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CN-119726358-B - Macro-channel submodule packaging clamp

CN119726358BCN 119726358 BCN119726358 BCN 119726358BCN-119726358-B

Abstract

The invention discloses a macro channel sub-module packaging clamp, wherein a macro channel heat dissipation base limiting mechanism is arranged on a bottom plate of an inverted gate-type placing frame, positioning frame limiting mechanisms are arranged on two side plates of the placing frame, the upper parts of two side wall plates of the placing frame are fixedly connected with pressure rods, a row of spring ejector pins are uniformly arranged on the pressure rods, a pressing block is tightly pressed below the spring ejector pins, the pressing block is positioned above the positioning frame, a macro channel heat dissipation base and an insulating ceramic plate with a metal film plated on the surface are arranged between the positioning frame and the bottom plate of the placing frame, the macro channel heat dissipation base is positioned below the insulating ceramic plate, the positioning frame comprises a left metal baffle plate and a right metal baffle plate, positioning partition plates and metal blocks are distributed between the two metal baffle plates at intervals, a sub-module accommodating cavity is formed between the metal blocks, and the shape of the pressing block is the same as that of the sub-module accommodating cavity. The sub-modules are separated by the positioning partition plates, so that the sub-modules are not mutually extruded, errors are not accumulated, and deviation of metal film cutting lines on the chip and the insulating ceramic sheet is avoided.

Inventors

  • CHENG DONGMING

Assignees

  • 郑州大学

Dates

Publication Date
20260505
Application Date
20241127

Claims (6)

  1. 1. A macro-channel sub-module packaging clamp is characterized by comprising a placing frame (1), a positioning frame (4), pressing blocks (5), pressure rods (6) and spring ejector pins (7), wherein the placing frame (1) is an inverted door-shaped structure, macro-channel heat dissipation base limiting mechanisms are arranged on bottom plates of the placing frame (1), positioning frame limiting mechanisms are arranged on two side plates of the placing frame (1), the pressure rods (6) are fixedly connected to upper parts of two side wall plates of the placing frame (1), a row of spring ejector pins (7) are uniformly arranged on the pressure rods (6), one pressing block (5) is tightly pressed below each spring ejector pin (7), the number of the pressing blocks is not less than that of sub-modules, the pressing blocks (5) are located above the positioning frame (4), macro-channel heat dissipation bases (2) and insulating ceramic plates (3) with metal films plated on surfaces are placed between the bottom plates of the positioning frame (4) and the placing frame (1), cutting lines (31) are uniformly distributed on the metal films, chips of the sub-modules correspond to the metal film cutting lines, the macro-channel bases (2) are arranged below the insulating ceramic plates (3), the positioning frame (6) comprises a left metal block (44) and a second metal block (42), a second metal block (42) is arranged between the second metal block (42), one end of the positioning baffle (41) is detachably connected with the first metal block (421), the other end of the positioning baffle is detachably connected with the second metal block (422), a sub-module accommodating cavity (43) is formed among the first metal block (421), the second metal block (422) and the positioning baffle (41), the width of the first metal block (421) and the width of the second metal block (422) are identical to the width of the sub-module, the distance between the first metal block (421) and the second metal block (422) is identical to the length of the sub-module, and the shape of the pressing block (5) is identical to the sub-module accommodating cavity (43).
  2. 2. The macro channel sub-module packaging fixture of claim 1, wherein the two ends of the positioning partition plate (41) are respectively provided with a connecting hole, the end, away from each other, of the first metal block (421) and the second metal block (422) is also respectively provided with a connecting hole, the positioning partition plate (41) and the first metal block (421) are connected through the connecting holes by screws, and the positioning partition plate (41) and the second metal block (422) are connected through the connecting holes by screws.
  3. 3. The macro-channel sub-module packaging fixture of claim 1, wherein the first metal block (421) and the second metal block (422) are each provided with a positioning tip (420) at an end adjacent to each other.
  4. 4. The macro channel sub-module packaging clamp of claim 1, wherein the macro channel heat dissipation base limiting mechanism comprises a first screw hole (11) arranged on a bottom plate of the placement frame (1), and a positioning screw penetrates through the first screw hole (11).
  5. 5. The macro channel sub-module packaging fixture of claim 1, wherein the positioning frame limiting mechanism comprises second screw holes (12) arranged on two side plates of the placing frame (1), the screw holes (12) on the two side plates are arranged at equal heights, and positioning screws penetrate through the screw holes (12).
  6. 6. A macro-channel sub-module packaging fixture according to claim 1, wherein the pressure bars (6) are arranged in parallel.

Description

Macro-channel submodule packaging clamp Technical Field The invention belongs to the technical field of semiconductor lasers, and particularly relates to a macro-channel submodule packaging clamp. The invention belongs to a 1.3.3 novel component semiconductor laser device in the key direction of 1.3 electronic core industry in the 1 new generation information technology industry of a novel industry catalog. Background The macro channel sub-module is formed by welding two electrode plates and a semiconductor laser array chip, the two electrode plates are welded by clamping the chip, the two electrode plates are respectively used as the positive electrode and the negative electrode of the chip, and as shown in figure 1, the module size is only 10mm multiplied by 2mm multiplied by 1mm. Assembling a macro-channel laser typically requires sequential series welding of a plurality of such sub-modules to form a high power macro-channel laser. In the welding, it is necessary to weld the sub-module to an insulating ceramic sheet having a metal film plated on the surface. In order to ensure that the positive and negative electrodes of the submodule are not shorted, the metal film is generally cut off by a diamond blade, see fig. 9, the chip just corresponds to the cut-off position, and the positive and negative electrodes are welded on the metal film layer of the ceramic sheet. In this way, a cut-off line corresponds exactly to the position of a chip, so that the submodules are connected in series with each other without short-circuiting. But during the packaging process, the following problems are encountered: 1. Because the chip is very thin and is only 0.135mm, accumulated errors among the sub-modules easily deviate the chip and the cutting line, so that the positive electrode and the negative electrode of the sub-module are welded on the same metal film to cause short circuit. 2. When the sub-modules are welded, as the sub-modules are closely arranged, the sub-modules are inevitably extruded mutually, so that some sub-modules are lifted. The lifted sub-module cannot contact the solder during soldering, resulting in soldering failure. Under the condition, when the submodule is powered on, heat cannot be timely dissipated, so that the submodule is burnt. Disclosure of Invention Aiming at the problems that accumulated errors among sub-modules in the prior art easily cause deviation of chips and cutting lines, cause short circuits when positive and negative electrodes of the sub-modules are welded to the same metal film, and cause lifting when the sub-modules are mutually extruded, the invention provides a macro-channel sub-module packaging clamp. The object of the invention is achieved in the following way: The utility model provides a macro-channel sub-module packaging fixture, including putting the frame, positioning frame, the briquetting, pressure bar and spring thimble, put the frame and be the door-type of inversion, set up macro-channel heat dissipation base stop gear on putting the bottom plate of frame, set up positioning frame stop gear on putting the both sides board of frame, put the both sides wallboard upper portion fixed connection pressure bar of frame, evenly set up a row of spring thimble on the pressure bar, every spring thimble below compresses tightly a briquetting, briquetting quantity is no less than sub-module quantity, the briquetting is located positioning frame top, positioning frame places macro-channel heat dissipation base and the insulating ceramic piece that the surface plated the metal film between putting the frame bottom plate, macro-channel heat dissipation base is in the below of insulating ceramic piece, positioning frame includes two blocks of metal baffles about, spacer plate and metal piece of interval distribution between two blocks of metal baffles, the metal piece includes first metal piece and second metal piece, spacer plate one end is dismantled with first metal piece and is connected, the other end is dismantled with the second metal piece and is connected, form sub-module holding chamber between first metal piece and the spacer plate, the sub-module holding chamber holds between first metal piece, the width and the second metal piece is the same with the sub-module, the sub-module shape is held with the sub-module. The connecting holes are formed in the two ends of the positioning partition plate, the connecting holes are formed in the ends, far away from each other, of the first metal block and the second metal block, the positioning partition plate and the first metal block are connected through the connecting holes through screws, and the positioning partition plate and the second metal block are connected through the connecting holes through screws. And positioning tips are arranged at the adjacent ends of the first metal block and the second metal block. The macro-channel heat dissipation base limiting mechanism comprises a first screw hole arranged on the bottom