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CN-118769123-B - Grinding equipment

CN118769123BCN 118769123 BCN118769123 BCN 118769123BCN-118769123-B

Abstract

The disclosure provides grinding equipment, which comprises a lower fixed disk, a transfer recovery unit and a negative pressure generating unit, wherein the lower fixed disk comprises a working disk surface and a bottom surface which are oppositely arranged, flow guide grooves which are in net distribution are arranged on the working disk surface, flow guide holes penetrating through the working disk surface and the bottom surface are formed in a plurality of groove crossing nodes of the flow guide grooves, the transfer recovery unit comprises a transfer member with a cavity and a recovery container, the flow guide holes are communicated to the cavity of the transfer member, the cavity of the recovery container is communicated to the cavity of the transfer member, and the negative pressure generating unit is communicated with the recovery container and is used for providing a negative pressure environment for the inner cavity of the recovery container so that residues in the flow guide grooves flow into the cavity of the transfer member through the flow guide holes. The utility model provides a grinding device can effectively clean the grinding disc surface, promotes the grinding product quality.

Inventors

  • DONG JIAJIA
  • GUO HONGYAN
  • SUN JIENAN
  • CHEN XIPENG
  • ZHAO JING

Assignees

  • 西安奕斯伟材料科技股份有限公司
  • 西安奕斯伟硅片技术有限公司

Dates

Publication Date
20260505
Application Date
20240814

Claims (6)

  1. 1. A grinding apparatus, comprising: The lower fixed disc comprises a working disc surface and a bottom surface which are arranged in a back-to-back manner, wherein the working disc surface is provided with diversion grooves distributed in a net shape, and diversion holes penetrating through the working disc surface and the bottom surface are formed at a plurality of groove crossing nodes of the diversion grooves; A transfer recovery unit comprising a transfer member provided with a chamber and a recovery container, wherein the diversion hole is communicated with the chamber of the transfer member, the chamber of the recovery container is communicated with the chamber of the transfer member, and The negative pressure generating unit is communicated with the recovery container and is used for providing a negative pressure environment for the inner cavity of the recovery container so that residues in the diversion trench flow into the cavity of the transfer member through the diversion hole; The transfer recovery unit further comprises a transfer wheel disc and a plurality of connecting pipes, wherein the transfer wheel disc is located below the bottom surface and can rotate synchronously with the lower fixed disc, through holes penetrating through two opposite axial surfaces of the transfer wheel disc are formed in the transfer wheel disc, the through holes are in one-to-one correspondence with the diversion holes and are connected through the corresponding connecting pipes, the transfer wheel disc is rotatable relative to the transfer member, a cavity of the transfer member is located below the transfer wheel disc, an opening is formed in the top of the cavity of the transfer member so as to accommodate all residues flowing out of the through holes, the transfer member comprises a main body and a rotating assembly, the main body is arranged between the transfer wheel disc and the main body so that the transfer wheel disc can rotate relative to the main body, the cavity of the transfer member is hollow in the main body, the opening of the cavity is in butt joint with the bottom of the transfer wheel disc so that the cavity is communicated with all the through holes, the main body is located below the transfer wheel disc, the opening is located at the periphery of the transfer member, the extending part is located at the periphery of the transfer wheel disc, the extending part is located at the extending part and the extending part is located between the extending part and the bearing part.
  2. 2. The grinding apparatus defined in claim 1 wherein the deflector groove includes a plurality of groove intersection nodes distributed in an array, the deflector hole being located at spaced apart groove intersection nodes.
  3. 3. The polishing apparatus according to claim 1, wherein among a plurality of groove crossing nodes distributed in an array, one of the guide holes is provided at every other one of the groove crossing nodes in the same row, and one of the guide holes is provided at every other one of the groove crossing nodes in the same column.
  4. 4. The grinding apparatus defined in claim 1 wherein the orifice diameter of the deflector hole tapers in a direction from the work surface toward the bottom surface.
  5. 5. The grinding apparatus defined in claim 1, wherein the pilot hole has an inner diameter greater than a width of the pilot groove.
  6. 6. The grinding apparatus defined in claim 1, wherein the grinding apparatus further comprises: a main shaft on which the lower stator and the conversion wheel disc are coaxially mounted; the sun gear is positioned above the working disc surface and is arranged on the main shaft; The annular internal gear is arranged along the circumferential direction of the working disc surface and is provided with a gap with the sun gear; the planetary gear is positioned above the working disc surface, positioned in the gap and meshed with the sun gear and the annular internal gear; and the bearing disc is positioned on the planetary gear.

Description

Grinding equipment Technical Field The invention relates to the technical field of semiconductor processing, in particular to grinding equipment. Background In the field of semiconductor wafer fabrication, silicon wafers (wafer) are the most commonly used semiconductor materials, which are the most costly materials that are essential in the chip manufacturing process. In the case of rapid developments in chip technology, photovoltaic technology, etc. today, the demand for silicon wafers has increased dramatically. Lapping (LAP) is an important process step in the manufacture of silicon wafers, and is aimed at providing a planar surface of a silicon wafer with a certain geometric dimensional accuracy, and at the same time, removing a mechanical stress damage layer generated by dicing from the surface of the silicon wafer during dicing. The double-sided grinding is to place the cut silicon wafer between an upper grinding fixed disk and a lower grinding fixed disk, and the purposes of rough machining and thinning of the surface of the silicon wafer are achieved under the action of grinding liquid and pressure in the rotating process of the grinding fixed disk. However, during the polishing process, polishing waste such as Slurry (Slurry) residues may remain in the guide grooves of the lower surface plate of the polishing apparatus, and the residence time is too long, the Slurry is coagulated, and the fluidity is reduced, which may cause the guide grooves to be blocked, thereby causing polishing fragments, deterioration of flatness, and deterioration of wafer quality. At present, the flow guide groove is cleaned by scraping the solidified residues by a blade after finishing grinding. Because the cleaning process is carried out after the grinding is finished, the cleaning is not timely, residues are coagulated, time and labor are wasted when the blade is used for cleaning, the residues are not easy to clean, and the cleaning effect is not ideal. Disclosure of Invention The embodiment of the disclosure provides grinding equipment, which can effectively clean a grinding disc surface and improve the quality of grinding products. The technical scheme provided by the embodiment of the disclosure is as follows: a grinding apparatus comprising: The lower fixed disc comprises a working disc surface and a bottom surface which are arranged in a back-to-back manner, wherein the working disc surface is provided with diversion grooves distributed in a net shape, and diversion holes penetrating through the working disc surface and the bottom surface are formed at a plurality of groove crossing nodes of the diversion grooves; the transfer recovery unit comprises a transfer member provided with a cavity and a recovery container, wherein the diversion hole is communicated with the cavity of the transfer member, and the cavity of the recovery container is communicated with the cavity of the transfer member; and the negative pressure generating unit is communicated with the recovery container and is used for providing a negative pressure environment for the inner cavity of the recovery container so that residues in the diversion trench flow into the cavity of the transfer member through the diversion holes. The transfer recovery unit further comprises a transfer wheel disc and a plurality of connecting pipes, wherein the transfer wheel disc is located below the bottom surface and can rotate synchronously with the lower fixed disc, through holes penetrating through two axially opposite sides of the transfer wheel disc are formed in the transfer wheel disc, the through holes are in one-to-one correspondence with the diversion holes and are connected through the corresponding connecting pipes, the transfer wheel disc can rotate relative to the transfer member, a cavity of the transfer member is located below the transfer wheel disc, and openings are formed in the top of the cavity of the transfer member to contain residues flowing out of all the through holes. The transfer member illustratively includes a body that is adapted to the shape of the transfer disc, the body being hollow inside to form a chamber of the transfer member, an opening of the chamber interfacing with a bottom of the transfer disc to communicate the chamber with all of the through-holes. The transfer member further comprises a rotating assembly, wherein the rotating assembly is arranged between the conversion wheel disc and the main body, so that the conversion wheel disc can rotate relative to the main body. Illustratively, the body extends upwardly at the open edge of the chamber to form an extension that is located on the peripheral side of the conversion disk, and the rotating assembly includes a bearing assembly located between the conversion disk and the extension. Illustratively, the flow directing grooves include a plurality of groove crossing nodes distributed in an array, the flow directing holes being located at spaced apart groove crossing nodes. In t