CN-120152140-B - Fully shielded stacked radio frequency transmission line and manufacturing method thereof

CN120152140BCN 120152140 BCN120152140 BCN 120152140BCN-120152140-B

Abstract

The application provides a full-shielding type stacked radio frequency transmission line which comprises a signal line, a first lateral shielding body, a second lateral shielding body, a first shielding line and a second shielding line, wherein the first lateral shielding body, the first shielding line, the second lateral shielding body and the second shielding line are sequentially connected end to form a shielding cavity, and the signal line is arranged in the shielding cavity. The full-shielding type stacked radio frequency transmission line provided by the application has the advantage of high frequency shielding. In addition, the application also provides a manufacturing method of the full-shielding type stacked radio frequency transmission line.

Inventors

LIU LIKUN
WANG CHAO
LI YANG

Assignees

宏启胜精密电子(秦皇岛)有限公司
鹏鼎控股(深圳)股份有限公司

Dates

Publication Date: 20260508
Application Date: 20231213

Claims (10)

1. A manufacturing method of a full-shielding type stacked radio frequency transmission line is characterized by comprising the following steps: providing a core plate, wherein the core plate is divided into a shielded area, a first enclosing area and a second enclosing area, the shielded area is arranged between the first enclosing area and the second enclosing area, the shielded area is provided with a signal circuit, the first enclosing area is provided with a first inner side conducting body, and the second enclosing area is provided with a second inner side conducting body; A first side plate is arranged on one side of the core plate, the first side plate comprises a first outer side conducting body, a second outer side conducting body and a first shielding circuit, the first shielding circuit is connected between the first outer side conducting body and the second outer side conducting body, the first outer side conducting body is arranged corresponding to the first enclosing area, the second outer side conducting body is arranged corresponding to the second enclosing area, the first shielding circuit is arranged corresponding to the shielding area, the first outer side conducting body is connected with one end of the first inner side conducting body, and the second outer side conducting body is connected with one end of the second inner side conducting body; A second side plate is arranged on the other side of the core plate, the second side plate comprises a third outer side conducting body, a fourth outer side conducting body and a second shielding circuit, the second shielding circuit is connected between the third outer side conducting body and the fourth outer side conducting body, the third outer side conducting body is arranged corresponding to the first enclosing area, the fourth outer side conducting body is arranged corresponding to the second enclosing area, the second shielding circuit is arranged corresponding to the shielding area, the third outer side conducting body is connected with the other end of the first inner side conducting body, and the fourth outer side conducting body is connected with the other end of the second inner side conducting body; Removing a part of the first inner side conducting body, a part of the first outer side conducting body and a part of the third outer side conducting body corresponding to the first enclosing region, wherein the other part of the first outer side conducting body, the other part of the first inner side conducting body and the other part of the third outer side conducting body are sequentially connected to form a first lateral shielding body, and two ends of the first lateral shielding body are respectively connected with one end of the first shielding circuit and one end of the second shielding circuit; And removing part of the second inner side conducting body, part of the second outer side conducting body and part of the fourth outer side conducting body corresponding to the second enclosing region, and sequentially connecting the other part of the second outer side conducting body, the other part of the second inner side conducting body and the other part of the fourth outer side conducting body to form a second lateral shielding body, wherein two ends of the second lateral shielding body are respectively connected with the other end of the first shielding circuit and the other end of the second shielding circuit to obtain the full-shielding stacked radio frequency transmission line.
2. The method of manufacturing of claim 1, wherein the core further comprises an inner insulating layer, the signal lines comprising a first signal line and a second signal line, the first signal line and the second signal line being disposed on opposite sides of the inner insulating layer, respectively, the method of manufacturing the core comprising the steps of: A first slotting and a second slotting are arranged on an inner substrate, the inner substrate comprises an inner insulating layer, a first inner copper foil layer and a second inner copper foil layer, the first inner copper foil layer and the second inner copper foil layer are arranged on two opposite sides of the inner insulating layer, and the first slotting and the second slotting penetrate through the first inner copper foil layer and the inner insulating layer; the first inner side guide body is arranged in the first slot, the second inner side guide body is arranged in the second slot, and Etching the first inner copper foil layer to form the first signal line layer, and etching the second inner copper foil layer to form the second signal line layer.
3. The method of manufacturing of claim 1, wherein the first side plate further comprises a first outside insulating layer, the method of manufacturing the first side plate comprising the steps of: A first through hole and a second through hole are formed in the first outer substrate, the first outer substrate comprises the first outer insulating layer and a first outer copper foil layer, the first outer insulating layer is arranged between the core board and the first outer copper foil layer, and the first through hole and the second through hole penetrate through the first outer copper foil layer and the first outer insulating layer; the first outside through-hole is provided with the first outside through-body, and the second outside through-hole is provided with the second outside through-body, and Etching the first outer copper foil layer to form the first shielding circuit.
4. The method of manufacturing of claim 1, wherein the second side plate further comprises a second outside insulating layer, the method of manufacturing the second side plate comprising the steps of: a third through hole and a fourth through hole are formed in the second outer substrate, the second outer substrate comprises the second outer insulating layer and a second outer copper foil layer, the second outer insulating layer is arranged between the core board and the second outer copper foil layer, and the third through hole and the fourth through hole penetrate through the second outer copper foil layer and the second outer insulating layer; Providing the third outer via in the third through hole, and providing the fourth outer via in the fourth through hole, and Etching the second outer copper foil layer to form the second shielding circuit.
5. The method of manufacturing of claim 1, further comprising the step of: a first adhesive layer is arranged between one side of the core plate and the first side plate, the first outer side guide body and the second outer side guide body penetrate through the first adhesive layer, A second bonding layer is arranged between the other side of the core plate and the second side plate, and the third outer side through body and the fourth outer side through body penetrate through the second bonding layer.
6. The method of manufacturing according to claim 1, wherein the first outer via and the third outer via are each formed at both ends of the first inner via by electroplating, and the second outer via and the fourth outer via are each formed at both ends of the second inner via by electroplating.
7. The method of claim 1, wherein a portion of the first inner via, a portion of the first outer via, and a portion of the third outer via corresponding to the first enclosed region are removed by laser etching, and a portion of the second inner via, a portion of the second outer via, and a portion of the fourth outer via corresponding to the second enclosed region are removed by laser etching.
8. The method of manufacturing of claim 1, further comprising the step of: A first protective layer is arranged on the first shielding circuit, the first protective layer covers one end of the first lateral shielding body and one end of the second lateral shielding body, And a second protection layer is arranged on the second shielding circuit, and the second protection layer covers the other end of the first lateral shielding body and the other end of the second lateral shielding body.
9. The method of manufacturing of claim 1, further comprising the step of: Providing a third protective layer on the first side shield, and And a fourth protective layer is arranged on the second lateral shielding body.
10. A fully shielded stacked radio frequency transmission line manufactured by the method for manufacturing a fully shielded stacked radio frequency transmission line according to any one of claims 1 to 9, comprising a signal line, a first lateral shield, a second lateral shield, a first shield line, and a second shield line, wherein the first lateral shield, the first shield line, the second lateral shield, and the second shield line are sequentially connected end to form a closed shield cavity, the signal line is disposed in the shield cavity, the first lateral shield and the second lateral shield are respectively disposed on opposite sides of the signal line, and the first shield line and the second shield line are respectively disposed on opposite sides of the signal line.

Description

Fully shielded stacked radio frequency transmission line and manufacturing method thereof Technical Field The invention belongs to the field of circuit board manufacturing, and particularly relates to a full-shielding type stacked radio frequency transmission line and a manufacturing method thereof. Background With rapid progress in wireless communication technology, particularly popularization and application of 5G technology, performance standards for radio frequency transmission lines and antennas of mobile devices are increasingly improved. This need is mainly manifested in two aspects, namely the requirement for high-frequency signal transmission capability and the desire for electromagnetic shielding performance. For frequencies up to 50GHz and above, it is difficult for existing shielding methods to achieve the desired electromagnetic shielding performance in these ultra-high frequency bands, which directly affects the overall performance and signal quality of the wireless communication system. Disclosure of Invention In order to solve the above defects in the prior art, the application provides a full-shielding type stacked radio frequency transmission line so as to provide high-quality electromagnetic shielding in high-frequency transmission. A manufacturing method of a full-shielding type stacked radio frequency transmission line comprises the following steps: The method comprises the steps of providing a core plate, wherein the core plate is divided into a shielded area, a first enclosing area and a second enclosing area, the shielded area is arranged between the first enclosing area and the second enclosing area, a signal line is arranged in the shielded area, a first inner side conducting body is arranged in the first enclosing area, and a second inner side conducting body is arranged in the second enclosing area. The first side plate comprises a first outer side conducting body, a second outer side conducting body and a first shielding circuit, wherein the first shielding circuit is connected between the first outer side conducting body and the second outer side conducting body, the first outer side conducting body corresponds to the first enclosing area, the second outer side conducting body corresponds to the second enclosing area, the first shielding circuit corresponds to the shielding area, the first outer side conducting body is connected with one end of the first inner side conducting body, and the second outer side conducting body is connected with one end of the second inner side conducting body. The second side plate comprises a third outer side conducting body, a fourth outer side conducting body and a second shielding circuit, the second shielding circuit is connected between the third outer side conducting body and the fourth outer side conducting body, the third conducting body corresponds to the first enclosing area, the fourth outer side conducting body corresponds to the second enclosing area, the second shielding circuit corresponds to the shielding area, the third outer side conducting body is connected with the other end of the first inner side conducting body, and the fourth outer side conducting body is connected with the other end of the second inner side conducting body. And removing part of the first inner side conducting body, part of the first outer side conducting body and part of the third outer side conducting body corresponding to the first enclosing region, wherein the other part of the first outer side conducting body, the other part of the first inner side conducting body and the other part of the third outer side conducting body are sequentially connected to form a first lateral shielding body, and two ends of the first lateral shielding body are respectively connected with one end of the first shielding circuit and one end of the second shielding circuit. And removing part of the second inner side conducting body, part of the second outer side conducting body and part of the fourth outer side conducting body corresponding to the second enclosing region, and sequentially connecting the other part of the second outer side conducting body, the other part of the second inner side conducting body and the other part of the fourth outer side conducting body to form a second lateral shielding body, wherein two ends of the second lateral shielding body are respectively connected with the other end of the first shielding circuit and the other end of the second shielding circuit to obtain the full-shielding stacked radio frequency transmission line. In some possible embodiments, the core further comprises an inner insulating layer, the signal lines comprise a first signal line and a second signal line, the first signal line and the second signal line are respectively arranged on two opposite sides of the inner insulating layer, the manufacturing method of the core comprises the steps of arranging a first slot and a second slot on an inner substrate, wherein the inner s