CN-118824967-B - Intelligent power module, manufacturing method thereof, controller and household appliance

Abstract

The invention discloses an intelligent power module, a manufacturing method thereof, a controller and a household appliance, and relates to the technical field of semiconductors. The invention comprises a ceramic substrate, a copper frame and a power chip, wherein the ceramic substrate is provided with a mounting cavity, and the copper frame is embedded in the mounting cavity. The power chip is arranged on the copper frame, and heat generated by the power chip is transmitted to the ceramic substrate through the copper frame and then is emitted outwards through the ceramic substrate. Therefore, the ceramic substrate is added, so that the heat of the chip transferred to the copper frame can be transferred along the four sides of the copper frame besides being transferred along the bottom of the copper frame, and the heat dissipation efficiency of the intelligent power module is improved.

Inventors

• WU HAOLIN
• LIU LEIREN
• LIAO YONGBO
• LI CHUNYAN

Assignees

• 珠海格力电器股份有限公司

Dates

Publication Date

20260508

Application Date

20240624

Claims (13)

1. 1. An intelligent power module, the intelligent power module comprising: a ceramic substrate (1), wherein a mounting cavity (101) is formed on the ceramic substrate (1); The copper frame (2) is embedded in the mounting cavity (101); the power chip (3), power chip (3) install in on copper frame (2), the heat that power chip (3) produced passes through copper frame (2) are passed through after ceramic substrate (1), rethread ceramic substrate (1) outwards gives off.
2. 2. The intelligent power module according to claim 1, wherein the ceramic substrate (1) is further provided with a plurality of connection holes (102), and the connection holes (102) are communicated with the mounting cavity (101) and penetrate through the ceramic substrate (1), so that a part of the copper frame (2) penetrates through the ceramic substrate (1) to form a plurality of connection ports (4).
3. 3. The intelligent power module according to claim 1, further comprising a plastic package body (5), wherein the plastic package body (5) is covered on the ceramic substrate (1) and wraps the copper frame (2) and the power chip (3), and heat generated by the power chip (3) is emitted outwards through the plastic package body (5).
4. 4. A smart power module according to claim 3, characterized in that an extension (11) is provided on the ceramic substrate (1), wherein the extension (11) is embedded in the plastic package (5).
5. 5. A method of manufacturing an intelligent power module, the method comprising: Providing a ceramic substrate (1), wherein a mounting cavity (101) is formed in the ceramic substrate (1), and a copper foil is placed in the mounting cavity (101) and heated so as to melt the copper foil and fill the mounting cavity (101) to form a copper frame (2); Providing at least one power chip (3), mounting the power chip (3) on the copper frame (2), and performing wire bonding on the power chip (3) to obtain a module body, so that heat generated by the power chip (3) is transmitted to the ceramic substrate (1) through the copper frame (2) and then is emitted outwards through the ceramic substrate (1); Adopt plastic envelope material to mould plastics the module body to form cover in plastic envelope body (5) on ceramic substrate (1), and obtain intelligent power module, wherein, plastic envelope body (5) are right copper frame (2) and power chip (3) form the parcel, the heat that power chip (3) produced is through plastic envelope body (5) is outwards given off.
6. 6. The method of manufacturing a smart power module according to claim 5, further comprising a substrate manufacturing step of a ceramic substrate (1), the substrate manufacturing step comprising: providing ceramic slurry, coating the ceramic slurry on a selective light-transmitting film platform (8), and pressing down a sample stage (7) to expose the ceramic slurry so that the solidified ceramic slurry is adhered to the sample stage (7) to obtain a layer of substrate green compact; Repeatedly coating the ceramic slurry on the selective light-transmitting film platform (8), and pressing down the sample platform (7) to expose the ceramic slurry after each ceramic slurry coating so as to enable the cured ceramic slurry to adhere to the cured substrate green body on the sample platform (7) to obtain a multilayer substrate green body (9); Calcining the green multilayer substrate (9), and sintering the calcined green multilayer substrate (9) to obtain the ceramic substrate (1).
7. 7. The method of manufacturing a smart power module as recited in claim 6, wherein the substrate manufacturing step further comprises: Mixing absolute ethyl alcohol, alumina ceramic powder and photosensitive resin to obtain the ceramic slurry.
8. 8. The method of manufacturing an intelligent power module according to claim 7, wherein the firing of the green multi-layered substrate (9) and the sintering of the green multi-layered substrate (9) after firing to obtain the ceramic substrate (1) comprises: According to a first temperature control strategy, low-temperature calcination is carried out on the multi-layer substrate green body (9) to remove photosensitive resin in the multi-layer substrate green body (9), wherein the temperature of low-temperature calcination is not more than 650 ℃; And (3) sintering the calcined green multilayer substrate (9) at a high temperature according to a second temperature control strategy to obtain the ceramic substrate (1), wherein the temperature of the high-temperature sintering is not lower than 800 ℃.
9. 9. The method of manufacturing a smart power module according to claim 8, wherein low temperature firing the green multilayer substrate (9) according to a first temperature control strategy comprises: heating the green multilayer substrate (9) to a first temperature interval at a first heating rate and maintaining the temperature at a first time; Heating the multi-layer substrate green body (9) with the heat preservation time reaching the first time according to the first heating rate to a second temperature interval, and preserving heat according to the second time; Heating the multi-layer substrate green body (9) with the heat preservation time reaching the second time according to the first heating rate to a third temperature interval, and preserving heat according to the third time; And cooling the multi-layer substrate green compact (9) with the heat preservation time reaching the third time according to the first cooling rate to the second temperature interval.
10. 10. The method of manufacturing a smart power module according to claim 8, wherein the high temperature sintering of the green multi-layered substrate (9) after firing according to the second temperature control strategy comprises: Heating the calcined green multilayer substrate (9) to a fourth temperature interval at a second heating rate; Heating the green multilayer substrate heated to the fourth temperature interval according to the third heating rate, continuing to heat the green multilayer substrate to the fifth temperature interval, and preserving heat according to the fourth time length; and cooling the multi-layer substrate green compact (9) with the heat preservation time reaching the fourth time according to the second cooling rate to the fourth temperature interval, and then cooling.
11. 11. The method of manufacturing a smart power module as recited in claim 5, wherein after the copper foil is placed in the mounting cavity (101) and heated, the method further comprises: And cooling the heated copper foil, and polishing the cooled copper foil to obtain the copper frame (2) which is flush with the ceramic substrate (1).
12. 12. A controller, characterized in that the controller comprises an intelligent power module according to any of claims 1-4.
13. 13. A household appliance is characterized in that, the household appliance comprises the controller of claim 12.

Description

Intelligent power module, manufacturing method thereof, controller and household appliance Technical Field The present invention relates to the field of semiconductor technologies, and in particular, to an intelligent power module, a manufacturing method thereof, a controller, and a household appliance. Background The intelligent power module (IPM, INTELLIGENT POWER MODULE) is a power switching device, in which an IGBT (Insulated Gate Bipolar Transistor ) module is integrated, and is widely used in the context of controlling and driving high-power electronic devices. For example, the high power electronics may include, but are not limited to, ac motor drives, frequency converters, inverters, and the like. The IPM module may be controlled to switch at a very high switching frequency during operation, resulting in a fast temperature rise of the IPM module during operation. Only if the working temperature of the IPM module is controlled within a reasonable range, the normal working and the stable operation of the IPM module can be ensured. At present, an IPM module generally adopts a combined structure of a copper frame and a plastic package material, namely, the copper frame is wrapped by the plastic package material to realize electrical insulation, and heat generated by a chip of the IPM module is transmitted to the outside through the copper frame. However, the plastic package material is mostly made of epoxy resin, so that the heat conductivity is low, and the heat dissipation performance of the power module is limited. Disclosure of Invention The present invention has been made in view of the above problems, and provides an intelligent power module, a method of manufacturing the same, a controller, and a home appliance, which overcome or at least partially solve the above problems. Based on a first aspect of the present invention, there is provided an intelligent power module comprising: the ceramic substrate is provided with an installation cavity; The copper frame is embedded in the mounting cavity; And the power chip is arranged on the copper frame, and heat generated by the power chip is transmitted to the ceramic substrate through the copper frame and then is emitted outwards through the ceramic substrate. In an optional summary, the ceramic substrate is further provided with a plurality of connection holes, and the connection holes are communicated with the mounting cavity and penetrate through the ceramic substrate, so that a part of the copper frame penetrates through the ceramic substrate to form a plurality of connection ports. In an optional summary, the intelligent power module further includes a plastic package body, the plastic package body covers the ceramic substrate, and wraps the copper frame and the power chip, and heat generated by the power chip is dissipated outwards through the plastic package body. In an optional summary, an extension portion is disposed on the ceramic substrate, where the extension portion is embedded in the plastic package body. Based on the second aspect of the invention, there is also provided a method for manufacturing an intelligent power module, the method comprising: Providing a ceramic substrate, wherein a mounting cavity is formed in the ceramic substrate, and a copper foil is placed in the mounting cavity and heated so as to be melted and filled in the mounting cavity to form a copper frame; providing at least one power chip, mounting the power chip on the copper frame, and performing wire bonding on the power chip to obtain a module body, so that heat generated by the power chip is transmitted to the ceramic substrate through the copper frame and then is emitted outwards through the ceramic substrate; and carrying out injection molding on the module body by adopting a plastic package material to form a plastic package body covered on the ceramic substrate and obtain the intelligent power module, wherein the plastic package body wraps the copper frame and the power chip, and heat generated by the power chip is emitted outwards through the plastic package body. In an optional summary, the manufacturing method further includes a substrate manufacturing step of the ceramic substrate, where the substrate manufacturing step includes: Providing ceramic slurry, coating the ceramic slurry on a selective light-transmitting film platform, and pressing down a sample platform to expose the ceramic slurry so that the solidified ceramic slurry is adhered to the sample platform to obtain a layer of substrate green compact; Repeatedly coating the ceramic slurry on the selective light-transmitting film platform, and pressing down the sample stage to expose the ceramic slurry after each ceramic slurry coating so as to enable the cured ceramic slurry to adhere to the cured substrate green body on the sample stage, thereby obtaining a multilayer substrate green body; calcining the green multilayer substrate, and sintering the calcined green multilayer substrate to obtain t