CN-119786465-B - Chip radiator and computer equipment

CN119786465BCN 119786465 BCN119786465 BCN 119786465BCN-119786465-B

Abstract

The embodiment of the application provides a chip radiator and computer equipment, wherein the chip radiator comprises a liquid cooling heat exchange cavity, an evaporation phase change cavity, a liquefaction cooling cavity and a first vortex tube, wherein the liquid cooling heat exchange cavity is arranged on the surface of a chip, the liquid cooling heat exchange cavity is filled with cooling liquid for absorbing heat generated by the chip, the evaporation phase change cavity is communicated with the liquid cooling heat exchange cavity, the liquefaction cooling cavity is arranged between the liquid cooling heat exchange cavity and the evaporation phase change cavity, the first vortex tube comprises a first hot end for providing hot air of first compressed gas and a first cold end for providing cold air of the first compressed gas, the first hot end extends to the evaporation phase change cavity and gasifies part of cooling liquid from the liquid cooling heat exchange cavity, and the first cold end extends to the liquefaction cooling cavity. The cooling liquid can flow between the liquid cooling heat exchange cavity and the evaporation phase change cavity and cool down the cooling liquid flowing to the liquid cooling heat exchange cavity, so that the heat exchange efficiency is improved, and the heat dissipation capacity of the chip radiator is improved.

Inventors

CHENG PENG
YANG XIAOJUN
QIAN XIAOFENG
SUN HAOTIAN

Assignees

海光信息技术股份有限公司

Dates

Publication Date: 20260505
Application Date: 20241206

Claims (10)

1. A chip heat sink, comprising: The liquid cooling heat exchange cavity is arranged on the surface of the chip and is filled with cooling liquid for absorbing heat generated by the chip, and comprises a first liquid inlet for inputting the cooling liquid and a first liquid outlet for outputting the cooling liquid; The evaporation phase-change cavity is communicated with the liquid cooling heat exchange cavity and comprises a second liquid inlet and a second liquid outlet, the second liquid inlet receives the cooling liquid from the first liquid outlet of the liquid cooling heat exchange cavity, and the second liquid outlet transmits the cooling liquid stored in the evaporation phase-change cavity to the first liquid inlet of the liquid cooling heat exchange cavity; The liquefaction cooling cavity is arranged between the liquid cooling heat exchange cavity and the evaporation phase change cavity; a first vortex tube comprising a first hot end providing a hot gas stream of a first compressed gas and a first cold end providing a cold gas stream of the first compressed gas, wherein the first hot end extends to the evaporative phase change cavity and gasifies a portion of the cooling liquid from the liquid cooled heat exchange cavity, the first cold end extending to the liquefaction cooling cavity; An air cooling convection cavity surrounding the liquid cooling heat exchange cavity, the liquefaction cooling cavity and the chip; The second vortex tube comprises a second hot end for providing a hot air flow of a second compressed gas and a second cold end for providing a cold air flow of the second compressed gas, wherein the second hot end extends to the evaporation phase change cavity and gasifies part of cooling liquid from the liquid cooling heat exchange cavity, and the second cold end extends to the air cooling convection cavity.
2. The chip heat sink of claim 1, further comprising: The first liquid cooling channel is connected with the second liquid outlet of the evaporation phase change cavity and the first liquid inlet of the liquid cooling heat exchange cavity; The second liquid cooling channel is connected with the first liquid outlet of the liquid cooling heat exchange cavity and the second liquid inlet of the evaporation phase change cavity.
3. The chip heat sink of claim 2, wherein the second liquid cooling channel comprises: and the check valve is arranged at a second liquid inlet of the evaporation phase change cavity connected with the second liquid cooling channel and used for preventing the cooling liquid from flowing back.
4. The chip heat spreader of claim 1, wherein an inner surface of the liquefaction cooling chamber is provided with a first heat dissipating fin; the outer surface of the liquid cooling heat exchange cavity is provided with a second radiating fin; the materials of the first radiating fin and the second radiating fin comprise aluminum or copper.
5. The chip heat sink of claim 1, further comprising a housing; The shell is provided with a first shell space and an air-cooling convection cavity; the evaporation phase change cavity and the first hot end are arranged in the first shell space.
6. The chip heat sink of claim 5 wherein the second cold end of the second vortex tube is located in a side region of the air-cooled convection chamber providing a cold air flow to the sides and bottom of the air-cooled convection chamber; a first through hole is formed between the air cooling convection cavity and the substrate where the chip is located, and the first through hole is communicated with the air cooling convection cavity and the outer side of the shell.
7. The heat sink of claim 6, further comprising a housing back plate disposed on a side of the substrate on which the chip is disposed away from the chip, the housing back plate having a second housing space; The surface of the base plate is provided with a second through hole which is used for communicating the air-cooled convection cavity and the second shell space.
8. The chip heat sink of claim 1, further comprising: the first gas input port is arranged in the first vortex tube and is used for inputting first compressed gas into the first vortex tube; the second gas input port is arranged in the second vortex tube and is used for inputting second compressed gas into the second vortex tube.
9. The chip heat spreader of claim 1, wherein the cooling fluid has a boiling point of 40 degrees celsius to 50 degrees celsius; The first compressed gas and the second compressed gas are gases which are not condensed and frosted when the temperature is below 60 ℃ below zero; The materials of the first vortex tube and the second vortex tube comprise stainless steel or copper.
10. A computer device comprising a chip heat sink as claimed in any one of claims 1-9.

Description

Chip radiator and computer equipment Technical Field The embodiment of the application relates to the technical field of computers, in particular to a chip radiator and computer equipment. Background Along with the improvement of the computing power of the chip, the power consumption of the chip is increased, and the increase of the power consumption of the chip can lead to more heat generated during the operation of the chip, so that the heat dissipation capability of the radiator of the chip is required to be higher. Therefore, how to improve the heat dissipation capability of the chip heat sink is a problem to be solved by those skilled in the art. Disclosure of Invention In view of the above, the embodiments of the present application provide a chip heat sink and a computer device to improve the heat dissipation capability of the chip heat sink. In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: The embodiment of the application provides a chip radiator, which comprises: The liquid cooling heat exchange cavity is arranged on the surface of the chip and is filled with cooling liquid for absorbing heat generated by the chip, and comprises a first liquid inlet for inputting the cooling liquid and a first liquid outlet for outputting the cooling liquid; The evaporation phase-change cavity is communicated with the liquid cooling heat exchange cavity and comprises a second liquid inlet and a second liquid outlet, the second liquid inlet receives the cooling liquid from the first liquid outlet of the liquid cooling heat exchange cavity, and the second liquid outlet transmits the cooling liquid stored in the evaporation phase-change cavity to the first liquid inlet of the liquid cooling heat exchange cavity; The liquefaction cooling cavity is arranged between the liquid cooling heat exchange cavity and the evaporation phase change cavity; The first vortex tube comprises a first hot end for providing a hot gas flow of a first compressed gas and a first cold end for providing a cold gas flow of the first compressed gas, wherein the first hot end extends to the evaporation phase change cavity and gasifies part of the cooling liquid from the liquid cooling heat exchange cavity, and the first cold end extends to the liquefaction cooling cavity. Optionally, the device also comprises an air cooling convection cavity surrounding the liquid cooling heat exchange cavity, the liquefaction cooling cavity and the chip; The second vortex tube comprises a second hot end for providing a hot air flow of a second compressed gas and a second cold end for providing a cold air flow of the second compressed gas, wherein the second hot end extends to the evaporation phase change cavity and gasifies part of cooling liquid from the liquid cooling heat exchange cavity, and the second cold end extends to the air cooling convection cavity. Optionally, the evaporator also comprises a first liquid cooling channel, a second liquid cooling channel and a first liquid cooling channel, wherein the first liquid cooling channel is connected with a second liquid outlet of the evaporation phase-change cavity and a first liquid inlet of the liquid cooling heat exchange cavity; The second liquid cooling channel is connected with the first liquid outlet of the liquid cooling heat exchange cavity and the second liquid inlet of the evaporation phase change cavity. Optionally, the second liquid cooling channel includes: and the check valve is arranged at a second liquid inlet of the evaporation phase change cavity connected with the second liquid cooling channel and used for preventing the cooling liquid from flowing back. Optionally, a first heat dissipation fin is arranged on the inner surface of the liquefaction cooling cavity; the outer surface of the liquid cooling heat exchange cavity is provided with a second radiating fin; the materials of the first radiating fin and the second radiating fin comprise aluminum or copper. Optionally, the evaporation phase change cavity is far away from the liquid cooling heat exchange cavity. Optionally, the device also comprises a shell; The shell is provided with a first shell space and an air-cooling convection cavity; the evaporation phase change cavity and the first hot end are arranged in the first shell space. Optionally, the second cold end of the second vortex tube is located in a side area of the air-cooled convection cavity, and provides cold air flow for the side and bottom of the air-cooled convection cavity; a first through hole is formed between the air cooling convection cavity and the substrate where the chip is located, and the first through hole is communicated with the air cooling convection cavity and the outer side of the shell. Optionally, the integrated circuit further comprises a shell backboard, a second shell space and a first shell, wherein the shell backboard is arranged on one side of the substrate where the chip is