CN-119738131-B - Silicon optical wafer testing equipment and optical fiber pose adjusting mechanism, method and system thereof

Abstract

The application discloses silicon optical wafer test equipment and an optical fiber pose adjusting mechanism, method and system thereof, wherein the optical fiber pose adjusting mechanism comprises a camera component and a deflection light path component; a probe station for carrying a silicon photonics wafer; the device comprises a silicon optical wafer, an optical fiber coupling module, a driving assembly, a deflection optical path assembly and an optical fiber coupling module, wherein the driving assembly is used for driving the silicon optical wafer to be located in an imaging view field of the camera assembly, the camera assembly is adjusted to be parallel to a cutting channel of the silicon optical wafer in a coordinate system, the driving assembly is used for driving the deflection optical path assembly to move into the imaging view field of the camera assembly, the camera assembly is used for collecting at least two lateral images in different directions of the end part of the optical fiber through the deflection optical path assembly, and the optical fiber coupling module is used for adjusting the pose of the end part of the optical fiber according to the lateral images and the direction of the coordinate system of the camera assembly so as to enable the end part of the optical fiber to be initially aligned with the silicon optical wafer. The application simplifies the operation difficulty and the equipment structure of the para-position coupling between the end part of the optical fiber and the silicon optical waveguide, and reduces the equipment cost.

Inventors

• XIE ZHIYIN
• ZHAO SHAN

Assignees

• 苏州联讯仪器股份有限公司

Dates

Publication Date

20260512

Application Date

20241231

Claims (19)

1. 1. The optical fiber pose adjusting mechanism of the silicon optical wafer testing equipment is characterized by comprising a micro-imaging assembly, a probe station, an optical fiber coupling module and a driving assembly, wherein the micro-imaging assembly comprises a camera assembly and a deflection optical path assembly; when the driving assembly drives the probe platform carrying the silicon optical wafer to move into an imaging view field of the camera assembly, the camera assembly is adjusted to be parallel to a coordinate system of the camera assembly and a cutting channel of the silicon optical wafer; When the driving component drives the deflection light path component to move into an imaging view field of the camera component, the camera component is used for collecting lateral images corresponding to at least two lateral images in different directions of the optical fiber end part input by deflection conduction of the deflection light path component, and the optical fiber coupling module is used for carrying out pose adjustment on the optical fiber end part according to the lateral images and the directions of a camera component coordinate system so as to enable the optical fiber end part to be initially aligned with the silicon optical wafer.
2. 2. The optical fiber pose adjustment mechanism of the silicon optical wafer test equipment according to claim 1, wherein a cross cursor is arranged in a camera head of the camera assembly; when the driving assembly drives the probe platform carrying the silicon optical wafer to move into the imaging view field of the camera assembly, the camera assembly is used for collecting the wafer image of the silicon optical wafer and adjusting the cross cursor of the camera in the camera assembly to be parallel to the cutting path on the silicon optical wafer through the wafer image.
3. 3. The optical fiber pose adjustment mechanism of a silicon optical wafer test apparatus of claim 2 wherein said deflected light path assembly includes at least two reflective elements; When the driving component drives the deflection light path component to move into an imaging view field of the camera component, the camera component is used for collecting a first lateral image and a second lateral image of the optical fiber end part of the optical fiber array in a first horizontal direction through the deflection light path component, and adjusting the end face of the optical fiber end part to a horizontal plane according to the first lateral image and the second lateral image by utilizing the optical fiber coupling module, wherein the first horizontal direction and the second horizontal direction are mutually perpendicular; the camera component is also used for collecting vertical images of the end parts of the optical fibers from the vertical direction, and the optical fiber coupling module is used for adjusting the contour lines of the end parts of the optical fibers to be parallel to the cross cursors of the cameras according to the vertical images.
4. 4. The optical fiber pose adjustment mechanism of silicon optical wafer test equipment according to claim 3, wherein the deflected light path assembly comprises a bearing table connected with the probe table, a first reflecting element and a second reflecting element arranged on the bearing table; the light source device further comprises a first light source assembly and a second light source assembly which are arranged on the bearing table; The first light source component is used for outputting a light beam to the first reflecting element along the first horizontal direction, the first reflecting element is used for reflecting the incident light beam along the vertical upward direction, the second light source component is used for outputting the light beam to the second reflecting element along the second horizontal direction, the second reflecting element is used for reflecting the incident light beam along the vertical upward direction, and the light path between the first light source component and the first reflecting element and the light path between the second light source component and the second reflecting element are mutually intersected in a set intersection area; When the deflection light path component moves to the lower part of the camera component through the driving component, the optical fiber end part is positioned in the set crossing area; the camera assembly is configured to capture the first lateral image when the camera is translated directly above the first reflective element and the second lateral image when the camera is translated directly above the second reflective element.
5. 5. The optical fiber pose adjusting mechanism of the silicon optical wafer testing device according to claim 4, wherein the optical fiber coupling module is further provided with a height detecting structure on a terminal connecting structure for connecting the end parts of the optical fibers; correspondingly, a calibration substrate is also arranged on the bearing table corresponding to the set intersection area; When the driving component drives the deflection light path component to move to the position that the distance between the lower surface of the height detection structure and the upper surface of the calibration substrate is within a set height range, the optical fiber end part is positioned in the set intersection area.
6. 6. The optical fiber pose adjustment mechanism of a silicon optical wafer test apparatus according to claim 5, wherein the elevation detection structure is a nano-capacitance displacement sensor.
7. 7. The optical fiber pose adjustment mechanism of a silicon optical wafer test apparatus according to claim 4, wherein the first light source assembly comprises a first surface light source and a third reflective element; The first reflecting element, the second reflecting element, the third reflecting element and the fourth reflecting element are all right-angle triangular prisms, and a reflecting film layer is arranged on the hypotenuse reflecting surface of each right-angle triangular prism; The bevel edge reflecting surface of the third reflecting element is positioned on the output light path of the first surface light source and is used for reflecting the light beam output by the first surface light source along the first horizontal direction, passing through the set intersection area and entering the first reflecting element so that the first reflecting element reflects the light beam carrying the lateral profile information of the end part of the optical fiber; The hypotenuse reflecting surface of the fourth reflecting element is located on the output light path of the second surface light source, and is used for reflecting the light beam output by the second surface light source along the second horizontal direction, passing through the set intersection area and entering the second reflecting element, so that the second reflecting element reflects the light beam carrying the lateral profile information of the end part of the optical fiber.
8. 8. The optical fiber pose adjustment mechanism of the silicon optical wafer test apparatus according to any one of claims 1 to 7, wherein the optical fiber coupling module comprises three translation components and three rotation components connected in sequence, and a terminal connection structure; The three translation components are respectively used for driving the terminal connecting structure to perform translation motion along a first direction, a second direction and a third direction, the three rotation components are respectively used for driving the terminal connecting structure to rotate around a first rotation shaft, a second rotation shaft and a third rotation shaft, the first direction, the second direction and the third direction are perpendicular in pairs, and the first rotation shaft, the second rotation shaft and the third rotation shaft are perpendicular in pairs.
9. 9. The mechanism of claim 8, wherein the end connection structure is further connected to a piezoelectric displacement stage for driving the fiber end to move through the end connection structure when the control voltages of different magnitudes are turned on, so as to control the alignment coupling between the fiber end and the silicon wafer.
10. 10. A silicon optical wafer testing apparatus comprising the optical fiber pose adjustment mechanism of the silicon optical wafer testing apparatus according to any one of claims 1 to 9.
11. 11. A method for adjusting the pose of an optical fiber for a silicon optical wafer testing apparatus, which is applied to the pose adjusting mechanism of an optical fiber for a silicon optical wafer testing apparatus according to any one of claims 1 to 9, comprising: The method comprises the steps that a driving assembly is controlled to drive a silicon optical wafer to translate into an imaging view field of a camera assembly, and the camera assembly is adjusted through a wafer image acquired by the camera assembly so that a coordinate system of the camera assembly and a cutting channel on the silicon optical wafer are parallel to each other; Controlling the silicon optical wafer to move out of an imaging view field of the camera assembly, moving a deflection optical path assembly into the imaging view field of the camera assembly, and collecting lateral images corresponding to at least two lateral images in different directions of the end part of the optical fiber which is deflected and conducted and input by the deflection optical path assembly through the camera assembly; And controlling the optical fiber coupling module to adjust the pose of the end part of the optical fiber according to the lateral image and the direction of the camera component coordinate system, and controlling the driving component to drive the silicon optical wafer to translate into the imaging view field of the camera component so as to enable the optical fiber array to be initially aligned with the silicon optical wafer.
12. 12. The method of claim 11, wherein adjusting the camera assembly to align a camera assembly coordinate system and scribe lines on the silicon wafer with each other based on the wafer image acquired by the camera assembly, comprises: Controlling the driving assembly to drive the probe platform carrying the silicon optical wafer to move into an imaging view of the camera assembly; the camera component is used for collecting wafer images of the silicon optical wafer; and adjusting the camera assembly through the wafer image, so that a cross cursor of a camera in the camera assembly is adjusted to be parallel to a cutting channel on the silicon optical wafer.
13. 13. The method of claim 12, wherein controlling the fiber coupling module to adjust the pose of the fiber end according to the lateral image and the direction of the camera assembly coordinate system to initially align the fiber array with the silicon wafer comprises: Acquiring lateral images of the end part of the optical fiber in a first horizontal direction and a second horizontal direction through the camera component, and acquiring a first lateral image and a second lateral image, wherein the first horizontal direction and the second horizontal direction are mutually perpendicular; Controlling the optical fiber coupling module to adjust the end face of the optical fiber end part to a horizontal plane according to the first lateral image and the second lateral image; acquiring, by the camera assembly, a vertical image of the fiber end from a vertical direction; and controlling the optical fiber coupling module to adjust the contour line of the end part of the optical fiber to be parallel to the cross cursor of the camera according to the vertical image.
14. 14. The method of claim 13, wherein controlling the fiber coupling module to adjust the end face of the fiber end to a horizontal plane based on the first lateral image and the second lateral image comprises: determining a first included angle between the end face of the optical fiber end and the second horizontal direction according to an end face contour line of the optical fiber end imaged in the first lateral image; Controlling the optical fiber coupling module to drive the optical fiber end part to rotate by a first included angle by taking a second rotating shaft as a center, wherein the second horizontal direction and the second rotating shaft are parallel to each other; determining a second included angle between the end face of the optical fiber end and the first horizontal direction according to an end face contour line of the optical fiber end imaged in the second lateral image; And controlling the optical fiber coupling module to drive the optical fiber end to rotate by a second included angle with the first rotating shaft as the center, wherein the first horizontal direction and the first rotating shaft are parallel to each other.
15. 15. The method for adjusting the pose of an optical fiber of a silicon wafer testing apparatus according to claim 14, wherein after controlling the optical fiber coupling module to drive the end portion of the optical fiber to rotate by a first angle with the second rotation axis as a center, further comprising: driving the optical fiber end to translate along a first direction by using the optical fiber coupling module Is translated in a third direction Wherein, the distance of the pair of the first electrodes and the second electrodes, A distance between the fiber end and the second axis of rotation; is the first included angle; correspondingly, after controlling the optical fiber coupling module to drive the optical fiber end to rotate by a second included angle with the first rotation axis as the center, the method further comprises: Driving the optical fiber end part to translate along the second direction by utilizing the optical fiber coupling module Is translated along the third direction Wherein, the distance of the pair of the first electrodes and the second electrodes, A distance between the optical fiber end and the first rotational axis; Is the second included angle; the first direction, the second direction and the third direction are perpendicular to each other; the first direction, the first rotating shaft, the second direction, the second rotating shaft and the third direction are vertical directions; the first direction and the first horizontal direction are parallel to each other, and the second direction and the second horizontal direction are parallel to each other.
16. 16. The method for adjusting the pose of an optical fiber of a silicon optical wafer testing device according to claim 13, wherein controlling the optical fiber coupling module to adjust the contour line of the end of the optical fiber to be parallel to a cross cursor of the camera according to the vertical image comprises: determining a third included angle between the end surface contour line of the optical fiber end part and the cross cursor according to the end surface contour line of the optical fiber end part imaged in the vertical image; and controlling the optical fiber coupling module to drive the optical fiber end to rotate by a third included angle through a third rotating shaft, wherein the third rotating shaft is a rotating shaft in the vertical direction.
17. 17. The method of claim 11, wherein controlling the driving assembly to drive the silicon optical wafer to translate into the imaging field of view of the camera assembly to initially align the optical fiber array with the silicon optical wafer further comprises: Controlling the camera component to acquire an alignment image of the end part of the optical fiber and the silicon optical wafer imaged in the same picture; And controlling the optical fiber coupling module to drive the optical fiber end to translate along a first direction and a second direction according to the imaging positions of the optical fiber port of the optical fiber end and the optical interface in the silicon optical wafer in the alignment image respectively, so that preliminary alignment coupling is carried out between the optical fiber port of the optical fiber end and the optical interface.
18. 18. The method of claim 17, further comprising, after preliminary alignment coupling between the fiber port of the fiber end and the optical interface: controlling a corresponding path of optical fiber output light waves in each optical fiber end part; The piezoelectric displacement platform connected with the tail end connecting structure of the optical fiber coupling module drives the end part of the optical fiber to move horizontally in a horizontal plane; The optical power which is detected and changes along with the translational movement of the optical fiber end part is detected by a coupling photoelectric detector connected with one end of the optical fiber, which is far away from the optical fiber end part; And when the optical power is maximum, the position corresponding to the end part of the optical fiber is the optimal coupling position between the end part of the optical fiber and each waveguide in the silicon optical wafer.
19. 19. A silicon optical wafer testing system comprising an optical performance tester, a controller, and the silicon optical wafer testing apparatus of claim 10; The controller is configured to perform the steps of the optical fiber pose adjustment method of the silicon optical wafer test apparatus according to any one of claims 11 to 18 using the silicon optical wafer test apparatus.

Description

Silicon optical wafer testing equipment and optical fiber pose adjusting mechanism, method and system thereof Technical Field The invention relates to the technical field of silicon optical wafer testing, in particular to an optical fiber pose adjusting mechanism of silicon optical wafer testing equipment, an optical fiber pose adjusting method of silicon optical wafer testing equipment and a silicon optical wafer testing system. Background The silicon optical wafer testing equipment is mainly used for testing whether a silicon optical chip formed by processing on a silicon optical wafer can normally work or not, and in the actual testing process, optical signals are transmitted into the silicon optical chips which are arranged on the wafer in an array mode by means of optical fibers or optical fiber arrays, and optical performance testing is carried out based on the optical signals output by the silicon optical chips. In the process of performing performance test on the silicon optical waveguide, ensuring effective alignment coupling between the port of the optical fiber and the silicon optical waveguide on the wafer is one of important factors for improving test accuracy. Therefore, how to realize the para-position coupling between the port of the optical fiber array and the optical interface of the silicon optical waveguide on the wafer in the silicon optical wafer test process is one of the important concerns in the industry. Disclosure of Invention The invention aims to provide an optical fiber pose adjusting mechanism, a coupling method and a testing system of silicon optical wafer testing equipment, which realize simpler alignment between an optical waveguide and an optical fiber port in the silicon optical wafer testing process, and reduce the alignment coupling difficulty on the basis of reducing the cost of the testing equipment. The invention provides an optical fiber pose adjusting mechanism of silicon optical wafer testing equipment, which comprises a micro-imaging assembly, a probe station, an optical fiber coupling module and a driving assembly, wherein the micro-imaging assembly comprises a camera assembly and a deflection optical path assembly; when the driving assembly drives the probe platform carrying the silicon optical wafer to move into an imaging view field of the camera assembly, the camera assembly is adjusted to be parallel to a coordinate system of the camera assembly and a cutting channel of the silicon optical wafer; When the driving component drives the deflection light path component to move into an imaging view field of the camera component, the camera component is used for collecting lateral images corresponding to at least two lateral images in different directions of the optical fiber end part input by deflection conduction of the deflection light path component, and the optical fiber coupling module is used for carrying out pose adjustment on the optical fiber end part according to the lateral images and the directions of a camera component coordinate system so as to enable the optical fiber end part to be initially aligned with the silicon optical wafer. In an alternative embodiment of the application, a cross cursor is arranged in a camera head of the camera assembly; when the driving assembly drives the probe platform carrying the silicon optical wafer to move into the imaging view field of the camera assembly, the camera assembly is used for collecting the wafer image of the silicon optical wafer and adjusting the cross cursor of the camera in the camera assembly to be parallel to the cutting path on the silicon optical wafer through the wafer image. In an alternative embodiment of the present application, the deflected light path assembly includes at least two light reflecting elements; When the driving component drives the deflection light path component to move into an imaging view field of the camera component, the camera component is used for collecting a first lateral image and a second lateral image of the optical fiber end part of the optical fiber array in a first horizontal direction through the deflection light path component, and adjusting the end face of the optical fiber end part to a horizontal plane according to the first lateral image and the second lateral image by utilizing the optical fiber coupling module, wherein the first horizontal direction and the second horizontal direction are mutually perpendicular; the camera component is also used for collecting vertical images of the end parts of the optical fibers from the vertical direction, and the optical fiber coupling module is used for adjusting the contour lines of the end parts of the optical fibers to be parallel to the cross cursors of the cameras according to the vertical images. In an alternative embodiment of the present application, the deflected light path assembly includes a carrier stage connected to the probe stage, a first reflective element and a second reflective element disposed