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CN-120462833-B - Semiconductor plug-in material discharging system and semiconductor plug-in material discharging method

CN120462833BCN 120462833 BCN120462833 BCN 120462833BCN-120462833-B

Abstract

A semiconductor plug-in discharging system and a discharging method thereof, wherein the system comprises a vibration disc, a spiral material plate is arranged on the inner wall of the vibration disc, and the tail end of the spiral material plate is connected with a main material groove extending to the outside of the vibration disc. The vibrating tray is characterized in that a spiral groove is formed in the inner wall of the vibrating tray and corresponds to the connecting part of the spiral material plate, a notch is formed in one side of the middle section of the main material groove, the width of the notch is larger than or equal to half of the width of the bottom plate of the main material groove, the notch is connected with a branch material groove, the branch material groove is communicated with the main material groove, a stop lever is arranged on the inner wall of a side plate opposite to the notch of the main material groove in parallel, a gap is formed between the stop lever and the bottom plate of the main material groove, a notch is formed in the middle section of the stop lever, the width of the notch is larger than the width of a pin, the tail ends of the branch material groove and the main material groove are respectively connected to two ends of an arc-shaped track, and a material taking point is arranged in the middle section of the arc-shaped track. The scheme can multiply improve the triode quantity of the vibration disc arrangement output, and effectively reduces the influence on the lifting efficiency of the plug-in equipment.

Inventors

  • ZHOU HANHUA

Assignees

  • 四川中瀚智造科技有限公司

Dates

Publication Date
20260508
Application Date
20250619

Claims (9)

  1. 1. The semiconductor plug-in component discharging system comprises a vibrating disc (1), wherein a spiral material plate (11) is arranged on the inner wall of the vibrating disc, and the tail end of the spiral material plate (11) is connected with a main trough (2) extending to the outside of the vibrating disc (1), and is characterized in that: a spiral groove (12) is formed in the inner wall of the vibration disc (1) at a position corresponding to the connection part of the spiral material plate (11) and used for accommodating pins of the triode, and the track of the spiral groove (12) is consistent with the track of the spiral material plate (11); the width of the spiral material plate (11) is smaller than the width of the triode plastic package body and is larger than half of the width; The section of the main trough (2) is U-shaped, the U-shaped main trough comprises a bottom plate and side plates arranged on two sides of the bottom plate, a notch (21) is formed in one side of the middle section of the main trough (2), the width of the notch (21) is larger than or equal to half of the width of the bottom plate of the main trough (2), the notch (21) is connected with a branch trough (3), the branch trough (3) is communicated with the main trough (2), the bottom surface of the branch trough (3) is inclined downwards relative to the bottom surface of the main trough (2), a stop lever (22) is arranged on the inner wall of the side plate opposite to the notch (21) in parallel, a gap is formed between the stop lever (22) and the bottom plate of the main trough (2), a notch (221) is formed in the middle section of the stop lever (22), and the width of the notch (221) is larger than the width of a pin; the tail ends of the branch trough (3) and the main trough (2) are respectively connected with two ends of an arc-shaped rail (4), and a material taking point is arranged in the middle section of the arc-shaped rail (4).
  2. 2. The semiconductor package discharging system according to claim 1, wherein the rear ends of the main trough (2) and the branch trough (3) are inclined downward, the horizontal heights of the rear ends of the main trough (2) and the branch trough (3) are higher than the horizontal height of the middle section of the arc-shaped rail (4), and the middle section of the arc-shaped rail (4) is the lowest position of the arc-shaped rail (4).
  3. 3. A semiconductor package discharging system according to claim 1, wherein the cross sections of the main trough (2) and the branch trough (3) are inclined outwards.
  4. 4. The semiconductor package discharging system according to claim 1, wherein a baffle (41) is provided at a middle section of the arc-shaped rail (4), and a triode directly contacted with both sides of the baffle (41) on the arc-shaped rail (4) is located at a material taking point.
  5. 5. The semiconductor package discharging system according to claim 1, wherein the arc-shaped rail (4) is disconnected from the middle portion and forms a left side rail and a right side rail, a material taking point is formed between the left side rail and the right side rail, a sliding plate (5) is arranged between the left side rail and the right side rail in a penetrating manner along the radial direction of the arc-shaped rail (4), the sliding plate (5) is arranged in a moving manner along the penetrating direction, a left notch (51) and a right notch (52) are arranged in the sliding plate (5) along the moving direction, and the left notch (51) and the right notch (52) face the left side rail and the right side rail respectively.
  6. 6. A semiconductor package discharging system according to claim 5, wherein a plurality of sensors (6) are provided along the conveying track on the left and right rails for sensing the transistors in the left and right rails.
  7. 7. A discharging method using the semiconductor package discharging system according to claim 6, wherein the sliding plate (5) is moved to move the left notch (51) between the left rail and the right rail when all the sensors (6) on the left rail detect the transistor, and the sliding plate (5) is moved to move the right notch (52) between the left rail and the right rail when all the sensors (6) on the right rail detect the transistor.
  8. 8. A method of discharging a semiconductor package discharging system according to claim 7, wherein the sensors (6) are uniformly and intermittently arranged in front of the left and right rails.
  9. 9. A method of discharging a semiconductor package discharging system according to claim 7, wherein the slide plate (5) is provided on a movable rod of a telescopic cylinder (7).

Description

Semiconductor plug-in material discharging system and semiconductor plug-in material discharging method Technical Field The invention belongs to the technical field of semiconductor plug-in discharging, and particularly relates to a semiconductor plug-in discharging system and a semiconductor plug-in discharging method. Background When the circuit board assembly is manufactured, various electronic components are required to be mounted on the circuit board, the process is also called as a plug-in, and the plug-in work is gradually changed from a traditional manual plug-in to an automatic plug-in along with the improvement of production efficiency. In order to facilitate automatic grabbing of various electronic components, an automatic discharging device is usually arranged at the front end of an automatic plug-in device to discharge the electronic components, the arranged electronic components are conveyed to a material taking position of the plug-in device, and the plug-in device takes away and installs the electronic components at the material taking position through a claw or a suction nozzle. The triode is a commonly used electronic component, and a commonly used packaging structure comprises a plastic package body with a cuboid structure and pins extending to two sides of the plastic package body, wherein three pins are arranged on the triode, one pin is positioned on one side of the plastic package body, and the other two pins are oppositely arranged on the other side of the plastic package body. And when the triode is inserted into the circuit board, the pins are aligned with the bonding pads on the circuit board, and the triode is fixed on the circuit board in a welding mode. The existing discharging technology adopts a vibrating disk to discharge materials, utilizes a spiral track arranged in the vibrating disk to convey triodes, achieves the purpose of screening discharging materials in the conveying process, and finally only triodes with consistent pin orientation can be output from the tail end of the spiral track, and triodes with the pin orientation not meeting the requirements automatically fall into the vibrating disk to continuously participate in discharging materials. The existing discharging equipment can only output triodes in one gesture, and ensures the consistency of the postures of the triodes when the plug-in equipment is used, but more triodes are required to fall back to the vibration disc to participate in discharging repeatedly, so that the discharging efficiency of the triodes is reduced, and the efficiency of the plug-in equipment is improved. Disclosure of Invention In order to solve the defects in the prior art, the invention provides the semiconductor plug-in discharging system and the semiconductor plug-in discharging method, which multiply increase the number of triodes arranged and output by the vibration disc and effectively reduce the influence on the lifting efficiency of plug-in equipment. In order to achieve the object of the invention, the following scheme is adopted: A semiconductor plug-in discharging system comprises a vibration disc, wherein a spiral material plate is arranged on the inner wall of the vibration disc, and the tail end of the spiral material plate is connected with a main trough extending to the outside of the vibration disc. A spiral groove is formed in the inner wall of the vibration disc at a position corresponding to the connection part of the spiral material plate and used for accommodating pins of the triode, and the track of the spiral groove is consistent with that of the spiral material plate; The width of the spiral material plate is smaller than the width of the triode plastic package body and is larger than half of the width; The section of the main trough is U-shaped, the main trough comprises a bottom plate and side plates arranged on two sides of the bottom plate, one side of the middle section of the main trough is provided with a notch, the width of the notch is greater than or equal to half of the width of the bottom plate of the main trough, the notch is connected with a branch trough, the branch trough is communicated with the main trough, the bottom surface of the branch trough is inclined downwards relative to the bottom surface of the main trough, stop rods are arranged on the inner walls of the side plates, opposite to the notch, of the main trough in parallel, gaps are reserved between the stop rods along the bottom plate of the main trough, the middle section of the stop rods is provided with notches, and the width of the notch is greater than the width of a pin; The tail ends of the branch trough and the main trough are respectively connected with two ends of an arc-shaped rail, and a material taking point is arranged in the middle section of the arc-shaped rail. The vibrating disk coupling has the advantages that the vibrating disk coupling is simpler, the triodes with the pins facing different directions can be output