CN-119763988-B - Inductance structure, manufacturing method, equipment and medium thereof

CN119763988BCN 119763988 BCN119763988 BCN 119763988BCN-119763988-B

Abstract

The application discloses an inductance structure, a manufacturing method, equipment and a medium thereof, wherein the inductance structure comprises: the induction coil comprises an induction coil body, a magnet and a metal frame, wherein the magnet wraps the induction coil body to form a cuboid induction main body, and the metal frame covers the top and/or bottom of the cuboid induction main body and is connected with an induction coil terminal which is extended and bent to the top and/or bottom of the cuboid induction main body. By adding a metal frame on the surface of the inductor, an inductor structure with an electric interconnection design is realized, and the inductor structure is suitable for a mature compression molding inductor manufacturing method and a semiconductor manufacturing process. The advanced system-in-package has higher dimensional accuracy requirement on the device than the general capability of inductance manufacture, and limits the flexibility of package design, while the electrode reconstruction mode provided by the application can solve the problem of mismatching of the accuracy, thereby improving the design flexibility.

Inventors

DAI WEIJING
Ao Sihong
Qiu Liangming
LIN SHENGBIAO

Assignees

深圳市沃芯半导体技术有限公司

Dates

Publication Date: 20260505
Application Date: 20250307

Claims (9)

1. The inductance structure is characterized by comprising an inductance winding, a magnet and a metal frame, wherein the magnet wraps the inductance winding and exposes an inductance winding terminal to form a cuboid inductance main body, the metal frame is covered on the top and/or the bottom of the cuboid inductance main body and is connected with the inductance winding terminal which is bent to the top and/or the bottom of the cuboid inductance main body in an extending mode through mounting, so that the inductance self area is directly utilized for electric interconnection, the heat dissipation area is increased, the edge of the metal frame connected with the inductance winding terminal is marked as a connecting edge, and the edge length of the connecting edge is larger than the width of the inductance winding terminal.
2. A method of manufacturing an inductor structure as claimed in claim 1, comprising the steps of: S11, manufacturing a copper material into an inductance winding with a fixed shape, wherein the fixed shape comprises any one of Z-shaped, I-shaped, U-shaped, C-shaped and spiral; S12, placing the inductance winding into a cavity of a die, filling magnetic powder, prepressing to keep a certain shape, and exposing an inductance winding terminal; s13, attaching a sheet-type metal frame; and S14, sintering after compression molding to form a firm whole of the magnetic powder, and curing the sintered material to form good connection and conductivity.
3. The method of manufacturing according to claim 2, wherein the step of attaching the sheet metal frame includes: S1311, coating a sintered nano metal material by using a steel mesh matched with the end of the inductance winding, or dispensing the material at a designated position of the end of the inductance winding in a dispensing mode; And S1312, attaching a sheet metal frame to the appointed position of the end of the inductance winding.
4. The method of manufacturing according to claim 2, wherein the step of attaching the sheet metal frame includes: s1321, coating a sintered nano metal material on a sheet metal frame, attaching a preformed inductor to a designated position of the metal frame, and then carrying out nano metal sintering and solidification once and cutting; s1322, the separated inductor is then surface-mounted on another metal frame, and is pressed, molded, sintered and solidified to finish the connection of the other surface.
5. The inductance structure is characterized by comprising an inductance winding, a magnet, a metal connecting sheet and a metal frame, wherein the magnet wraps the inductance winding and the metal connecting sheet, an inductance winding terminal and a metal connecting sheet terminal are exposed out to form a cuboid inductance main body, the metal connecting sheet is located on the outer peripheral surface of the cuboid inductance main body, the metal frame is of a sheet shape and covers the top and/or the bottom of the cuboid inductance main body, and is connected with the inductance winding terminal which is extended and bent to the top and/or the bottom of the cuboid inductance main body through pasting, and/or is connected with the metal connecting sheet terminal which is extended to the top and/or the bottom of the cuboid inductance main body, the metal frame at the top and/or the bottom can be arranged in different shapes according to different circuit requirements, and the edge of the metal frame connected with the inductance winding terminal is a connecting edge, and the edge length of the connecting edge is larger than the width of the inductance winding terminal.
6. The inductor structure of claim 5, wherein the plurality of metal frames are arranged differently from each other in shape at the top and bottom of the rectangular inductor body.
7. A method of fabricating an inductor structure as claimed in claim 5, comprising the steps of: S21, manufacturing a copper material into an inductance winding with a fixed shape, wherein the fixed shape comprises any one of Z-shaped, I-shaped, U-shaped, C-shaped and spiral; S22, placing the inductance winding and the corresponding metal connecting sheet terminal into a cavity of a die, filling magnetic powder, prepressing to keep a certain shape, and exposing the inductance winding and the metal connecting sheet terminal; S23, coating sintered nano metal materials by using a steel mesh matched with the inductance winding end and the metal connecting sheet end, or spot-coating materials at appointed positions of the inductance winding end and the metal connecting sheet end in a dispensing mode; and S24, sintering after compression molding to form a firm whole of the magnetic powder, and curing the sintered material to form good connection and conductivity.
8. An inductor structure fabrication apparatus comprising a memory and a processor coupled to each other, the processor configured to execute program instructions stored in the memory to implement the method of fabricating an inductor structure of any one of claims 2-4 or the method of fabricating an inductor structure of claim 7.
9. A computer readable storage medium having stored thereon program instructions, which when executed by a processor, implement the method of manufacturing an inductive structure as claimed in any one of claims 2-4, or the method of manufacturing an inductive structure as claimed in claim 7.

Description

Inductance structure, manufacturing method, equipment and medium thereof Technical Field The application belongs to the field of semiconductor packaging, and particularly relates to an inductance structure, and a manufacturing method, equipment and medium thereof. Background With the continuous development of semiconductor technology, in the field of high-integration power supply chip packaging, in order to adapt to the continuously reduced terminal equipment, the power supply chip or module needs to be designed to occupy smaller space as much as possible. Therefore, a mode of vertically stacking each component is proposed, so that the planar space is further reduced. The inventors have found that inductors in conventional manufacturing are currently commonly used in power circuit structures with planar structures, while advanced system in package technology in highly integrated power chips or module packages requires higher dimensional accuracy for inductor devices than is currently possible in conventional manufacturing. Therefore, the inductor manufacturing in the conventional manufacturing industry is not fully applicable to the high-integration power chip or module designed and manufactured by the advanced semiconductor packaging process. Further, the power supply chip or module adopting the vertical stacking mode also provides challenges for the interconnection mode of the inductor during packaging, for example, the requirement that the inductor terminals need to be located on different surfaces appears, and the conventional inductor terminals cannot meet the complex electrical appliance interconnection requirement and heat dissipation requirement. Disclosure of Invention In order to solve the problem of how to provide an inductance structure in the prior art so as to meet the requirements of complex electrical interconnection and heat dissipation in a magnetic integrated power module, the technical scheme of the application is as follows: in one aspect, an inductance structure is provided, comprising an inductance winding, a magnet and a metal frame, wherein the magnet wraps the inductance winding to form a cuboid inductance main body, and the metal frame covers the top and/or the bottom of the cuboid inductance main body and is connected with an inductance winding terminal which is extended and bent to the top and/or the bottom of the cuboid inductance main body. The metal frame is thin, and the width of the metal frame is larger than that of the inductance winding terminal. On the other hand, a manufacturing method of the inductance structure is provided, which comprises the following steps: s11, manufacturing a copper material into an inductance winding with a fixed shape, wherein the fixed shape comprises any one of Z-shaped, I-shaped, U-shaped, C-shaped and spiral; s12, placing the inductance winding into a cavity of a mold, filling magnetic powder, prepressing to keep a certain shape and exposing an inductance winding terminal; s13, attaching a sheet-type metal frame; and S14, sintering after compression molding to form a firm whole of the magnetic powder, and curing the sintered material to form good connection and conductivity. Wherein, the step of attaching the sheet metal frame includes: S1311, coating a sintered nano metal material by using a steel mesh matched with an inductance winding end, or spot-coating the material at a designated position of the inductance winding end in a dispensing mode; and S1312, attaching a sheet metal frame to the appointed position of the end of the inductance winding. Wherein, the step of attaching the sheet metal frame includes: s1321, coating a sintered nano metal material on a sheet metal frame, attaching a preformed inductor to a designated position of the metal frame, and then carrying out nano metal sintering and solidification once and cutting; and S1322, mounting the surface of the separated inductor on another metal frame, and sintering and solidifying to finish the connection of the other surface. In still another aspect, an inductor structure is provided, including an inductor winding, a magnet, a metal connecting piece, and a metal frame, wherein the magnet wraps the inductor winding and the metal connecting piece to form a cuboid inductor main body, the metal connecting piece is located on an outer peripheral surface of the cuboid inductor main body, and the metal frame covers the top and/or bottom of the cuboid inductor main body and is connected with an inductor winding terminal and a metal connecting piece terminal which are bent to the top and/or bottom of the cuboid inductor main body in an extending manner. The metal frames are arranged in a plurality, and the shape of the metal frames at the top and the bottom of the cuboid inductor main body are different. In yet another aspect, a method for manufacturing the above inductor structure is provided, including the steps of: s21, manufacturing a copper material into an inductance winding with