CN-120388929-B - Multifunctional traceless carrying wafer end effector

CN120388929BCN 120388929 BCN120388929 BCN 120388929BCN-120388929-B

Abstract

The invention provides a multifunctional traceless carrying wafer end effector, wherein one side of a wafer finger is provided with an air flow groove, a plurality of connecting holes are formed in the air flow groove, an adsorption device is fixedly connected to the wafer finger through the connecting holes, a vacuum pumping hole is formed in the end of the air flow groove, the adsorption device comprises an elastic sucker and a traceless contact pad, the top of the elastic sucker is fixedly connected to the wafer finger through the connecting holes, the traceless contact pad is detachably connected to the bottom of the elastic sucker, the inside of the elastic sucker is communicated with the air flow groove, the vacuum pumping hole is connected with a vacuum pump, and the vacuum pump is used for enabling the inside of the elastic sucker to form a vacuum environment so as to enable the contact surface of the bottom of the traceless contact pad to be in close contact with the surface of a wafer to be carried, and realizing the traceless carrying of the wafer. The multifunctional traceless carrying wafer end effector provided by the invention realizes the compatibility of multiple transmission modes of the same end effector.

Inventors

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Assignees

深圳市埃芯半导体科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250411

Claims (6)

1. The multifunctional traceless carrying wafer end effector comprises a wafer finger and an operating mechanical arm detachably connected with the wafer finger, and is characterized in that the adsorption principle of the adsorption device is changed or the adsorption number generated by the adsorption device is changed by replacing traceless contact pads of different types based on the detachable structure of a plurality of adsorption devices, and the multifunctional traceless carrying wafer end effector further comprises a plurality of adsorption devices and a vacuum pump, wherein: the wafer finger is provided with a gas flow groove at one side, a plurality of connecting hole sites are arranged on the gas flow groove, the adsorption device is fixedly connected to the wafer finger through the connecting hole sites, and a vacuum pumping hole is arranged at the terminal of the gas flow groove; The adsorption device comprises an elastic sucker and a traceless contact pad, wherein the top of the elastic sucker is fixedly connected to a wafer finger through a connecting hole site; the vacuum pump is used for forming a vacuum environment inside the elastic sucker so as to enable the contact surface at the bottom of the traceless contact pad to be in close contact with the surface of the wafer to be conveyed, and therefore traceless conveying of the wafer is achieved; the seamless contact pad is detachably clamped in the elastic sucker cavity through the clamping ring; the traceless contact pad comprises a vacuum chuck pad, wherein the vacuum chuck pad is used for enabling the inside of the elastic chuck to form a vacuum environment when the vacuum pump is started, so that the surface of the wafer to be conveyed is adsorbed on the contact surface of the bottom of the vacuum chuck pad, and the traceless conveying of the wafer is realized; The traceless contact pad comprises a cyclone sucker pad, wherein a cyclone nozzle is arranged on the side edge of the cyclone sucker pad, and the cyclone nozzle is communicated with the airflow groove when the cyclone sucker pad is detachably connected to the bottom of the elastic sucker; the cyclone sucker pad is used for providing a supply gas from the vacuum suction hole to the airflow groove, spraying the supply gas at a high speed through the airflow groove at the cyclone nozzle, forming a rotating airflow in the cyclone sucker pad, forming a pressure difference on two sides of the wafer surface to be conveyed based on the rotating airflow, and further enabling the wafer surface to be conveyed to be adsorbed on the contact surface of the bottom of the cyclone sucker pad based on the pressure difference; The traceless contact pad comprises a solid sucker pad, wherein when any adsorption device is formed by detachably connecting the elastic sucker and the solid sucker pad, the adsorption device cannot adsorb wafers to be carried.
2. The multifunctional traceless wafer handling end effector as set forth in claim 1, wherein the lower portion of the elastic suction cup is configured as an upwardly open horn structure according to a predetermined suction cup angle, and the bottom of the horn structure is detachably connected to a snap ring at the upper portion of the traceless contact pad.
3. The multi-functional, traceless handling wafer end effector of claim 2, wherein the lower portion of the traceless contact pad is configured as a downwardly open horn-like structure according to a predetermined contact pad angle, the predetermined contact pad angle being matched with a predetermined chuck angle.
4. The multi-functional traceless handling wafer end effector of claim 1, wherein an outer wall of the upper clasp of the traceless contact pad is configured to an outer wall optimized arc and an inner wall of the lower portion of the resilient suction cup is configured to an inner wall optimized arc that matches the outer wall optimized arc.
5. The multi-purpose traceless handling wafer end effector as set forth in claim 1, wherein: the upper part of the elastic sucker is provided with an elastically compressible corrugated pipe structure, and the top of the corrugated pipe structure is fixedly connected to the wafer finger through a connecting hole site; The bellows structure is used for changing the adsorption angle and the adsorption height of the adsorption device through elastic compression so as to meet different adsorption requirements of wafers to be carried.
6. The multi-purpose traceless handling wafer end effector as set forth in claim 1, wherein the traceless contact pad bottom contact surface is provided with grooves.

Description

Multifunctional traceless carrying wafer end effector Technical Field The invention relates to the technical field of semiconductor industry, in particular to a multifunctional traceless carrying wafer end effector. Background In the semiconductor field, a robot is often used to transfer the wafer, and subsequent processing and inspection processes. In the process of wafer transfer, the wafer needs to be fixed, and common transfer modes adopted by the end effector include mechanical clamping, vacuum adsorption, bernoulli adsorption and the like, so that the wafer is transferred into a station or a chamber. In the carrying process, the mechanical clamping type end effector can grasp the wafer by driving the gears of the clamping mechanism to reciprocate through a motor, but the wafer is easy to damage due to certain clamping force, the carrying efficiency is low, the Bernoulli adsorption type end effector is applicable to thin sheets and has limitations, and the vacuum adsorption type wafer end effector has high carrying efficiency and wide application and is easy to leave adsorption marks on the wafer. Thus, in the semiconductor industry today, end effectors may be required to have the ability to adsorb warpage and bond pads. However, when the requirement of various wafers is met, besides the limitations of the existing mechanical clamping type end effector and the existing Bernoulli type end effector, the vacuum adsorption type end effector cannot be used for adsorbing wafers with warpage, and the end effector cannot be compatible with the adsorption of wafers with various specifications and sizes. The common coping operation for these problems is to replace the corresponding end effector and debug again, which is complicated in operation and long in replacement time, and greatly affects the working efficiency. Disclosure of Invention The invention aims to provide a multifunctional traceless carrying wafer end effector so as to solve the technical problems, realize simple replacement operation and meet the requirements of carrying various wafers. In order to solve the technical problems, the invention provides a multifunctional traceless carrying wafer end effector, which comprises a wafer finger, an operation mechanical arm detachably connected with the wafer finger, a plurality of adsorption devices and a vacuum pump, wherein: the wafer finger is provided with a gas flow groove at one side, a plurality of connecting hole sites are arranged on the gas flow groove, the adsorption device is fixedly connected to the wafer finger through the connecting hole sites, and a vacuum pumping hole is arranged at the terminal of the gas flow groove; The adsorption device comprises an elastic sucker and a traceless contact pad, wherein the top of the elastic sucker is fixedly connected to a wafer finger through a connecting hole site; The vacuum pump is used for enabling the inside of the elastic sucker to form a vacuum environment, so that the contact surface at the bottom of the traceless contact pad is in close contact with the surface of the wafer to be carried, and the traceless carrying of the wafer is realized. The adsorption device is formed by detachably connecting the elastic sucking disc and the traceless contact pad, is fixedly connected to the wafer finger through the elastic sucking disc, is internally communicated with an airflow groove on the wafer finger, is connected with a vacuum pump through a vacuum suction hole at the terminal of the airflow groove, and is used for adsorbing wafers through vacuumizing operation, so that the wafer conveying process is realized, the structure of the wafer conveying device is simplified, the traceless contact pad is adopted, adsorption marks are not left on the surface of the wafer in the conveying process, the adsorption principle of the adsorption device or the adsorption number generated by the adsorption device is changed by replacing the traceless contact pads of different types based on the detachable structure of the adsorption device, the adsorption conveying mode of the wafer finger is changed, the compatibility of the wafer conveying modes with various specifications on the same end effector is realized, the quick switching operation is convenient, and the working efficiency is greatly improved. Further, a clamping ring is arranged on the upper portion of the traceless contact pad, and the traceless contact pad is detachably clamped in the cavity of the elastic sucker through the clamping ring. In the scheme, through setting up the snap ring structure on no trace contact pad upper portion, in inserting the elastic sucking disc with the snap ring structure from bottom joint, realize with the detachable of elastic sucking disc simply swiftly being connected, and be difficult for droing, be convenient for carry out the replacement of corresponding type no trace contact pad fast when treating the wafer in the face of the difference. The vacuum chuck pad is used