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CN-119451265-B - Battery piece production method, production equipment and battery piece

CN119451265BCN 119451265 BCN119451265 BCN 119451265BCN-119451265-B

Abstract

The embodiment of the application provides a battery piece production method, production equipment and a battery piece. The production method of the battery piece comprises the steps of providing a silicon wafer, dispensing glue on the first surface and/or the second surface of the silicon wafer, arranging welding strips on the silicon wafer, wherein the welding strips correspond to the dispensing glue positions, solidifying the dispensing glue positions to pre-fix the welding strips, and welding the pre-fixed welding strips and the silicon wafer to form the battery piece. According to the production method of the battery piece, the welding strip is fixed on the silicon wafer in the mode of firstly bonding and then welding the welding strip, so that the connection strength of the welding strip and the silicon wafer is improved, and the risk that the welding strip is easy to fall off in the transferring process of the silicon wafer is avoided.

Inventors

  • Request for anonymity
  • Request for anonymity
  • Request for anonymity
  • Request for anonymity

Assignees

  • 无锡先导智能装备股份有限公司

Dates

Publication Date
20260512
Application Date
20240906
Priority Date
20240612

Claims (15)

  1. 1. The production method of the battery piece is characterized by comprising the following steps of: Providing a silicon wafer; dispensing on the first surface and the second surface of the silicon wafer to form dispensing positions; A welding strip is arranged on the silicon wafer, and the welding strip corresponds to the dispensing phase; curing the dispensing position to pre-fix the welding strip; welding the pre-fixed welding strip and the silicon wafer to form a battery piece; dispensing on the first surface and the second surface of the silicon wafer specifically comprises: Dispensing one surface of the silicon wafer and then dispensing the other surface of the silicon wafer; dispensing the first surface of the silicon wafer and then dispensing the second surface of the silicon wafer specifically comprises the following steps: Placing the silicon wafer on a dispensing platform (621), wherein a second surface of the silicon wafer is attached to the dispensing platform (621), and a long edge of the silicon wafer extends along a first direction; Dispensing the first surface of the silicon wafer by using a dispensing device; Transferring the single-sided dispensing silicon wafer from a first conveying line (622) to a second conveying line (623), wherein the silicon wafer is transferred to the second conveying line (623), and the long edge of the silicon wafer extends along a second direction, and the first direction is perpendicular to the second direction; Transferring the single-sided dispensing silicon wafer from the second conveyor line (623) to a third conveyor line (624), wherein the silicon wafer is transferred to the third conveyor line (624), and the silicon wafer is turned 180 ° so that the first surface of the silicon wafer is attached to the third conveyor line (624); Transferring the silicon wafer flow on the third conveying line (624) to the dispensing platform (621), wherein the long edge of the silicon wafer extends along the first direction; And dispensing the second surface of the silicon wafer by adopting the same dispensing device.
  2. 2. The method for producing a battery plate according to claim 1, wherein the providing a silicon wafer specifically comprises: A group of silicon wafers is provided, wherein the group of silicon wafers comprises a first silicon wafer and a second silicon wafer, and the first surface of the first silicon wafer and the second surface of the second silicon wafer are positioned on the same horizontal plane.
  3. 3. The method of claim 2, wherein the first surface of the first silicon wafer and the second surface of the second silicon wafer are at the same horizontal plane comprises: One of the first silicon wafer and the second silicon wafer is turned 180 degrees so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane.
  4. 4. The battery piece production method according to claim 1, wherein glue avoiding tools are arranged on the first conveying line (622), the second conveying line (623) and the third conveying line (624).
  5. 5. The method for producing a battery plate according to claim 1, wherein dispensing the adhesive on the first surface and/or the second surface of the silicon wafer specifically comprises: The glue dispensing positions are arranged on the first surface and/or the second surface of the silicon wafer in a rectangular array, and the adjacent glue dispensing positions are arranged at intervals.
  6. 6. The method for producing a battery plate according to claim 1, wherein the disposing the solder strip on the silicon wafer specifically comprises: Providing a welding strip with a preset length; A soldering flux is arranged on the welding strip; transferring the glued silicon wafer flow to a welding strip layout platform (632); and arranging a welding strip provided with soldering flux on the surface with the dispensing position.
  7. 7. The method of claim 6, wherein, in the case that the first surface and the second surface of the silicon wafer each have a dispensing position, the disposing the solder strip provided with the soldering flux on the surface having the dispensing position specifically comprises: Firstly, paving a welding strip provided with soldering flux on the welding strip layout platform (632); placing the silicon wafer on a welding strip layout platform (632) provided with welding strips, wherein the welding strips correspond to dispensing positions on one surface of the silicon wafer; cutting off the welding strip at a preset position; and finally, arranging the cut welding strip on the other surface of the silicon wafer, wherein the welding strip corresponds to the dispensing position on the other surface of the silicon wafer.
  8. 8. The method of claim 6, wherein transferring the dispensed wafer stream to the solder strip layout platform (632) comprises: The silicon wafer after dispensing is transferred from the dispensing platform (621) to a fourth conveying line (634), and then transferred to a first preset position (A) through the fourth conveying line (634); And (2) transferring the silicon wafer flow at the first preset position (A) to the welding strip layout platform (632).
  9. 9. The method of claim 5, wherein disposing a solder strip provided with a flux on the surface having the spot gluing sites further comprises: placing the press mesh at the second preset position (B) on a welding belt, and transferring the silicon wafer flow provided with the press mesh to a curing platform (641).
  10. 10. The method for producing a battery plate according to claim 9, wherein the first preset position (a) and the second preset position (B) where the silicon wafer is located are arranged at intervals along the second direction.
  11. 11. The method of claim 9, further comprising, after the curing process of the dispensing station to pre-fix the solder strip: the press wire is turned back from the curing platform (641) to the second preset position (B).
  12. 12. The method of claim 1, wherein welding the pre-fixed solder strip and the silicon wafer to form the battery cell specifically comprises: carrying the silicon wafer from a curing platform (641) to a welding platform; and the heating device positioned below the welding platform is matched with the pressure head positioned above the welding platform to weld the pre-fixed welding strip and the silicon chip.
  13. 13. A battery sheet production apparatus characterized in that the battery sheet production apparatus prepares a battery sheet using the battery sheet production method according to any one of claims 1 to 12.
  14. 14. The battery cell production apparatus of claim 13, wherein the battery cell production apparatus comprises: the feeding device (60), the feeding device (60) is used for providing silicon wafers; the dispensing device (62) is used for dispensing the first surface and/or the second surface of the silicon wafer; dispensing on the first surface and the second surface of the silicon wafer specifically comprises: Dispensing one surface of the silicon wafer and then dispensing the other surface of the silicon wafer; dispensing the first surface of the silicon wafer and then dispensing the second surface of the silicon wafer specifically comprises the following steps: Placing the silicon wafer on a dispensing platform (621), wherein a second surface of the silicon wafer is attached to the dispensing platform (621), and a long edge of the silicon wafer extends along a first direction; dispensing the first surface of the silicon wafer; Transferring the single-sided dispensing silicon wafer from a first conveying line (622) to a second conveying line (623), wherein the silicon wafer is transferred to the second conveying line (623), and the long edge of the silicon wafer extends along a second direction, and the first direction is perpendicular to the second direction; Transferring the single-sided dispensing silicon wafer from the second conveyor line (623) to a third conveyor line (624), wherein the silicon wafer is transferred to the third conveyor line (624), and the silicon wafer is turned 180 ° so that the first surface of the silicon wafer is attached to the third conveyor line (624); Transferring the silicon wafer flow on the third conveying line (624) to the dispensing platform (621), wherein the long edge of the silicon wafer extends along the first direction; dispensing the second surface of the silicon wafer; The welding strip processing device (63) is used for distributing welding strips to the silicon wafer, and the welding strips correspond to the dispensing positions; The curing device (64) is used for curing the dispensing position so as to pre-fix the welding strip; and the welding device (65) is used for welding the pre-fixed welding strip and the silicon wafer to form a battery piece.
  15. 15. A battery sheet, characterized in that the battery sheet is a battery sheet produced by the battery sheet production method according to any one of claims 1 to 12.

Description

Battery piece production method, production equipment and battery piece The present application claims priority from China patent office filed on 12 months of 2024, 06, with application number 202421340901.0, and Chinese patent application entitled "Battery production apparatus and Battery", the entire contents of which are incorporated herein by reference. The present application claims priority from chinese patent office, application number 202421341615.6, filed on 12 months 2024, entitled "battery serial welding machine", the entire contents of which are incorporated herein by reference. Technical Field The embodiment of the application relates to the technical field of photovoltaic panel processing, in particular to a battery piece production method, production equipment and a battery piece. Background In the related art, the solder strips of the battery piece are fixed on the silicon wafer by means of welding and then dispensing. The welding strip is welded firstly, the welding firmness is very weak, and the risk that the welding strip falls off is possibly existed in the process of carrying and overturning the silicon wafer. In view of the foregoing, there is a need to provide a new technical solution to solve the above-mentioned problems. Disclosure of Invention The application aims to provide a battery piece production method, production equipment and a new battery piece technical scheme. In a first aspect, an embodiment of the present application provides a method for producing a battery sheet. The production method of the battery piece is characterized by comprising the following steps: Providing a silicon wafer; Dispensing on the first surface and/or the second surface of the silicon wafer to form dispensing positions, wherein the first surface and the second surface are arranged in opposite directions; A welding strip is arranged on the silicon wafer, and the welding strip corresponds to the dispensing phase; curing the dispensing position to pre-fix the welding strip; and welding the pre-fixed welding strip and the silicon wafer to form a battery piece. Optionally, the providing a silicon wafer specifically includes: A group of silicon wafers is provided, wherein the group of silicon wafers comprises a first silicon wafer and a second silicon wafer, and the first surface of the first silicon wafer and the second surface of the second silicon wafer are positioned on the same horizontal plane. Optionally, the first surface of the first silicon wafer and the second surface of the second silicon wafer are located at the same horizontal plane specifically includes: One of the first silicon wafer and the second silicon wafer is turned 180 degrees so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane. Optionally, dispensing on the first surface and the second surface of the silicon wafer specifically includes: dispensing the first surface of the silicon wafer and then dispensing the second surface of the silicon wafer. Optionally, dispensing the first surface of the silicon wafer and then dispensing the second surface of the silicon wafer specifically includes: placing the silicon wafer on a dispensing platform, wherein the second surface of the silicon wafer is attached to the dispensing platform, and the long edge of the silicon wafer extends along a first direction; dispensing the first surface of the silicon wafer; the silicon wafer subjected to single-sided dispensing is transferred to a second transfer line from a first transfer line, wherein the silicon wafer is transferred to the second transfer line, the long edge of the silicon wafer extends along a second direction, and the first direction is perpendicular to the second direction; the silicon wafer subjected to single-sided dispensing is transferred to a third transfer line from the second transfer line, wherein the silicon wafer is transferred to the third transfer line, and the silicon wafer is turned over for 180 degrees, so that the first surface of the silicon wafer is attached to the third transfer line; the silicon wafer on the third conveying line is circulated to the dispensing platform, and the long edge of the silicon wafer extends along the first direction; and dispensing the second surface of the silicon wafer. Optionally, the first conveying line, the second conveying line and the third conveying line are all provided with the glue avoiding tool. Optionally, dispensing on the first surface and/or the second surface of the silicon wafer specifically includes: The glue dispensing positions are arranged on the first surface and/or the second surface of the silicon wafer in a rectangular array, and the adjacent glue dispensing positions are arranged at intervals. Optionally, the disposing a solder strip on the silicon wafer specifically includes: Providing a welding strip with a preset length; A soldering flux is arranged on the welding strip; Trans