CN-119208315-B - Three-dimensional interconnection structure for microwave module metal packaging and manufacturing method

CN119208315BCN 119208315 BCN119208315 BCN 119208315BCN-119208315-B

Abstract

The invention provides a method for manufacturing a three-dimensional interconnection structure for microwave module metal packaging, which comprises a module shell, an upper cover plate, a lower cover plate, a base plate, bolts and nuts. Wherein, multilayer base plate stacks the place in the module on the vertical direction, through boss overlap joint support on the casing inside wall, and the base plate edge is opened there is the counter bore, coaxial with the through-hole on the boss, utilizes outer hexagon bolt and nut to run through upper and lower base plate two sides, fixes two layers of base plates in the cavity. The inner structure of the outer hexagonal bolt is composed of a signal connection metal column, an insulating ceramic ring and a shell metal layer from inside to outside, and the outer hexagonal bolt not only plays a role in fixing an upper substrate and a lower substrate, but also forms a signal transmission path for interconnecting the double-layer substrates in the three-dimensional vertical direction. The shell, the upper cover plate, the lower cover plate, the inner base plate and the outer hexagon bolts form an airtight packaging module with devices and bare chips.

Inventors

YANG NINGNING
WEI MENG
TIAN YING
HU GUANGTAO
LI QI

Assignees

四川航天电子设备研究所

Dates

Publication Date: 20260512
Application Date: 20240911

Claims (10)

1. The three-dimensional interconnection structure for the microwave module metal package is characterized by comprising a shell, an upper cover plate, a lower cover plate, a base plate, bolts and nuts, wherein the base plate is formed by two or more layers; The upper surface and the lower surface of the shell are provided with sunken steps for placing an upper cover plate and a lower cover plate, the upper cover plate and the lower cover plate are respectively placed on the sunken steps, and the upper surface of each cover plate is flush with the outer surface of the shell, so that a closed cavity structure is formed after encapsulation; The surface of the base plate is stuck with devices, the base plates are horizontally stacked and placed on steps in the inner cavity of the shell, adjacent base plates are parallel and are provided with a reserved space, and counter sunk holes are formed in the edges of the base plates and coaxial with the through holes on the steps; The bolt is an outer hexagon bolt manufactured by an integrated sintering process, the core of the bolt is a metal communication column, the outer side of the communication column is wrapped with an insulating ring, the insulating ceramic ring is filled between a bolt shell and the metal communication column, the insulating ring and the bolt shell are flush end to end, the bolt is used for fixing two layers of substrates with signal communication requirements on side wall steps and forming a signal connection channel, the bolt is matched with a nut to fasten the two layers of substrates, an input or output bonding pad on an upper substrate is connected with a bonding pad of the metal communication column in the bolt head by utilizing a thermosonic bonding process, and then the bonding pad of the metal communication column in the bolt tail is connected with an input or output bonding pad on a lower substrate to realize signal communication of the double-layer substrate in the module.
2. The three-dimensional interconnection structure for microwave module metal packaging according to claim 1, wherein the thickness of the cover plate material is 0.5 mm-2 mm, the assembly gap is controlled to be 0.03 mm-0.05 mm, and the upper surface of the cover plate is flush with the surface of the shell after assembly.
3. The three-dimensional interconnection structure for microwave module metal packaging according to claim 1, wherein the thickness of the substrate is larger than 1mm, a plurality of layers of circuit connection are arranged inside the substrate, and bonding pads are attached to the surface of the substrate for connecting device surface mounting with signals.
4. The three-dimensional interconnection structure for metal packaging of the microwave module, which is disclosed in claim 1, is characterized in that the shell material is a metal packaging material comprising aluminum alloy, silicon-aluminum alloy and kovar alloy, the cover plate material is a material meeting the requirement of welding matching with the shell material, the base plate is a resin material, and the nut material is consistent with the bolt shell material.
5. The three-dimensional interconnection structure of claim 1, wherein the outer shell of the bolt is made of metal meeting the strength requirement, the thickness is greater than 60% of the whole thickness, the bolt is provided with corresponding threads, the thread length is half of the whole bolt, the inner insulating ring is made of ceramic, the core metal connecting column is made of a material with good electric conductivity, the electric conductivity is more than 4 multiplied by 10 7 S/m, and the surface is plated with gold.
6. A method of fabricating a three-dimensional interconnect structure according to any one of claims 1-5, comprising the steps of: the method comprises the steps of preparing components in a three-dimensional interconnection structure, namely machining a shell, an upper cover plate and a lower cover plate, adopting colored conductive oxidation treatment, adopting an integrated sintering process for the whole structure of the bolt, and sintering a core metal communication column, an insulating ceramic ring and a bolt shell together to form a bolt meeting the packaging air tightness and the assembly strength; Bonding the surface mount device to the substrate by adopting a reflow soldering process; Placing the substrate subjected to surface mounting on a step of a shell, and ensuring that a counter bore formed in the substrate is coaxial with a through hole in the step; The bolt penetrates through two substrates with signal communication requirements to be connected with the nuts, and the metal bonding pads of the bolt core part are connected with bonding pads on the substrates by gold wire bonding; And sealing and welding the upper cover plate and the lower cover plate on the shell by utilizing laser sealing and welding to realize airtight packaging.
7. The method of claim 6, wherein the signal communication between the two layers of substrates in the module is realized by connecting the input or output pads on the upper substrate with the pads of the metal communication posts in the heads of the bolts by thermosonic bonding and then connecting the pads of the metal communication posts in the tails of the bolts with the input or output pads on the lower substrate; the upper substrate and the lower substrate are defined by the relative positions of the two layers of substrates in the shell, and if the substrates are multi-layer substrates, the other two substrates required by signal communication are connected in the same mode.
8. The method of claim 6, wherein the head and tail of the bolt are not higher than 0.5mm above the plane of the upper and lower substrates.
9. The method of claim 6, wherein the reflow temperature is 180-240 ℃, and the strength of the sintered bolt meets the GB/T5782-2000 requirements.
10. The method of manufacturing a package of claim 6, wherein when the package is made of aluminum alloy, the seal-welded aluminum alloy selects a laser pulse waveform to adjust and set the peak power based on a front spike wave, and when the package is made of silicon aluminum alloy, the seal-welded aluminum alloy selects a preheating heat-insulating wave to adjust and set the peak power based on a preheating heat-insulating wave, and the laser pulse waveform has an abscissa of time, an ordinate of peak power, and the adjustment and setting are floating adjustments to the peak power.

Description

Three-dimensional interconnection structure for microwave module metal packaging and manufacturing method Technical Field The invention relates to the technical field of integrated circuit micro-assembly, in particular to a method for manufacturing a three-dimensional interconnection structure for microwave module metal packaging. Background Along with the increasing demands of miniaturization and multifunction of the module, the number of components and integration level in the module are also increasing, the number of substrates in the module is gradually overlapped from one sheet to a plurality of sheets, the complicated internal signal connection provides higher requirements on structural design, and particularly in the radio frequency field or the power supply field, special requirements on grounding effect and space distribution are provided, the number of stacked substrates in the module is large, and the three-dimensional packaging design difficulty is high. The input and output of the signal among the traditional modules are mostly realized by an inscribed connector through cables or flying wires, namely, one end of a connector or an enameled wire is connected with the input or output end on one substrate in a cavity, and the other end of the connector or the enameled wire connected through the cables is connected with the other substrate through the interconnection, so that the signal transmission is completed. Thus, the input and output ports for signals are all internal to the module. The transmission mode reduces the stability of signals, increases the use space of the module, and cannot meet the use requirements of high reliability and high stability of the microwave module, and the development trend of miniaturization and light weight. Disclosure of Invention The invention solves the technical problems of providing a three-dimensional interconnection structure for microwave module metal packaging and a manufacturing method thereof, aiming at optimizing a signal transmission mode in a module, converting traditional cable transmission into connection support column transmission, stabilizing signals and simultaneously greatly saving structural design space The technical scheme includes that the three-dimensional interconnection structure for the microwave module metal packaging comprises a shell, an upper cover plate, a lower cover plate, a base plate, bolts and nuts, wherein the base plate is formed by two or more layers; The upper surface and the lower surface of the shell are provided with sunken steps for placing an upper cover plate and a lower cover plate, the upper cover plate and the lower cover plate are respectively placed on the sunken steps, and the upper surface of each cover plate is flush with the outer surface of the shell, so that a closed cavity structure is formed after encapsulation; The surface of the base plate is stuck with devices, the base plates are horizontally stacked and placed on steps in the inner cavity of the shell, adjacent base plates are parallel and are provided with a reserved space, and counter sunk holes are formed in the edges of the base plates and coaxial with the through holes on the steps; The core of the bolt is a metal communication column, an insulating ring is wrapped outside the communication column, an insulating ceramic ring is filled between the bolt shell and the metal communication column, the insulating ring and the bolt shell are flush end to end, the bolt is used for fixing two layers of substrates with signal communication requirements on side wall steps and forming a signal connection channel, and the bolt is matched with a nut to fasten the two layers of substrates. Preferably, the thickness of the cover plate material is between 0.5mm and 2mm, the assembly gap is controlled between 0.03mm and 0.05mm, and the upper surface of the assembled cover plate is flush with the surface of the shell. Preferably, the thickness of the substrate is larger than 1mm, a plurality of layers of circuits are arranged inside the substrate to be connected, and a bonding pad is attached to the surface of the substrate for connecting the device surface mount with signals. Preferably, the shell material is a metal packaging material comprising aluminum alloy, silicon aluminum alloy and kovar alloy, the cover plate material is a material meeting the requirement of welding matching with the shell material, the base plate is a resin material, and the nut material is consistent with the bolt shell material. Preferably, the shell of the bolt is made of metal meeting the strength requirement, the thickness is more than 60% of the whole thickness, the bolt is provided with corresponding threads, the length of the threads is half of the whole length of the bolt, the inner insulating ring is made of ceramic, the core metal connecting column is made of a material with good conductivity, the conductivity is more than 4 multiplied by 10 7 S/m, and the surface is subjecte