CN-118588841-B - LED display screen packaging method

CN118588841BCN 118588841 BCN118588841 BCN 118588841BCN-118588841-B

Abstract

The invention provides a packaging method of an LED display screen, which comprises the steps of forming a first packaging adhesive layer and a second packaging adhesive layer on a lamp panel, wherein the first packaging adhesive layer is formed on the lamp panel by being heated to soften and then being pressed down into a gap space among a plurality of lamp beads filled on the lamp panel, the thickness of the first packaging adhesive layer above the top surface of the lamp beads is 0-10um, the second packaging adhesive layer is positioned on one side of the first packaging adhesive layer, which is far away from the lamp panel, and covers the lamp beads, the first packaging adhesive layer can shield light, and the second packaging adhesive layer can transmit light rays emitted by the lamp beads. The LED display screen packaging method reduces the process difficulty and the manufacturing cost, improves the consistency of the black matrix effect, improves the light emitting efficiency of the LED display screen, and reduces the power consumption of the LED display screen.

Inventors

ZHANG QI
XIAO ZHOU
CHEN YIJI
XU MENGMENG
SHI CHANGJIN
Ding Chongbin

Assignees

深圳市艾比森光电股份有限公司
惠州市艾比森光电有限公司

Dates

Publication Date: 20260505
Application Date: 20240620

Claims (2)

1. The LED display screen packaging method is characterized by comprising the following steps of: Forming a first packaging adhesive layer and a second packaging adhesive layer on a lamp panel, wherein the first packaging adhesive layer is formed on the lamp panel by being heated to soften and then being pressed down into a gap space among a plurality of lamp beads filled on the lamp panel, the thickness of the first packaging adhesive layer above the top surface of the lamp beads is 0-10um, the second packaging adhesive layer is positioned on one side of the first packaging adhesive layer, which is far away from the lamp panel, and covers the lamp beads, the first packaging adhesive layer can shield light, and the second packaging adhesive layer can transmit light emitted by the lamp beads; the forming the first packaging adhesive layer and the second packaging adhesive layer on the lamp panel comprises: Firstly, the first packaging adhesive layer is pressed down to the lamp panel, and then the second packaging adhesive layer is pressed down to the first packaging adhesive layer; wherein, first forming the first encapsulation adhesive layer on the lamp panel includes: The method comprises the steps of heating a first adhesive film to soften the first packaging adhesive layer, wherein the first adhesive film comprises the first packaging adhesive layer and a buffer adhesive layer formed on the first packaging adhesive layer, the buffer adhesive layer is an elastic functional layer made of silica gel or rubber, the thickness of the buffer adhesive layer is 2-3 times of that of the first packaging adhesive layer, the Shore A hardness of the buffer adhesive layer is smaller than 60HA, the adhesion force between the buffer adhesive layer and the first packaging adhesive layer is smaller than a preset force value, the preset force value is 100kgf, so that the first packaging adhesive layer is pierced in the pressing process of the buffer adhesive layer, and in the pressing process of the buffer adhesive layer, the part of the buffer adhesive layer corresponding to a gap space between two adjacent lamp beads protrudes towards the gap space through self elastic deformation, so that the first packaging adhesive layer in the gap space forms a cambered surface with a concave middle part on the upper surface under the pressing of the buffer adhesive layer, wherein the adhesion force between the buffer adhesive layer and the top surface of the first packaging adhesive layer in the gap space is parallel to the side of the lamp beads; The first packaging adhesive layer of the first adhesive film faces the lamp beads and presses down the buffer adhesive layer until the first adhesive film is pressed down until the first packaging adhesive layer fills the gap space and avoids the top surfaces of the lamp beads; Solidifying the first packaging adhesive layer; Tearing off the buffer adhesive layer; Or alternatively The forming the first packaging adhesive layer and the second packaging adhesive layer on the lamp panel comprises: Pressing the first packaging adhesive layer and the second packaging adhesive layer which are stacked to the lamp panel, wherein the material of the first packaging adhesive layer is the same as that of the second packaging adhesive layer; The pressing the first packaging adhesive layer and the second packaging adhesive layer which are stacked and arranged down onto the lamp panel comprises pressing a third adhesive film down onto the lamp panel, wherein the third adhesive film comprises the first packaging adhesive layer, the second packaging adhesive layer and a second release film layer which are stacked and arranged, the thickness of the first packaging adhesive layer is greater than or equal to 10um, and the total thickness of the first packaging adhesive layer and the second packaging adhesive layer is 1.2-1.5 times of the front break difference of the lamp beads and the base plates of the lamp panel; Heating the third adhesive film until the first packaging adhesive layer is softened, the softening degree of the first packaging adhesive layer is larger than that of the second packaging adhesive layer, then enabling the first packaging adhesive layer of the third adhesive film to face the lamp beads, pressing down the second release film layer until the third adhesive film is pressed down until the first packaging adhesive layer fills the gap, the thickness of the first packaging adhesive layer above the top surface of the lamp beads is smaller than 10um, then conducting curing on the third adhesive film, and finally tearing off the second release film layer; Heating the third adhesive film to soften the first packaging adhesive layer comprises heating the lamp panel, and after the surface of the lamp panel reaches a preset temperature, pressing the third adhesive film down to attach the first packaging adhesive layer to the lamp beads until the first packaging adhesive layer is softened by absorbing heat of the lamp beads, wherein the softening degree of the first packaging adhesive layer is greater than that of the second packaging adhesive layer, so that the first packaging adhesive layer and the second packaging adhesive layer are prevented from being fused.
2. The method of claim 1, wherein the forming the second encapsulation layer on the first encapsulation layer further comprises, Heating a second adhesive film to soften the second packaging adhesive layer, wherein the second adhesive film comprises a second packaging adhesive layer and a first heavy release film layer which are stacked; The second packaging adhesive layer of the second adhesive film faces the lamp beads, and the first heavy release film layer is pressed down until the second adhesive film is pressed down to be attached to the upper surface of the second packaging adhesive layer, the upper surface of the first packaging adhesive layer and the top surface of the lamp beads; solidifying the second packaging adhesive layer; And tearing off the first heavy release film layer.

Description

LED display screen packaging method Technical Field The invention belongs to the technical field of LED display screens, and particularly relates to an LED display screen packaging method. Background The LED (LIGHT EMITTING Diode) display screen has the characteristics of high brightness, bright color, high luminous efficiency, high contrast ratio, short response time, wide working temperature range, low energy consumption and the like, and is widely applied to stage display equipment, advertisement display equipment, data visualization display equipment and commercial display equipment. The LED display screen comprises a plurality of independent boxes which are connected in sequence and are formed by splicing a plurality of lamp panels, each lamp panel comprises a PCB (Printed Circuit Board, a printed circuit board) and a plurality of independent LED lamp beads arranged on the PCB, and the special structure enables the LED display screen to be flexibly applied under various use scenes and has the obvious advantage of high display integrity. In recent years, micro LED display screens adopting COB (Chip on Board) and MIP (Mini/Micro LED IN PACKAGE, aiming at the packaging technology of Mini LEDs and Micro LEDs) are emerging in the industry, and the light beads on the Micro LED display screens are Chip-level LED pixel particles, so that the Micro LED display screens firstly bond a plurality of the Chip-level LED pixel particles on a PCB (printed circuit Board) and then directly package the whole light Board, and compared with the traditional SMD LED display screens, the Micro LED display screens have shorter process chains and are easier to realize ultra-small spacing. Meanwhile, new technical difficulties are generated, besides the complex molding and packaging process and high cost, as the LED pixel particles of the Micro LED display screen are smaller, most area of the PCB is solder resist ink, and the PCB solder resist ink has inter-plate color difference, so that the Micro LED display screen has serious problem of inconsistent ground color effect. Disclosure of Invention The invention aims to provide an LED display screen packaging method, which aims to solve the technical problems of complex process, higher cost and poor consistency of ground color effects in the prior related art. In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: the LED display screen packaging method comprises the following steps: The lamp panel comprises a lamp panel body, a first packaging adhesive layer and a second packaging adhesive layer, wherein the first packaging adhesive layer is formed on the lamp panel body by being heated to be softened and then being pressed down to be filled in a gap space among a plurality of lamp beads on the lamp panel body, the thickness of the first packaging adhesive layer above the top surface of the lamp beads is 0-10um, the second packaging adhesive layer is located on one side, deviating from the lamp panel body, of the first packaging adhesive layer and covers the lamp beads, the first packaging adhesive layer can shield light, and the second packaging adhesive layer can be used for transmitting light rays emitted by the lamp beads. As one embodiment, the forming the first and second encapsulation layers on the lamp panel includes, The first packaging adhesive layer is firstly pressed down to the lamp panel, and then the second packaging adhesive layer is pressed down to the first packaging adhesive layer. As one embodiment, the first encapsulating adhesive layer is formed on the lamp panel first includes, Heating a first adhesive film to soften the first packaging adhesive layer, wherein the first adhesive film comprises the first packaging adhesive layer and a buffer adhesive layer formed on the first packaging adhesive layer, and the adhesion force between the buffer adhesive layer and the first packaging adhesive layer is smaller than a preset force value; The first packaging adhesive layer of the first adhesive film faces the lamp beads and presses down the buffer adhesive layer until the first adhesive film is pressed down until the first packaging adhesive layer fills the gap space and avoids the top surfaces of the lamp beads; Solidifying the first packaging adhesive layer; and tearing off the buffer adhesive layer. As one embodiment, the thickness of the buffer glue layer is 2-3 times that of the first packaging glue layer, and the shore a hardness of the buffer glue layer is less than 60HA. As one embodiment, the forming the second encapsulation adhesive layer on the first encapsulation adhesive layer further includes, Heating a second adhesive film to soften the second packaging adhesive layer, wherein the second adhesive film comprises a second packaging adhesive layer and a first heavy release film layer which are stacked; The second packaging adhesive layer of the second adhesive film faces the lamp beads, and the first heavy re