CN-119947421-B - Display module preparation method and display module

CN119947421BCN 119947421 BCN119947421 BCN 119947421BCN-119947421-B

Abstract

The invention provides a preparation method of a display module and the display module, and the preparation method comprises the steps of providing a substrate, and etching a groove on the surface of the substrate; the method comprises the steps of placing a binding circuit in a groove, fixing the binding circuit in the groove in a magnetic control mode, preparing a substrate on the surface of a substrate provided with the groove, fixing the binding circuit on one side of the substrate close to the substrate, preparing a screen layer on one side of the substrate far away from the substrate, etching the screen layer and the substrate to form a wire through hole, wherein the screen layer comprises a screen circuit, the screen circuit is electrically connected with the binding circuit through the wire through hole, stripping the substrate from the substrate to enable the binding circuit to be exposed on one side of the substrate close to the substrate, and providing a binding assembly to enable the binding circuit to be electrically connected with the binding assembly. The method adopts a magnetic control mode to fix the binding line, and can effectively reduce the frame of the screen body.

Inventors

WANG SHUPENG
LIU YAWEI
LIU JUNWEI
LIU QIANG
ZHANG MIN

Assignees

云谷（固安）科技有限公司
合肥维信诺科技有限公司

Dates

Publication Date: 20260508
Application Date: 20250122

Claims (9)

1. The preparation method of the display module is characterized by comprising the following steps: A substrate is provided and a substrate is provided, Etching a groove on the surface of the substrate; placing a binding circuit in the groove; the binding circuit is fixed in the groove in a magnetic control mode; Preparing a substrate on the surface of the substrate provided with the groove, wherein the binding circuit is fixed on one side of the substrate, which is close to the substrate; Preparing a screen layer on one side of the substrate far away from the base, etching the screen layer and the substrate to form a wire through hole, wherein the screen layer comprises a screen circuit, and the screen circuit is electrically connected with the binding circuit through the wire through hole; stripping the substrate from the base, so that the binding circuit is exposed at one side of the substrate close to the base; Providing a binding component, and electrically connecting the binding circuit with the binding component; The binding circuit comprises a connecting part and a conductive contact piece fixed on the connecting part, the binding circuit is formed by a metal calendaring process, the connecting part comprises a metal substrate, and the binding circuit has magnetism; The magnetic control mode comprises that a coil is arranged on one side of the substrate, which is away from the groove, and after the binding circuit is placed in the groove, the coil is electrified, and the binding circuit is adsorbed and positioned in the groove through a magnetic field generated by the coil; And after the binding circuit is fixed on one side of the substrate close to the base, removing the magnetic control.
2. The method of claim 1, wherein, The binding circuit is arranged in a groove formed in the surface of the substrate, the binding circuit protrudes out of the surface of the substrate, and the substrate covers the part of the binding circuit protruding out of the groove.
3. The method of manufacturing a display module according to claim 2, wherein, The substrate is a glass substrate.
4. The method of claim 1, wherein, And the depth of the groove etched on the substrate is 7-10 mu m.
5. The method of claim 1, wherein, The thickness of the binding circuit is larger than or equal to 20 mu m.
6. The method of claim 1, wherein, The screen body layer comprises a dam and an organic packaging layer, and the organic packaging layer is located in an area surrounded by the dam.
7. The method for manufacturing a display module according to any one of claims 1 to 6, wherein, The screen body layer comprises an encapsulation protection area and a cutting area, wherein the cutting area is outside the encapsulation protection area.
8. The method of claim 7, wherein, And cutting off the connecting part of the binding circuit when the substrate is cut.
9. A display module, which is characterized in that the display module is prepared by the preparation method of the display module according to any one of claims 1-8.

Description

Display module preparation method and display module Technical Field The invention relates to the technical field of display, in particular to a display module preparation method and a display module. Background Along with technical progress and aesthetic improvement of consumers, the terminal display needs to be thinned and the frame is further compressed, however, the screen body circuit of the current display module is led out from the display panel (also called a screen body), and the circuit binding is performed by using a pad binding (substrate bending) process, so that the frame of the screen body is larger, and the requirement of extremely narrow frame cannot be met. For this reason, there is a need to improve the existing display module. Disclosure of Invention The invention aims to provide a display module manufacturing method and a display module, which are used for solving the problem that a screen frame is large due to the adoption of a substrate bending process in the prior art. In order to achieve the above purpose, the present invention provides the following technical solutions: In a first aspect, a method for preparing a display module, the method comprising: A substrate is provided and a substrate is provided, Grooves are etched in the surface of the substrate, The binding wire is placed in the groove, The binding circuit is fixed in the groove in a magnetic control mode, Preparing a substrate on the surface of the substrate provided with the groove, wherein the binding circuit is fixed on one side of the substrate, which is close to the substrate; Preparing a screen layer on one side of the substrate far away from the base, etching the screen layer and the substrate to form a wire through hole, wherein the screen layer comprises a screen circuit, and the screen circuit is electrically connected with the binding circuit through the wire through hole; stripping the substrate from the base to expose the binding circuit on one side of the substrate close to the base, And providing a binding component, and electrically connecting the binding circuit with the binding component. Further, the binding circuit is arranged in a groove formed on the surface of the substrate and protrudes out of the surface of the substrate, the substrate covers the part of the binding circuit protruding out of the groove, Preferably, the substrate comprises a glass substrate. Further, the depth of the groove etched on the substrate is 7-10 μm. Further, the binding circuit comprises a connecting part and a conductive contact fixed on the connecting part; Preferably, the binding circuit is formed by a metal calendaring process, and the connection portion includes a metal substrate; preferably, the binding circuit has magnetism; preferably, the thickness of the binding wire is greater than or equal to 20 μm. The screen body circuit is electrically connected with a chip (IC) and a flexible circuit board (FPC) in the binding area mainly through the conductive contact pieces, and the process difficulty of placing a plurality of conductive contact pieces which are arranged in parallel in the groove is high, so that a metal substrate is used as a supporting piece when the binding circuit is prepared, and the whole binding circuit is conveniently placed in the groove. When the binding circuit is placed in the groove, the upper end part of the binding circuit is arranged outside the groove and protrudes out of the surface of the glass substrate, so that the substrate coated on the surface of the glass substrate can effectively wrap the protruding part of the upper end of the binding circuit after solidification, and the magnetic control is removed before the glass substrate and the substrate are subjected to laser stripping, so that the binding circuit is separated from the groove of the glass substrate after laser stripping and is fixedly embedded on the surface of the substrate. Further, the screen body layer comprises a dam and an organic packaging layer, and the organic packaging layer is located in an area surrounded by the dam. Further, the screen body layer comprises a packaging protection area and a cutting area, wherein the cutting area is outside the packaging protection area. In the preparation area, the display screen body layer is prepared by an ink-jet printing mode, and the ink needs to be spread and diffused to form a uniform film layer, so that in the process, in order to prevent the ink from overflowing out of the preparation area of the display module, a circle of dykes are required to be arranged at the edge of the preparation area of the display module, the ink is blocked by the dykes, and a circle of encapsulation protection area is arranged outside the area surrounded by the dykes. The packaging protection area is used for avoiding the damage of the display module due to the edge extension of the laser cutting part, so that the laser cutting part is positioned outside the packaging protection area. Furt