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CN-119517778-B - Carrier assembly, control method thereof and semiconductor process equipment

CN119517778BCN 119517778 BCN119517778 BCN 119517778BCN-119517778-B

Abstract

The application discloses a bearing assembly, a control method thereof and semiconductor process equipment, wherein the bearing assembly comprises a base and at least three jacking mechanisms, the base and the at least three jacking mechanisms are respectively used for supporting a workpiece to be processed, the base is provided with a plurality of through holes, each jacking mechanism comprises a jacking piece, the plurality of jacking pieces can be correspondingly penetrated in the plurality of through holes one by one, at least one jacking mechanism further comprises a pressure detection piece, and the jacking pieces in the jacking mechanisms are supported by the pressure detection piece. The bearing assembly can solve the problems that the wafer is in a state of being eccentric relative to the base for subsequent processing due to the fact that the current semiconductor process equipment cannot monitor the sliding vane phenomenon possibly occurring in the wafer transferring process, and the wafer is possibly invalid or even broken.

Inventors

  • HE ZHONGKAI

Assignees

  • 北京北方华创微电子装备有限公司

Dates

Publication Date
20260512
Application Date
20230824

Claims (9)

  1. 1. The bearing assembly is characterized by comprising a base, a position adjusting mechanism and at least three jacking mechanisms, wherein the base and the at least three jacking mechanisms are respectively used for supporting a workpiece to be machined, the base is provided with a plurality of through holes, each jacking mechanism comprises a jacking piece, and the jacking pieces can be correspondingly penetrated in the through holes one by one; The at least one jacking mechanism further comprises a pressure detection piece, and the jacking piece in the jacking mechanism is supported on the pressure detection piece so as to judge whether the center of the workpiece to be machined and the center of the base are in a concentric state or not through a pressure detection value of the pressure detection piece; Each jacking mechanism is arranged on the position adjusting mechanism, and the position adjusting mechanism is used for driving each jacking mechanism to move relative to the base along the direction vertical to the axial direction of the through hole under the condition that the to-be-machined piece does not meet the concentric requirement of the to-be-machined piece and the base.
  2. 2. The carrier assembly of claim 1, wherein the position adjustment mechanism comprises a drive member and a connector frame, each of the jacking mechanisms is mounted to the connector frame, and the drive member is connected to the connector frame.
  3. 3. The carrier assembly of claim 1, wherein each of the jacking mechanisms includes the pressure sensing element, and wherein the jacking element of any one of the jacking mechanisms is supported by the pressure sensing element.
  4. 4. A carrier assembly according to claim 3, wherein the number of through holes is three, and the line connecting the centers of three through holes encloses an acute triangle.
  5. 5. The carrier assembly of claim 4, wherein the spacing between the centers of the three through holes and the center of the base is equal.
  6. 6. A control method applied to the bearing assembly of claim 1, wherein the bearing assembly further comprises a position adjusting mechanism, each supporting mechanism is mounted on the position adjusting mechanism, the position adjusting mechanism is used for driving each supporting mechanism to move relative to the base along a direction perpendicular to an axial direction of the through hole, and the control method comprises: S1, acquiring a detection value of the pressure detection piece; And S2, under the condition that the detection value does not meet the preset pressure, controlling the position adjusting mechanism to drive the plurality of jacking mechanisms to move relative to the base so as to reduce the distance between the center of the workpiece to be machined and the center of the base in the direction perpendicular to the axial direction of the through hole.
  7. 7. The control method according to claim 6, wherein each of the jack mechanisms includes the pressure detecting member, and the jack member of any one of the jack mechanisms is supported by the pressure detecting member, the control method, The S1 comprises the following steps: Obtaining detection values of the pressure detection pieces; The step S2 comprises the following steps: Acquiring an offset vector of the center of the workpiece to be processed relative to the center of the base based on the plurality of detection values under the condition that any one of the plurality of detection values does not meet the corresponding preset pressure; when the value of the offset vector is smaller than or equal to the adjustment range of the position adjustment mechanism, controlling the position adjustment mechanism to drive a plurality of jacking mechanisms to move relative to the base, wherein the adjustment distance of the position adjustment mechanism is equal to the value of the offset vector, and the adjustment direction is opposite to the direction of the offset vector; And controlling the to-be-machined part to be moved out of the process chamber under the condition that the value of the offset vector is larger than the adjustment range of the position adjustment mechanism.
  8. 8. The control method according to claim 7, wherein the controlling the movement of the workpiece out of the process chamber in the case where the value of the offset vector is larger than the adjustment range of the position adjustment mechanism includes: When the value of the offset vector is larger than the adjusting range of the position adjusting mechanism and smaller than the preset offset, controlling the to-be-processed workpiece to be moved out of the process chamber, and re-executing the sheet conveying step; and under the condition that the value of the offset vector is larger than the adjusting range of the position adjusting mechanism and is equal to or larger than the preset offset, controlling the to-be-machined piece to move out of the process chamber, and sending out alarm information.
  9. 9. A semiconductor processing apparatus comprising a process chamber and the carrier assembly of any one of claims 1-5, the susceptor being liftable and lowerable mounted to the process chamber.

Description

Carrier assembly, control method thereof and semiconductor process equipment Technical Field The application belongs to the technical field of semiconductor processing, and particularly relates to a bearing assembly, a control method thereof and semiconductor process equipment. Background Because the tungsten has good conductivity and electromigration resistance, in the semiconductor processing process, the holes or grooves are filled with the tungsten by chemical vapor deposition so as to realize the purpose of electric connection between the previous device and the subsequent metal interconnection. Generally, after the metal filling process is completed, the metal tungsten remained on the surface of the wafer needs to be removed by using a chemical mechanical planarization method, and before the metal deposition process is performed, a shielding ring with an inner diameter slightly smaller than the outer diameter of the wafer needs to be covered on the edge of the wafer, so as to ensure that an annular area with no sediment and equal width can be formed on the upper surface of the wafer from the outer edge of the wafer. Of course, in order to ensure that the width of the deposition-free area formed at the outer edge of the wafer is equal or substantially equal, it is necessary to ensure that the ring, the wafer, and the susceptor for carrying the wafer are arranged concentrically. In the current wafer transfer process, a wafer is usually supported in advance by using a plurality of pins, and then, in the process of lifting the base, the base lifts the wafer from the top ends of the pins and drives the wafer to continuously lift to a process station. Because the current process equipment cannot acquire the problem that the wafer may have a sliding vane phenomenon when being moved to the thimble, the position of the wafer when being carried on the thimble may be eccentric relative to the base, in this case, when the base holds the wafer to finish the metal deposition process, the eccentric, even failure or fragments of the wafer may occur after the edge is removed. Disclosure of Invention The embodiment of the application aims to provide a bearing assembly, a control method thereof and semiconductor process equipment, which are used for solving the problems that the wafer is in a state of being eccentric relative to a base for subsequent processing and possibly causing wafer failure and even fragments due to the fact that the current semiconductor process equipment cannot monitor the sliding vane phenomenon possibly occurring in the wafer transferring process. In a first aspect, an embodiment of the present application discloses a bearing assembly, which includes a base and at least three propping mechanisms, where the base and the at least three propping mechanisms are respectively used for supporting a workpiece to be machined, the base is provided with a plurality of through holes, each propping mechanism includes a propping member, and the plurality of propping members can be correspondingly penetrated in the plurality of through holes one by one; At least one of the jacking mechanisms further comprises a pressure detection piece, and the jacking piece in the jacking mechanism is supported on the pressure detection piece. In a second aspect, an embodiment of the present application discloses a control method applied to the above-mentioned bearing assembly, where the bearing assembly further includes a position adjustment mechanism, each of the jacking mechanisms is mounted on the position adjustment mechanism, and the position adjustment mechanism is configured to drive each of the jacking mechanisms to move relative to the base along a direction perpendicular to an axial direction of the through hole, and the control method includes: S1, acquiring a detection value of the pressure detection piece; And S2, under the condition that the detection value does not meet the preset pressure, controlling the position adjusting mechanism to drive the plurality of jacking mechanisms to move relative to the base so as to reduce the distance between the center of the workpiece to be machined and the center of the base in the direction perpendicular to the axial direction of the through hole. In a third aspect, an embodiment of the present application further discloses a semiconductor processing apparatus, which includes a process chamber and the above-mentioned carrier assembly, wherein the susceptor is liftably mounted in the process chamber. The embodiment of the application discloses a bearing assembly, which comprises a base and at least three jacking mechanisms, wherein the base is respectively used for supporting a workpiece to be processed, a plurality of through holes are formed in the base, and jacking pieces of the jacking mechanisms can be correspondingly penetrated into the through holes one by one, so that the capability of supporting the workpiece to be processed is ensured for both the jacking mechan