side circumferential surfaces of wheel body parts of a fifth driving wheel (64) and all guide wheels (65), the inner side surface of the fourth endless belt (68) surrounds part of the outer side circumferential surfaces of the wheel body parts of the fifth driving wheel (64) and all guide wheels (65), teeth on the outer side circumferential surfaces of the wheel body parts of the fifth driving wheel (64) and all guide wheels (65) can be engaged with teeth on the inner side surface of the fourth endless belt (68), so that the fifth driving wheel (64) can drive all guide wheels (65) to rotate by means of the fourth endless belt (68), the outer side surface of the fourth endless belt (68) surrounds part of the outer side circumferential surfaces of two third guide rollers (66), one section of the fourth endless belt (68) winds into the outer circumferential surface of each third guide roller (66) and out of the outer circumferential surface of the third guide rollers (66), the fourth endless belt (68) can be wound around the fourth endless belt (68) and the fourth endless belt (68) at right angle to the fourth guide rollers (66), and the fourth endless belt (68) can be wound around the fourth endless belt (68) and the fourth endless belt (66) at right angle.
  6. 6. Wafer clamping mechanism for turret-type die bonding apparatus according to claim 5, wherein a circular threaded hole (61-6) is provided in each lug portion (61-3), each guide wheel (65) is fixedly connected to one end of a screw (69), and the other end of the screw (69) is threaded out from the front surface of the base plate (40), each screw (69) is threaded into the threaded hole (61-6) of one lug portion (61-3) of the lift ring (61), and the screw (69) is screwed with the lug portion (61-3).
  7. 7. The wafer clamping mechanism for a turret-type die bonding apparatus as set forth in claim 5, wherein a circular through hole is provided in each lug portion (61-3) of the lift ring (61), and a ball nut (61-7) is fixedly provided in each through hole, the screws (69) are ball screws, each screw (69) penetrates into the through hole of one lug portion (61-3) of the lift ring (61), and the screws (69) are screwed with the ball nuts (61-7).
  8. 8. Wafer clamping mechanism for turret-type die bonding apparatus according to claim 6 or 7, wherein each of the shoulder portions (61-2) is symmetrically disposed along the outer circumferential surface of the main ring body portion (61-1) and uniformly distributed, the lifting assembly (60) comprises four guide wheels (65) and four screw shafts (69), the lifting ring (61) comprises four shoulder portions (61-2), four lug portions (61-3) and four second V-shaped rollers (61-4), the center point of the fifth driving wheel (64) and the center point of the two third guide rollers (66) form an isosceles triangle, and the center points of the four guide wheels (65) form a rectangle.
  9. 9. Wafer clamping mechanism for turret-type die bonding apparatus according to claim 6 or 7, further comprising a support ring (80), the support ring (80) being cylindrical in shape as a whole, the support ring (80) being located inside the lifting ring (61) in the radial direction, the support ring (80) being connected to the base plate (40) and the support ring (80) being not capable of lifting movement relative to the base plate (40).
  10. 10. The wafer clamping mechanism for a turret-type die bonding apparatus as recited in claim 9, further comprising a clamping assembly (70), wherein the clamping assembly (70) comprises a bottom ring body (71), a lining ring (72) and two identical semi-ring bodies (73), the bottom ring body (71) and the lining ring (72) are both in a ring shape, the two semi-ring bodies (73) are fixedly connected with the bottom ring body (71), the two semi-ring bodies (73) are symmetrically arranged, a clamping gap is arranged between the two semi-ring bodies (73) and the bottom ring body (71) along the thickness direction of the bottom ring body (71), the size of the clamping gap is matched with the size of the lining ring (72), the lining ring (72) can be inserted into or pulled out from the clamping gap, the outer edge of the bottom ring body (71) is in a wedge shape, and the outer edge of the bottom ring body (71) is clamped in a second V-shaped groove of a second V-shaped roller (61-4) of the lifting ring (61).
  11. 11. The wafer clamping mechanism for a turret-type die bonding apparatus as claimed in claim 10, wherein each half-ring body (73) includes a half-ring body portion (73-1), a first stiffener portion (73-2), and a second stiffener portion (73-3), the first stiffener portion (73-2) is located at an intermediate position of the half-ring body portion (73-1), the second stiffener portion (73-3) is located at one end of the half-ring body portion (73-1), the first stiffener portion (73-2) and the second stiffener portion (73-3) are fixedly connected to the half-ring body portion (73-1) and form a laminated structure, and inner side edges of the first stiffener portion (73-2) and the second stiffener portion (73-3) are each in a straight shape such that the inner side edges of the first stiffener portion (73-2) and the second stiffener portion (73-3) each form a straight thickness step; The first reinforcing rib part (73-2) and the second reinforcing rib part (73-3) of each semi-ring body (73) are fixedly connected with the bottom ring body (71), and the two semi-ring bodies (73) are symmetrically arranged, so that the inner edges of the first reinforcing rib parts (73-2) of the two semi-ring bodies (73) are parallel to each other, the inner edges of the second reinforcing rib parts (73-3) of the two semi-ring bodies (73) are along the same straight line, and a clamping gap is formed between the two semi-ring bodies (73) and the bottom ring body (71) along the thickness direction.
  12. 12. Wafer clamping mechanism for turret-type die bonding apparatus according to claim 11, wherein the edge of the gasket (72) is provided with a first straight edge portion (72-1), a second straight edge portion (72-2), a third straight edge portion (72-3), and a fourth straight edge portion (72-4), the first straight edge portion (72-1) and the second straight edge portion (72-2) are symmetrically arranged and parallel to each other, the third straight edge portion (72-3) and the fourth straight edge portion (72-4) are symmetrically arranged and parallel to each other, and the first straight edge portion (72-1) and the third straight edge portion (72-3) are perpendicular to each other.
  13. 13. Wafer clamping mechanism for turret-type die bonding apparatus according to claim 12, wherein the gasket (72) is inserted into a clamping gap between the two half ring bodies (73) and the bottom ring body (71), the first straight edge portion (72-1) and the second straight edge portion (72-2) of the gasket (72) are respectively abutted against inner edges of the first reinforcing rib portions (73-2) of the two half ring bodies (73), the third straight edge portion (72-3) of the gasket (72) is abutted against inner edges of the second reinforcing rib portions (73-3) of the two half ring bodies (73), and the fourth straight edge portion (72-4) is for receiving a force applied to the gasket (72) by a robot arm, the force causing the gasket (72) to be inserted into the clamping gap between the two half ring bodies (73) and the bottom ring body (71), and the gasket (72) of the clamping assembly (70) is for attaching a wafer.
  14. 14. The wafer clamping mechanism for a turret-type die bonding apparatus as claimed in claim 13, wherein two grooves (71-1) are symmetrically provided on the bottom ring body (71), and two half ring bodies (73) are respectively provided on both sides of the two grooves (71-1), the grooves (71-1) are used for a manipulator to penetrate to grasp the gasket (72), inclined surfaces (71-2) are respectively provided along the outer circumferential edge of the bottom ring body (71) and on both sides of the opening of each groove (71-1), and the inclined surfaces (71-2) play a guiding role on the manipulator for grasping the gasket (72).
  15. 15. The wafer clamping mechanism for a turret-type wafer clamping device of claim 14 further including a rotating assembly (50), the rotating assembly (50) including a rotating disk (51) and a first motor (52); the rotary disk (51) is movably arranged on the front surface of the base plate (40), and the rotary disk (51) can rotate relative to the base plate (40) under the drive of the first motor (52); The rotary disk (51) is in a circular ring shape as a whole, the rotary disk (51) comprises a ring body part (51-1), a circumferential wall part (51-2) and a flange part (51-3), the ring body part (51-1) is in a circular ring shape, the circumferential wall part (51-2) is fixedly arranged at the outer edge of the ring body part (51-1), the circumferential wall part (51-2) is perpendicular to the ring body part (51-1), teeth are fixedly arranged on the outer circumferential surface of the circumferential wall part (51-2), the extending direction of the teeth on the outer circumferential surface of the circumferential wall part (51-2) is perpendicular to the ring body part (51-1), the flange part (51-3) is fixedly arranged on the inner circumferential surface of the circumferential wall part (51-2), the flange part (51-3) protrudes inwards relative to the circumferential wall part (51-2), and the inner edge of the flange part (51-3) is in a wedge shape.
  16. 16. The wafer clamping mechanism for a turret-type die bonder as claimed in claim 15, wherein a plurality of first V-rolls (59) are fixedly arranged on the front surface of the substrate (40), each first V-roll (59) comprises a roll body (59-1) and a roll shaft (59-2), one end of the roll shaft (59-2) of each first V-roll (59) is fixedly arranged on the substrate (40) and the extending direction of the roll shaft (59-2) is perpendicular to the substrate (40), the roll body (59-1) of each first V-roll (59) is sleeved on the roll shaft (59-2) so that the roll body (59-1) of each first V-roll (59) can rotate around the roll shaft (59-2) of the first V-roll (59), a first V-groove (59-3) surrounding the roll body (59-1) is arranged on the side surface of each first V-roll (59-1), all the first V-rolls (59) are uniformly clamped along the first V-groove (59-3) of each first V-roll (59) and the flanges (59-3) are uniformly distributed along the edges of the first V-groove (59-3) of each first V-roll (59-3), so that the flange portion (51-3) of the rotating disk (51) can rotate relative to each first V-shaped roller (59) within the first V-shaped groove (59-3) of the roller body portion (59-1) of the first V-shaped roller (59).
  17. 17. The wafer clamping mechanism for a turret-type die bonding apparatus as recited in claim 16, wherein the rotating assembly (50) further includes a first drive wheel (52-1), a first drive wheel (53-1), a second drive wheel (53-2), a third drive wheel (54), a first guide roller (55), a second guide roller (56), a first endless belt (57), and a second endless belt (58); The output shaft of the first motor (52) is fixedly connected with the first driving wheel (52-1), the first driving wheel (53-1), the second driving wheel (53-2), the third driving wheel (54), the first guide roller (55) and the second guide roller (56) are all arranged on the front surface of the base plate (40), the first driving wheel (53-1) and the second driving wheel (53-2) are respectively and fixedly arranged at two ends of the same central shaft, so that the first driving wheel (53-1), the second driving wheel (53-2) and the central shaft thereof can synchronously rotate relative to the base plate (40), the central shaft of the first driving wheel (53-1) is arranged on the base plate (40), the extending direction of the central shaft of the first driving wheel (53-1) is perpendicular to the base plate (40), the central shafts of the third driving wheel (54), the first guide roller (55) and the second guide roller (56) are fixedly arranged on the base plate (40), the central shafts of the third driving wheel (54), the first guide roller (55) and the second guide roller (56) are all perpendicular to the extending directions of the central shafts of the third driving wheel (53-1) and the second guide roller (56), and the third driving wheel (55) can rotate around the third driving wheel (55) and the third guide roller (56) respectively.
  18. 18. The wafer clamping mechanism for a turret-type die bonder as claimed in claim 17, wherein the inner side surface of the first endless belt (57) is provided with teeth, and the outer circumferential surfaces of the wheel body parts of the second driving wheel (53-2) and the third driving wheel (54) are provided with teeth; The inner side surface of the first annular belt (57) surrounds most of the outer circumferential surface of the circumferential wall part (51-2) of the rotary disk (51), and teeth on the inner side surface of the first annular belt (57) can be meshed with teeth on the outer circumferential surface of the circumferential wall part (51-2) of the rotary disk (51), the inner side surface of the first annular belt (57) also surrounds part of the outer circumferential surfaces of the second transmission wheel (53-2) and the third transmission wheel (54), and teeth on the outer circumferential surfaces of the second transmission wheel (53-2) and the third transmission wheel (54) can be meshed with teeth on the inner side surface of the first annular belt (57); The outer side surface of the first annular belt (57) surrounds part of the outer circumferential surface of the second guide roller (56), one section of the first annular belt (57) wound into the second guide roller (56) forms an included angle with one section wound out of the second guide roller (56) so as to realize the steering of the first annular belt (57) at the second guide roller (56), the outer side surface of the first annular belt (57) is circumscribed with the first guide roller (55), and the first guide roller (55) plays a limiting role on the first annular belt (57); The first endless belt (57) is stretched by the rotating disc (51), the second transmission wheel (53-2), the third transmission wheel (54), the first guide roller (55), and the second guide roller (56).
  19. 19. The wafer clamping mechanism for a turret-type die bonder as claimed in claim 18, wherein the inner side surface of the second endless belt (58) is provided with teeth, and the outer circumferential surfaces of the wheel body of the first driving wheel (52-1) and the wheel body of the first driving wheel (53-1) are provided with teeth; The inner side surface of the second annular belt (58) surrounds the first driving wheel (52-1) and part of the outer circumferential surface of the first driving wheel (53-1), teeth on the inner side surface of the second annular belt (58) can be meshed with teeth on the outer circumferential surfaces of the first driving wheel (52-1) and the first driving wheel (53-1), the second annular belt (58) is stretched by the first driving wheel (52-1) and the first driving wheel (53-1), so that an output shaft of the first motor (52) can drive the first driving wheel (52-1) to rotate, and the first driving wheel (52-1) drives the first driving wheel (53-1) to rotate by means of the second annular belt (58).
  20. 20. The wafer clamping mechanism for a turret-type die bonder as recited in claim 19, wherein a section of the first endless belt (57) wound into the second drive wheel (53-2) is perpendicular to a section wound out of the second drive wheel (53-2) to effect a right angle turn of the first endless belt (57) at the second drive wheel (53-2), and a section of the first endless belt (57) wound into the third drive wheel (54) is perpendicular to a section wound out of the third drive wheel (54) to effect a right angle turn of the first endless belt (57) at the third drive wheel (54).

Description

Wafer clamping mechanism for turret-type die bonding device Technical Field The invention relates to the field of semiconductor chip processing and packaging, in particular to a wafer clamping mechanism for a turret-type die bonding device. Background The die bonder (Die bonder), also called a chip mounter, is the most critical and core equipment in the chip mounting (DIE ATTACH) step of the chip packaging test procedure. The Die bonder is used for grabbing the chip from the diced Wafer (Wafer), placing the chip on a Die attach position (Die flag) corresponding to the lead frame, and bonding the chip and the lead frame by using silver paste (Epoxy). The die bonding quality of the die bonder directly influences the yield and cost of the chip package test, and further influences links such as subsequent wire bonding. In practical application, the higher the requirement on the productivity UPH (Unit Per Hour) of the chip testing procedure in unit time, the higher the requirements on the accuracy and the speed of the die bonder for completing the chip mounting. Therefore, the die bonder is required to meet the requirements of the chip mounting precision and the speed, and can meet the requirements of market application. For turret-type die bonders, a clamping mechanism is required to fix the wafer in order to facilitate the bonding head to quickly and accurately grasp the die from the wafer. In the process of grabbing chips from a wafer by the bonding head, in order to realize that the bonding head is opposite to the position of the chip to be grabbed when each grabbing action is realized, the position of the wafer cannot be fixed, and on the contrary, the position of the wafer needs to be continuously adjusted, so that the clamping mechanism is required to realize the adjustment of the position of the wafer. However, the existing wafer clamping structures for turret-type die bonders fix the wafer in the horizontal direction, and it is difficult to adjust the wafer position during the process of picking the chips from the wafer by the bonding head. Further, the wafer carrying the chips has a certain flexibility, which causes the positions of the chips on the wafer to be not fixed and to be easily changed, and further causes the bonding head to have difficulty in quickly and accurately grabbing the chips from the wafer. For the above reasons, how to design and improve the wafer clamping mechanism for the turret-type die bonder to achieve the firm fixing and position adjustment of the flexible wafer has become a technical problem to be solved by those skilled in the art. Disclosure of Invention The invention aims to provide a wafer clamping mechanism for a turret-type die bonder, which can realize lifting movement and rotation of a wafer and can realize firm fixation of a flexible wafer in a manner of expanding the wafer. In order to solve the technical problems, the invention adopts the following technical scheme: the wafer clamping mechanism comprises a substrate and a lifting assembly, wherein the lifting assembly comprises a lifting ring and a second motor, the second motor is fixedly arranged at one end of the substrate, the lifting ring of the lifting assembly is arranged on the front surface of the substrate, and the lifting ring can lift and move relative to the substrate under the driving of the second motor. The lifting ring is in a circular ring shape, and comprises a main ring body part, a plurality of shoulder parts, a plurality of lug parts and a plurality of second V-shaped rollers, wherein all the shoulder parts are fixedly arranged on the outer circumferential surface of the main ring body part and protrude outwards in the radial direction relative to the main ring body part, one lug part is fixedly arranged on the outer side surface of each shoulder part and protrudes outwards relative to the shoulder part, one U-shaped groove is formed in the end surface of one end, far away from the base plate, of each shoulder part, one second V-shaped roller is arranged in each U-shaped groove, and one second V-shaped groove surrounding the periphery of the roller body part is formed in the side surface of the roller body part of each second V-shaped roller. Further preferably, the lifting assembly further comprises a second driving wheel, a fourth driving wheel, a fifth driving wheel, a plurality of guide wheels, two third guide rollers, a third annular belt, a fourth annular belt and a plurality of lead screws, wherein the number of the guide wheels is the same as that of the lead screws. Further preferably, the output shaft of the second motor is fixedly connected with the second driving wheel, the fourth driving wheel is arranged on the front surface of the substrate, the fifth driving wheel is arranged on the back surface of the substrate, the fourth driving wheel and the fifth driving wheel are respectively and fixedly arranged at two ends of the same central shaft, so that the fourth driving wheel, th