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CN-119264660-B - All-polymer nano-structure dielectric film with self-assembled nanoscale multi-interface and preparation method thereof

CN119264660BCN 119264660 BCN119264660 BCN 119264660BCN-119264660-B

Abstract

The invention relates to the technical field of dielectric materials and energy storage materials, in particular to a full-polymer nano-structure dielectric film with self-assembled nanoscale multi-interface and a preparation method thereof. The film material comprises the following components, wherein the mass ratio of the thermoplastic resin to the bismaleimide resin is 95:5-65:35, and the addition amount of the catalyst is 0.05-2 wt% of the weight of the bismaleimide resin. The film provided by the invention can meet the application requirements under the conditions of 150 ℃ and over 600 MV/m. The thermoplastic resin component in the film endows the film with good flexibility, is suitable for winding and laminating processes of a film capacitor, and the Bismaleimide (BMI) nanoscale multi-interface structure effectively blocks charge injection and excitation, and remarkably reduces leakage current under high temperature and strong electric field, thereby improving dielectric energy storage performance under high temperature and strong electric field conditions.

Inventors

  • ZHANG QIYAN
  • Xie Qiaohui
  • HUANG SHUANGWU

Assignees

  • 深圳大学

Dates

Publication Date
20260505
Application Date
20241025

Claims (5)

  1. 1. The preparation method of the dielectric film with the self-assembled nanoscale multi-interface and full polymer nano structure is characterized in that the following requirements are met in the components of the film material: The mass ratio of the thermoplastic resin to the bismaleimide resin is 85:15-70:30, and the addition amount of the catalyst is 0.05-wt-2: 2 wt% of the weight of the bismaleimide resin; The thermoplastic resin is polyetherimide, polysulfone or polycarbonate, the bismaleimide resin is bisphenol A type bismaleimide, and the catalyst is an initiator which is subjected to chain extension reaction and crosslinking reaction with the bismaleimide resin; the film preparation method comprises the following steps: S1, placing a thermoplastic polymer and bismaleimide resin in a polar organic solvent, heating and dissolving, adding a catalyst to obtain a composition slurry, wherein the solid content of the slurry is 0.1 wt-20 wt%; S2, uniformly coating the slurry on a glass substrate, and baking to volatilize the solvent as much as possible to obtain an uncured film; s3, carrying out multi-stage curing reaction at the temperature of 200-250 ℃ on the glass substrate after the solvent is volatilized to obtain a cured film; S4, putting the glass substrate with the cured film into deionized water for film uncovering, and drying the uncovered film at high temperature to obtain the full polymer nano-structure dielectric film with self-assembled nanoscale multi-interface; In the step S3, the temperature and time of each stage of the curing reaction are sequentially 200 ℃ for two hours and 230 ℃ for six hours.
  2. 2. The method of preparing a dielectric film with self-assembled nanoscale multi-interface of all-polymer nanostructures of claim 1, wherein the amount of catalyst added is 0.1% wt% -1 wt% by weight of bismaleimide resin.
  3. 3. The method of preparing a dielectric film with self-assembled nanoscale multi-interface and all-polymer nanostructures of claim 1, wherein the catalyst is bis-t-butylperoxyisopropylbenzene or di-t-butyl peroxide.
  4. 4. The method of preparing a fully polymeric nanostructured dielectric film having self-assembled nanoscale multi-interfaces according to claim 1, wherein the slurry has a solids content of 1 wt% -2 wt% in step S1.
  5. 5. The method for preparing a dielectric film with self-assembled nanoscale multi-interface of claim 1, wherein in step S2, the dielectric film is baked at 60-90 ℃ for more than 10 hours.

Description

All-polymer nano-structure dielectric film with self-assembled nanoscale multi-interface and preparation method thereof Technical Field The invention relates to the technical field of dielectric materials and energy storage materials, in particular to a full-polymer nano-structure dielectric film with self-assembled nanoscale multi-interface and a preparation method thereof. Background The polymer dielectric film capacitor has irreplaceable functions in the electronic and electric fields due to the advantages of rapid charge and discharge, high power density, excellent voltage resistance, self-healing capacity, chemical corrosion resistance and the like. As electronic devices move toward miniaturization and weight reduction, and in extreme environments, there is an increasing demand for applications, there is a growing demand for energy storage performance and reliability of polymer dielectrics at high temperatures. Under the action of the external electric field, when the external temperature approaches the glass transition temperature of the polymer, the leakage current in the dielectric medium can increase exponentially and be converted into Joule heat, so that the conductivity loss is increased. This not only significantly reduces the charge-discharge efficiency, but also greatly reduces the breakdown field strength, resulting in failure or damage of the power equipment. Therefore, a polymer dielectric material suitable for a high temperature environment is required to have not only excellent dielectric properties of high dielectric constant and low dielectric loss but also low conductivity loss and high breakdown field strength to ensure high charge and discharge efficiency and high discharge energy density. Currently, high temperature polymer dielectric materials for thin film capacitors are mainly thermoplastic engineering plastics with higher glass transition temperatures (Tg), such as Polyetherimide (PEI), polyphenylene sulfide (PPS), polyester (PET), polyetheretherketone (PEEK), and the like. Although these materials have a high Tg and can meet the mechanical temperature resistance requirements, their dielectric energy storage properties at high temperatures are still not ideal. For example, at 150 ℃, the conductance loss increases significantly, resulting in a substantial decrease in breakdown field strength, charge-discharge efficiency, and energy storage density. Therefore, development of a novel polymer dielectric material with excellent dielectric energy storage performance in a wide temperature range (from room temperature to 150 ℃) has important application prospect. Disclosure of Invention Aiming at the problem of insufficient dielectric energy storage performance of the existing polymer dielectric under a high-temperature strong electric field, the invention aims to provide a full polymer nano-structure dielectric film with self-assembled nanoscale multi-interface and a preparation method thereof. In order to achieve the aim of the invention, the invention adopts the following technical scheme: in one aspect, an all-polymer nanostructured dielectric film with self-assembled nanoscale multi-interfaces is provided, wherein the following requirements are met in the composition of the film material: the mass ratio of the thermoplastic resin to the bismaleimide resin is 95:5-65:35, and the addition amount of the catalyst is 0.05-2 wt% of the weight of the bismaleimide resin; The thermoplastic polymer is thermoplastic material with high glass transition temperature, and the catalyst is the initiator for chain extension reaction and crosslinking reaction of bismaleimide resin. Further, the mass ratio of the thermoplastic resin to the bismaleimide resin is 85:15-70:30. Further, the catalyst is added in an amount of 0.1wt% to 1wt% based on the weight of the bismaleimide resin. Further, the thermoplastic polymer is polyetherimide, polysulfone, or polycarbonate. Further, the bismaleimide resin is bisphenol A type bismaleimide or 4,4' -diphenylmethane bismaleimide. Further, the catalyst is di-tert-butyl peroxyisopropyl benzene or di-tert-butyl peroxide. In another aspect, a method of preparing an all-polymer nanostructured dielectric film having self-assembled nanoscale multi-interfaces is provided, comprising the steps of: S1, placing a thermoplastic polymer and bismaleimide resin in a polar organic solvent, heating and dissolving, and adding a catalyst to obtain a composition slurry, wherein the solid content of the slurry is 0.1-20wt%; s2, uniformly coating the slurry on a glass substrate, and baking at 60-90 ℃ for more than 10 hours to volatilize the solvent as much as possible to obtain an uncured film; s3, carrying out multi-stage curing reaction at the temperature of 200-250 ℃ on the glass substrate after the solvent is volatilized to obtain a cured film; S4, placing the glass substrate with the cured film into deionized water for film uncovering, and drying the uncovered film at high temperat