CN-119767454-B - Uniform heating structure and manufacturing method thereof

CN119767454BCN 119767454 BCN119767454 BCN 119767454BCN-119767454-B

Abstract

The invention discloses a uniform heating structure and a manufacturing method thereof, and belongs to the field of electric heating. The structure mainly comprises a supporting structure, a temperature equalizing layer, a heating layer, an electrode, an insulating layer, a heat conducting interface layer, a fastening structure and a heat preservation structure. Firstly, a supporting structure, a uniform temperature layer, an insulating layer and a heating layer are combined together through a heat conducting interface layer, then electrodes are installed through methods such as pressing, welding and the like, a mechanical structure is used for fastening the device, then a heat preservation structure is coated on the outer side of the fastening structure, and finally a power line is connected with the electrodes and is mechanically fixed through insulating materials, so that a uniform electric heating structure is obtained. The structure prepared by the method adopts the uniform conductive film as a heating element, and simultaneously lays a uniform temperature layer, so that the overall temperature is more uniform. Meanwhile, the structure also uses a large amount of heat conduction interface layers, so that the heat resistance is smaller and the energy efficiency is higher. The structure also has the advantages of quick temperature rise, high reliability and the like.

Inventors

YU ZIKANG
WANG HUATAO
ZHANG SHAOPING
LONG JINSONG
ZHAO YUQING
YUAN YE

Assignees

哈尔滨工业大学（威海）
威海焦尔电气科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250126

Claims (9)

1. A manufacturing method of a uniform heating structure is characterized by mainly comprising a supporting structure, a uniform temperature layer, a heating layer, an electrode, an insulating layer, a heat conducting interface layer, a fastening structure and a heat insulation structure, wherein the manufacturing steps of the manufacturing method comprise: S01, paving a first uniform temperature layer, namely uniformly coating a heat conducting interface layer on the surface of one side of the heat source direction of the supporting structure, uniformly paving the first uniform temperature layer on the surface of the heat conducting interface layer, wherein the thickness range of the first uniform temperature layer is 0.01-10 mm; s02, paving a first insulating layer, namely uniformly coating a heat conducting interface layer on the other surface of the first temperature equalizing layer in S01, uniformly paving the first insulating layer on the surface of the heat conducting interface layer, wherein the thickness range of the first insulating layer is 0.01-8 mm; S03, paving a heating layer, namely uniformly coating a heat conduction interface layer on the other surface of the first insulating layer in S02, and uniformly paving the heating layer on the surface of the heat conduction interface layer; S04, electrode installation, namely coating conductive paste on the surfaces of two or more electrodes with a certain shape, fixing the conductive paste on the surface of an S03 heating layer, and keeping a certain distance between the electrodes, wherein the electrodes in the step S04 contain one or more of copper, aluminum, silver and gold, and the conductive paste in the step S04 is one or more of silver paste, aluminum paste and carbon paste; s05, paving a second insulating layer, namely uniformly coating a heat conduction interface layer on the other surface of the heating layer in S04, uniformly paving the second insulating layer on the surface of the heat conduction interface layer, wherein the thickness range of the second insulating layer is 0.01-8 mm; S06, paving a second uniform temperature layer, namely uniformly coating a heat conduction interface layer on the other surface of the insulating layer in S05, uniformly paving the second uniform temperature layer on the surface of the heat conduction interface layer, wherein the second uniform temperature layer is Wen Cenghou degrees in a range of 0.01-10 mm; S07, installing a fastening structure, namely placing the fastening structure on the other surface of the S06 uniform temperature layer and fastening the fastening structure through a mechanical structure; s08, installing the heat-insulating structure, namely placing the heat-insulating structure on the other surface of the S07 fastening structure and fixing the heat-insulating structure; and S09, connecting the power line with the electrode, and mechanically fixing the power line with an insulating material to obtain a uniform heating structure, wherein the power line and the electrode are connected in a welding or crimping way, and the insulating material is one or more of high-temperature-resistant resin, ceramic and insulating composite material.
2. The method of claim 1, wherein the support structure of step S01 is made of one or more of metal, ceramic, polymer and composite material, and the bottom surface is one or more of ring, rectangle, sector, ellipse, circle, polygon, and has a thickness ranging from 0.01m to 1m.
3. The method according to claim 1, wherein the S01-S06 heat conductive interface layer has a heat conductivity of 0.5 to 500W/(m.K), the heat conductive interface layer contains a resin matrix and a heat conductive filler, the resin matrix comprises one or more of epoxy resin, silicone resin, fluorosilicone resin, polyimide, bismaleimide, phenolic resin, cyanate resin, phthalonitrile resin, the heat conductive filler comprises one or more of silica, alumina, magnesia, zinc oxide, silicon, boron nitride, aluminum nitride, silicon carbide, diamond, carbon nanotube, graphene, graphite nano-sheet, graphite, and metal particles, and the heat conductive filler has a particle diameter in the range of 0.01 to 200 μm.
4. The method according to claim 1, wherein the thermal conductivities of the first and second temperature equalizing layers in the steps S01 and S06 are 80 to 2000W/(m·k), and the first and second temperature equalizing layers in the steps S01 and S06 contain one or more of metal, silicon, boron nitride, aluminum nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanoplatelets, and graphite.
5. The method according to claim 1, wherein the insulating strength of the first insulating layer and the second insulating layer in the step S02 and S05 is greater than 10kV/mm, and the temperature resistance is greater than 150 ℃, and the first insulating layer and the second insulating layer in the step S02 and S05 contain one or more of epoxy resin, phenolic resin, polyimide, polyether ether ketone, polyphenylene sulfide, polysulfone, polytetrafluoroethylene, silica gel, fluorine-containing silica gel, mica, ceramic, glass, and rubber.
6. The manufacturing method according to claim 1, wherein the heating layer in the steps S03 and S04 is made of a thin film material, the thickness range of the heating layer is 0.01 mm-1 mm, the sheet resistance is less than 1000 Ω/≡and the maximum fluctuation range of the sheet resistance is ± 15%, and the heating layer in the steps S03 and S04 contains one or more of carbon nanotubes, graphene, graphite nanoplatelets, graphite, carbon fibers, carbon black, metal and semiconductor.
7. The method according to claim 1, wherein the electrode in the step S04 has a resistivity of less than 100 μΩ -cm, and the mounting method is one or more of crimping and welding.
8. The method according to claim 1, wherein the material of the fastening structure in the step S07 is one or more of metal, resin, ceramic fiber, and composite material, and has a tensile strength of more than 100MPa and a temperature resistance of more than 150 ℃.
9. The uniform heating structure is characterized in that the uniform heating structure is prepared by the method of any one of claims 1-8, the heating temperature can reach 120-300 ℃, the temperature difference between the heating surface and the temperature is less than 8 ℃, the heating speed is more than 1 ℃ per minute, and the uniform heating structure has a uniform electric heating function.

Description

Uniform heating structure and manufacturing method thereof Technical Field The invention belongs to the field of electric heating, and relates to a uniform heating structure and a manufacturing method thereof. Background Uniform heating has been a difficulty in the field of industrial heating. The traditional electric heating mostly adopts resistance wires as heating bodies, and has the problems of uneven heating, easy aging, blowing and the like. The invention adopts the uniform conductive film as the heating element, and lays the uniform temperature layer, so that the heating temperature distribution is more uniform. In addition, the invention also adopts a thermal interface material, the thermal resistance of the system is smaller, and the overall energy efficiency is higher. The invention provides a uniform electric heating method, which has the characteristics of simple process, low cost, energy conservation, safety, uniform temperature, high reliability and the like. Disclosure of Invention The invention aims to overcome the defects of the prior art, adopts uniform conductive films as heating elements and adopts uniform temperature layers, adopts thermal interface materials among layers, structures and structures, has smaller thermal resistance of the system, and realizes uniform, energy-saving and high-reliability electric heating. The invention provides a manufacturing method applied to a uniform heating structure, which comprises the following steps of: 1. The manufacturing method of the uniform heating structure is characterized in that the prepared uniform heating structure mainly comprises a supporting structure, a uniform temperature layer, a heating layer, an electrode, an insulating layer, a heat conducting interface layer, a fastening structure and a heat preservation structure. The manufacturing steps comprise: s01, paving a first uniform temperature layer, namely uniformly coating a heat conducting interface layer on the surface of one side of the heat source direction of the supporting structure, and uniformly paving the first uniform temperature layer on the surface of the heat conducting interface layer; S02, paving a first insulating layer, namely uniformly coating a heat conduction interface layer on the other surface of the first temperature equalizing layer in S01, and uniformly paving the first insulating layer on the surface of the heat conduction interface layer; S03, paving a heating layer, namely uniformly coating a heat conduction interface layer on the other surface of the first insulating layer in S02, and uniformly paving the heating layer on the surface of the heat conduction interface layer; S04, electrode installation, namely coating conductive paste on the surfaces of two or more electrodes with a certain shape, and fixing the conductive paste on the surface of the heating layer S03, wherein a certain distance is kept between the electrodes; s05, paving a second insulating layer, namely uniformly coating a heat conduction interface layer on the other surface of the heating layer in S04, and uniformly paving the second insulating layer on the surface of the heat conduction interface layer; S06, paving a second uniform temperature layer, namely uniformly coating a heat conduction interface layer on the other surface of the insulating layer in S05, and uniformly paving the second uniform temperature layer on the surface of the heat conduction interface layer; S07, installing a fastening structure, namely placing the fastening structure on the other surface of the S06 uniform temperature layer and fastening the fastening structure through a mechanical structure; s08, installing the heat-insulating structure, namely placing the heat-insulating structure on the other surface of the S07 fastening structure and fixing the heat-insulating structure; and S09, connecting a power line, namely connecting the power line with the electrode, and mechanically fixing the power line by using an insulating material to obtain the uniform heating structure. 2. Further, the support structure in the step S01 is made of one or more of metal, ceramic, polymer and composite material, and the bottom surface of the support structure is one or more of ring, rectangle, sector, ellipse, circle and polygon, and the thickness range is 0.001 m-10 m. 3. The heat conduction interface layer is further characterized in that the heat conductivity of the S01-S06 heat conduction interface layer is 0.5-500W/(m.K), the heat conduction interface layer contains a resin matrix and a heat conduction filler, the resin matrix comprises one or more of epoxy resin, polyurethane, acrylic acid, silicon resin, fluorosilicone resin, polyimide, bismaleimide, phenolic resin, cyanate resin and phthalonitrile resin, the heat conduction filler comprises one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon carbide, diamond, carbon nano-tube, graphene, graphi