CN-119997701-B - Micro-distance high-speed MiniLED chip transfer device and method

CN119997701BCN 119997701 BCN119997701 BCN 119997701BCN-119997701-B

Abstract

The invention discloses a micro-distance high-speed MiniLED chip transfer device and a method, which belong to the technical field of chip conveying devices and methods, and comprise a workbench, a rack and a rack, wherein two ends of the workbench are respectively connected with a chip carrying disc and a conveying line, and the conveying line is arranged on a frame and extends along a preset direction for carrying and conveying a circuit board; the needling transfer mechanism comprises a first U-shaped frame arranged on the workbench, a first motor is fixedly installed on the first U-shaped frame, an output shaft of the first motor extends to a screw shaft on the side wall of the other end of the first U-shaped frame, a first sliding block fixed on a moving plate is spirally driven on the screw shaft, and first lifting cylinders are fixedly installed on two sides of the moving plate. The invention solves the technical problems that the prior transfer technology is difficult to realize the huge transfer of chips, the positioning precision of the chips is weakened after long-term use, and the consistency of the light emitting surface is poor because the swing arm transfer technology adopts a solder paste reflow mode for welding.

Inventors

LAI YUMENG
WU DEQI
LI JIALIN

Assignees

江西省东都智能装备科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250113

Claims (9)

1. Micro-pitch high-speed MiniLED chip transfer device, characterized by comprising: The two ends of the workbench in the width direction are respectively connected with a chip bearing disc and a conveying line, and the conveying line is arranged on the frame and extends along the length direction of the workbench to bear and convey the circuit board; The needling transfer mechanism comprises a first U-shaped frame which is arranged on the workbench and is arranged on the chip carrying disc and the conveying line in a crossing manner, a first motor is arranged on one side of the outer wall of the first U-shaped frame, an output shaft of the first motor is connected with a screw shaft which penetrates through the first U-shaped frame and is arranged along the width direction of the workbench, a first sliding block which is fixed on the movable plate is in spiral transmission on the screw shaft, a first lifting cylinder is fixedly arranged on two sides of the outer wall of the movable plate along the length direction of the workbench, and a piston rod of the first lifting cylinder is connected with a second lifting cylinder through a fixed block; The bottom of a piston rod on the second lifting cylinder is connected with a needle head matched with the piston rod, two sides of the piston rod on the second lifting cylinder are connected with a second sliding block through a first swinging rod, two ends of the first swinging rod are connected with the second lifting cylinder and the second sliding block through a rotating connection mode, the extending sections of the fixing blocks are arranged in a downward protruding mode and distributed on two sides of the first lifting cylinder, the second sliding block is connected with a sliding groove along the length direction of the extending sections of the fixing blocks, and the bottom of the second sliding block is connected with a cleaning brush attached to a chip in a contact mode through a support.
2. The macro high-speed MiniLED chip transfer device according to claim 1, further comprising a laser welding mechanism, wherein the laser welding mechanism comprises a support frame fixed on the workbench, the support frame is symmetrically arranged relative to the first U-shaped frame, and a welding head with an opening facing one side of the chip is connected to the support frame through a laser.
3. The micro-pitch high-speed MiniLED chip transfer device according to claim 2, further comprising a heat-seal drying mechanism, wherein the heat-seal drying mechanism comprises a second U-shaped frame fixed on a workbench and crossing a conveying line, third lifting cylinders are fixedly installed on two sides of the top of the second U-shaped frame, a piston rod on the third lifting cylinders penetrates through the second U-shaped frame and extends into an insulation box with a notch formed in the bottom, and a heater is installed in the height direction of the side wall of the insulation box.
4. The micro-pitch high-speed MiniLED chip transfer device according to claim 3, wherein a second motor is fixedly installed at the center of the top of the incubator, an output shaft of the second motor sequentially extends to a rotary pushing assembly and a turntable, the rotary pushing assembly is arranged in a cover body, the top end of the cover body is fixedly connected with the inner wall of the incubator through a stand column, the rotary pushing assembly comprises a first conical gear fixed on the output shaft of the second motor, two ends of the outer wall of the first conical gear are respectively meshed and driven with a bidirectional conical gear fixed on a telescopic piece, the outer wall of the bidirectional conical gear is meshed and driven with a second conical gear fixed on a first rotating shaft, the first rotating shaft and the telescopic piece are vertically arranged, and the outer wall of the first rotating shaft is fixedly connected with a first impeller; The telescopic part comprises a sleeve arranged in a hollow mode and a movable rod movably connected to the inner wall of the sleeve, limiting parts are fixedly arranged at two ends of the movable rod, and the limiting parts are connected with strip-shaped grooves along the length direction of the inner wall of the sleeve.
5. The high-speed MiniLED chip transfer device with micro-distance according to claim 4, wherein the edge of the outer wall of the first swinging rod is provided with a rolling groove arranged on a third sliding block, the third sliding block is connected with a baffle along the length direction of the inner wall of the incubator, the baffle is provided with a limit groove connected with the third sliding block, the first swinging rod is connected with the protruding part on the turntable through a second swinging rod, the two ends of the second swinging rod are respectively provided with the first swinging rod and the turntable in a rotating connection mode, and the corners of the second bevel gear and the bidirectional bevel gear are connected through an L-shaped bending rod.
6. The high-speed MiniLED chip transfer device with micro-distance according to claim 5, wherein a movable opening is connected to one side of the L-shaped bending rod, which is close to the first rotating shaft, a guide sleeve connected with the movable rod on the bidirectional bevel gear is arranged on the L-shaped bending rod, a fixed ring is integrally formed on the edge of the inner wall of the guide sleeve, and an annular groove connected with the outer wall of the movable rod and embedded inwards is arranged on the fixed ring.
7. The high-speed MiniLED chip transfer device with micro-distance according to claim 6, wherein one end of the first conical gear is meshed with a third conical gear fixed on a second rotating shaft, one end of the second rotating shaft is fixedly connected with a central shaft at a vent hole through a reciprocating screw, a vent plate is embedded in the vent hole, a through hole matched with the vent plate is formed in the vent plate, a second impeller contacted and attached to the outer wall of the vent plate is fixedly mounted on the central shaft, a fourth sliding block fixed on a pushing plate is spirally driven on the reciprocating screw, and a conical part corresponding to the through hole is connected on the pushing plate.
8. The macro high speed MiniLED chip transfer apparatus according to claim 7, wherein the horizontal central axes of the second rotating shaft, the reciprocating screw and the central shaft are all maintained on the same axis, and a central hole connected with the central shaft is formed at the center of the ventilation plate.
9. The high-speed MiniLED chip transfer method for the high-speed MiniLED chip transfer device of any one of claims 1 to 8, comprising the following steps: S1.1, starting a first lifting cylinder to enable a needling mechanism to reach a specified height, matching with a second lifting cylinder, needling on a chip through a needle head, transferring the chip to a circuit board on a conveying line, aligning the chip with a bonding point of the circuit board, and separating the chip from the circuit board in the lifting process of the needle head under the welding action of a laser; s1.2, in the conveying process of a conveying line, heat-sealing the chip shell on the chip, so that the chip is correspondingly protected; S1.3, a third lifting cylinder drives the heat insulation box to cover the chip shell, the heater is started, the drying treatment is realized at the joint between the chip shell and the chip, meanwhile, a second motor is started, and under the action of mechanical transmission, the first impeller uniformly distributes heat to the chip; s1.4, step S1.3 in-process, when the second motor starts, can drive the second impeller and rotate, carry out certain emission with inside heat, prevent that the inside temperature of insulation can from being too high, drive toper portion reciprocating motion to on the through-hole simultaneously to prevent the through-hole department on the ventilating board from blockking up.

Description

Micro-distance high-speed MiniLED chip transfer device and method Technical Field The invention belongs to the technical field of chip transfer devices and methods, and particularly relates to a MiniLED chip transfer device and method with high micro-distance and high speed. Background MiniLED is used as a next generation novel display technology, and has the potential to replace the original technology in a plurality of fields by virtue of the advantages of high resolution, high brightness, high contrast, high color saturation, low power consumption, high reaction speed, thin thickness, long service life and the like, and subversion change is brought to a display terminal. MiniLED is an LED display chip with a die size of about 100-200 ym. By combining the flip chip COB or IMD technology, miniLED direct display can realize dot spacing display below 1MM, pixel density is high, and high gray scale display under low brightness can be realized. Meanwhile, miniLED is used as a backlight source to be applied to a liquid crystal display screen, and can improve contrast through regional dimming, so that the fine display effects of HDR and the like are realized. MiniLED display technology is an important technology for realizing high brightness, high contrast and high color gamut of LCD, which uses a large number of MiniLED chips arranged in an array, has ultrahigh brightness, supports local dimming, brings finer HDR partition, realizes ultrahigh contrast, realizes ultrahigh color gamut by matching with a colored conversion film, and MiniLED display technology mainly comprises a backlight display technology and a direct display technology. At present, a main stream MiniLED chip transfer adopts a swing arm type transfer technology, the swing arm type transfer technology utilizes a suction nozzle at the end part of a driving shaft of a linear motion device, the suction force is utilized to pick up the chip, the suction nozzle is driven to rotate to the upper part of a target substrate through a rotary motion device, and an air path is disconnected to release the chip to the target substrate. The initial yield can reach 99.99%, but the single-arm transfer speed is only 4-5 particles/s, so that the huge transfer of chips is difficult to realize, and the positioning accuracy of the chips is weakened after long-term use. Because swing arm transfer technique adopts solder paste backward flow's mode welding, the light-emitting surface uniformity is not good, so visual experience is weaker relatively, in addition, when the encapsulation is on the chip through the shell, can play good peripheral guard action to the chip after the welding, the shell carries out the heat-seal in-process and need carry out stoving work to it moreover, so guarantee that the effectual installation of shell is outside the chip, current stoving structural design is more complicated, the operation is more troublesome, the stoving effect to the chip is relatively poor, can not evenly dry the chip, be unfavorable for the takeout of product, and then influence the stoving shaping operation of product. Disclosure of Invention The invention aims to provide a micro-distance high-speed MiniLED chip transfer device and a micro-distance high-speed MiniLED chip transfer method, which are used for solving the technical problems that the prior transfer technology is difficult to realize huge transfer of chips, the positioning accuracy of the chips is weakened after long-term use, and the consistency of a light emitting surface is poor because a solder paste reflow mode is adopted in a swing arm transfer technology. In order to achieve the above purpose, the present invention adopts the following technical scheme: A macro high speed MiniLED chip transfer device comprising: the two ends of the workbench are respectively connected with a chip bearing disc and a conveying line, and the conveying line is arranged on the frame and extends along a preset direction for bearing and conveying the circuit board; the needling transfer mechanism comprises a first U-shaped frame arranged on the workbench, a first motor is fixedly arranged on the first U-shaped frame, an output shaft of the first motor extends to a screw shaft on the side wall of the other end of the first U-shaped frame, a first sliding block fixed on a moving plate is in spiral transmission on the screw shaft, first lifting cylinders are fixedly arranged on two sides of the moving plate, and a piston rod of each first lifting cylinder is connected with a second lifting cylinder through a fixed block; The bottom of a piston rod on the second lifting cylinder is connected with a needle head matched with the piston rod, two sides of the piston rod on the second lifting cylinder are connected with a second sliding block through a first swinging rod, two ends of the first swinging rod are connected with the second lifting cylinder and the second sliding block through a rotating connection mode, the second slidin