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CN-119076426-B - Sorting and matching method for silicon wafers

CN119076426BCN 119076426 BCN119076426 BCN 119076426BCN-119076426-B

Abstract

The application provides a sorting and matching method of silicon chips, which comprises the steps of carrying out product investigation on a client to collect process data, uploading the process data to an MES system for sorting and analyzing to obtain a judging value sum of clients, wherein the judging value sum is smaller than or equal to a set standard value, namely marked as a low-resistivity client, the judging value sum is larger than the set standard value, namely marked as a high-resistivity client, a sorting machine sorts the silicon chips with the resistivity of a or more and X or less into low-resistivity products, and sorts the silicon chips with the resistivity of X or less than or equal to b into high-resistivity products, wherein b is larger than a, the low-resistivity products are used for being matched and sent to the low-resistivity client, and the high-resistivity products are used for being matched and sent to the high-resistivity client. The method provided by the application is beneficial to improving the distribution concentration of the resistivity of the target silicon wafers in the same batch and improving the matching accuracy of the resistivity of the silicon wafers and the resistivity required by customers so as to improve the delivery quality of products.

Inventors

  • WANG XIN
  • MEI JUN
  • GAO PENG
  • FU MINGQUAN
  • CHEN DAN

Assignees

  • 高景太阳能股份有限公司
  • 广东金湾高景太阳能科技有限公司

Dates

Publication Date
20260512
Application Date
20240715

Claims (6)

  1. 1. The sorting and matching method for the silicon wafers is characterized by comprising the following steps of: product investigation is conducted on the client side to collect process data; uploading the processing data to an MES system for sorting and analyzing to obtain a judging value sum of clients, wherein the judging value sum is smaller than or equal to a set standard value, namely, the clients are marked as low-resistivity clients, and the judging value sum is larger than the set standard value, namely, the clients are marked as high-resistivity clients; the sorter sorts the silicon wafers with the resistivity greater than or equal to a and less than or equal to X into low-resistivity products, and sorts the silicon wafers with the resistivity greater than X and less than or equal to b into high-resistivity products, wherein b is greater than a, the low-resistivity products are used for matching and sending to the low-resistivity clients, and the high-resistivity products are used for matching and sending to the high-resistivity clients.
  2. 2. The method of claim 1, wherein the process data comprises a front diffusion temperature, a front diffusion time, a back diffusion temperature, a back diffusion time, a front main gate number, a front fine gate number, a back main gate number, a back fine gate number, and a sheet resistance value; the step of deriving the decision value sum includes: setting standard values of various parameters of the process data in the MES system; The MES system compares the input parameter value of the process data with the corresponding standard value, if the input parameter value of the process data is smaller than the standard value, the judgment value is 0, if the input parameter value of the process data is equal to the standard value, the judgment value is 0.5, and if the input parameter value of the process data is larger than the standard value, the judgment value is 1; And adding the judgment values of all the parameters to obtain the sum of the judgment values.
  3. 3. The method of sorting and matching silicon wafers according to claim 2, wherein the set standard value is 4.5.
  4. 4. The method of sorting and matching silicon wafers according to claim 3, wherein the standard value of the front diffusion temperature is 850 ℃, the standard value of the front diffusion time is 100 seconds, the standard value of the back diffusion temperature is 1045 ℃, and the standard value of the back diffusion time is 160 seconds.
  5. 5. The method of sorting and matching silicon wafers according to claim 4, wherein the standard value of the number of front side main grids is 16pcs, the standard value of the number of front side fine grids is 150pcs, the standard value of the number of back side main grids is 16pcs, and the standard value of the number of back side fine grids is 160pcs.
  6. 6. The method for sorting and matching silicon wafers according to claim 5, wherein the standard value of the sheet resistance value is 110 Ω/sq.

Description

Sorting and matching method for silicon wafers Technical Field The invention relates to the technical field of silicon wafer split charging, in particular to a silicon wafer sorting and matching method. Background At present, a silicon wafer is detected by an AOI (automatic optical inspection) device to judge whether the silicon wafer is qualified or not, namely, the silicon wafer is sorted, packaged and shipped to a customer, but the resistivity of the silicon wafer cannot be accurately matched with the required resistivity of the customer due to the mode, so that the quality of the shipped product cannot be ensured. In addition, the existing sorting mode leads to a wide distribution range of the resistivity of the silicon wafers in the same batch, so that the number of the silicon wafers meeting the processing requirement is reduced in proportion, and the subsequent processing yield of the silicon wafers in the same batch is reduced. Disclosure of Invention In order to overcome the defects of the prior art, the invention aims to provide a silicon wafer sorting and matching method which is beneficial to narrowing the distribution range of the resistivity of the target silicon wafers in the same batch, further beneficial to improving the concentration of the resistivity distribution of the target silicon wafers in the same batch so as to assist in improving the subsequent processing yield of the silicon wafers, and is beneficial to improving the matching accuracy of the resistivity of the silicon wafers and the required resistivity of customers, and further beneficial to improving the shipping quality of products. In order to solve the problems, the technical scheme adopted by the invention is as follows: a sorting and matching method of silicon wafers comprises the following steps: product investigation is conducted on the client side to collect process data; uploading the processing data to an MES system for sorting and analyzing to obtain a judging value sum of clients, wherein the judging value sum is smaller than or equal to a set standard value, namely, the clients are marked as low-resistivity clients, and the judging value sum is larger than the set standard value, namely, the clients are marked as high-resistivity clients; the sorter sorts the silicon wafers with the resistivity greater than or equal to a and less than or equal to X into low-resistivity products, and sorts the silicon wafers with the resistivity greater than X and less than or equal to b into high-resistivity products, wherein b is greater than a, the low-resistivity products are used for matching and sending to the low-resistivity clients, and the high-resistivity products are used for matching and sending to the high-resistivity clients. In some possible embodiments, the process data includes a front diffusion temperature, a front diffusion time, a back diffusion temperature, a back diffusion time, a front main gate number, a front fine gate number, a back main gate number, a back fine gate number, and a sheet resistance value; the step of deriving the decision value sum includes: setting standard values of various parameters of the process data in the MES system; The MES system compares the input parameter value of the process data with the corresponding standard value, if the input parameter value of the process data is smaller than the standard value, the judgment value is 0, if the input parameter value of the process data is equal to the standard value, the judgment value is 0.5, and if the input parameter value of the process data is larger than the standard value, the judgment value is 1; And adding the judgment values of all the parameters to obtain the sum of the judgment values. In some possible embodiments, the set standard value is 4.5. In some possible embodiments, the standard value of the front diffusion temperature is 850 ℃, the standard value of the front diffusion time is 100 seconds, the standard value of the rear diffusion temperature is 1045 ℃, and the standard value of the rear diffusion time is 160 seconds. In some possible embodiments, the standard value of the front number of main gratings is 16pcs, the standard value of the front number of fine gratings is 150pcs, the standard value of the back number of main gratings is 16pcs, and the standard value of the back number of fine gratings is 160pcs. In some possible embodiments, the standard value of the sheet resistance value is 110Ω/sq. Compared with the prior art, the invention has the beneficial effects that: In the application, the process data of the target clients are collected in the early stage and uploaded to the MES system for sorting analysis to divide the clients into low-resistivity clients and high-resistivity clients, in addition, the sorting method of the existing sorting machine is changed, and the distribution range of the resistivity of the target silicon wafers in the same batch is narrowed by adopting a sectional screening mode, so tha