CN-120640558-B - Chip mounting device for processing semiconductor chip

Abstract

The invention discloses a chip mounting device for processing a semiconductor chip, which relates to the technical field of chip processing, and is characterized in that a PCB (printed circuit board) is placed on a placing frame, a clamping plate is driven to clamp the upper side and the lower side of the PCB through rotation of a threaded rod, after clamping is finished, the surface of the PCB is covered with solder paste through forward and backward movement of a paste brushing plate, a scraper knife is driven to move while the paste brushing plate moves, the scraper knife moves backwards at first, impurities on the surface of the PCB are scraped off by the backward movement of the scraper knife, the impurities such as dust and scraps can be possibly stained on the PCB in the production process, the impurities can be effectively removed by cleaning the scraper knife, the solder paste is coated and shoveled when the scraper knife moves forwards, the uneven part of the surface of the PCB can be scraped off by the scraper knife, the condition that the thickness of the solder paste is inconsistent is avoided, the stirring rod rotates when a solder paste tank moves, air in the solder paste can be discharged, solder mask volatilization is reduced, and the solder ball problem caused by air condensation is avoided.

Inventors

• GAO HENG
• CHEN FENG
• SHEN XIAOLING

Assignees

• 东莞市中锦旺电子有限公司

Dates

Publication Date

20260508

Application Date

20250620

Claims (1)

1. 1. The utility model provides a paster device is used in semiconductor chip processing, includes chassis (1), the surface of chassis (1) is provided with the cylinder, its characterized in that is used for carrying out the paster to the PCB board, includes: The fixing frame (2), the said fixing frame (2) is fixedly installed at the output end of the air cylinder; the solder paste tank (3) is slidably arranged on the surface of the fixing frame (2); the eccentric rod (4) is rotatably arranged on the surface of the fixing frame (2); The connecting rod (5), one side of the connecting rod (5) is rotatably arranged on the surface of the eccentric rod (4), and the other side of the connecting rod (5) is rotatably arranged on the circumferential surface of the solder paste tank (3); the paste brushing plate (6) is fixedly arranged at the bottom of the solder paste tank (3); the rack (8) is fixedly arranged on the inner wall of the fixing frame (2); The gear (9) is rotatably arranged at the top of the solder paste tank (3), and the gear (9) is meshed with the toothed bar frame (8); The stirring rod (10) is fixedly arranged at the bottom of the gear (9); The placing rack (11) is rotatably arranged on the surface of the underframe (1); the threaded rod (12) is rotatably arranged on the inner wall of the placing frame (11); The clamping plate (13) is arranged on the circumferential surface of the threaded rod (12) in a threaded manner; The coating device further comprises a scraper knife (7) and a rotating rod (14), wherein the scraper knife (7) is fixedly arranged at the rear side of the paste brushing plate (6), the rotating rod (14) is rotatably arranged on the inner wall of the underframe (1), and the rotating rod (14) is in transmission connection with the placing frame (11) through a first belt; the top of the underframe (1) is provided with a patch device for performing patch on the bottom of the PCB and a feeding device for automatically feeding the patches; The surface mounting device comprises a positioning rod (20) and a positioning plate (21), wherein the positioning rod (20) is fixedly arranged on the circumferential surface of the rotating rod (14), the positioning plate (21) is fixedly arranged on the surface of the positioning rod (20), and a rubber pad is arranged on the inner wall of the positioning plate (21); The patch device further comprises an electric push rod (22) and a patch board (23), wherein the fixed end of the electric push rod (22) is fixedly arranged at the top of the underframe (1), and the patch board (23) is fixedly arranged at the output end of the electric push rod (22); the paste brushing plate (6) is communicated with the tin paste tank (3), and a hairbrush is arranged at the bottom of the paste brushing plate (6); The patch device further comprises an elastic telescopic rod (24), a supporting plate (25) and a braking rod (26), wherein the fixed end of the elastic telescopic rod (24) is fixedly arranged at the top of the underframe (1), the supporting plate (25) is fixedly arranged at the movable end of the elastic telescopic rod (24), and the braking rod (26) is fixedly arranged at the movable end of the elastic telescopic rod (24).

Description

Chip mounting device for processing semiconductor chip Technical Field The invention relates to the technical field of chip processing, in particular to a chip mounting device for semiconductor chip processing. Background A chip mounter for semiconductor chip processing, also called a chip mounter, is one of key devices in a semiconductor manufacturing process, and its main function is to accurately mount minute electronic components onto a Printed Circuit Board (PCB) or other substrate, and the development of such devices originates from the demands of the semiconductor industry for high precision, high efficiency and high reliability. Patent bulletin number CN 222214133U's patent, this patent relates to chip processing technology field, discloses a paster device for semiconductor chip processing, the on-line screen storage device comprises a base, the surface of base is provided with paster subassembly, paster subassembly includes the stand, stand fixed connection is on the surface of base, the spout has been seted up to the lateral wall of stand, the inside sliding connection of spout has the crossbeam, the bottom surface fixedly connected with paster head of crossbeam, the crossbeam symmetry is provided with two sets of, two sets of through two-way threaded rod threaded connection between the crossbeam, the fixed surface of crossbeam is connected with the air pump, the both sides fixedly connected with shower nozzle of crossbeam, the shower nozzle passes through the output fixed connection of hose and air pump. In this patent, rotate through motor drive bi-directional threaded rod to make two sets of crossbeams remove in opposite directions, and drive the laminating of the bottom surface and the surface of two sets of paster heads and semiconductor chip, thereby process simultaneously the two sides of semiconductor chip, improve work efficiency. In the above patent, the double sides of the semiconductor chip are processed simultaneously to improve the working efficiency, but the existing equipment has the problems that dust is inevitably adhered to the surface of the PCB before the PCB is glued, the gluing effect of the PCB is affected, the thickness of the solder paste coating is possibly inconsistent, the tin amount of part of welding spots is insufficient in the welding process, the tin amount of part of welding spots is excessive, and the welding spots with insufficient tin amount can be unstable in welding. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a chip mounting device for processing a semiconductor chip, which solves the problems in the prior art. The invention is realized by the following technical scheme that the chip mounting device for processing the semiconductor chip comprises a bottom frame, wherein the surface of the bottom frame is provided with an air cylinder for mounting a PCB, and the chip mounting device comprises: The fixing frame is fixedly arranged at the output end of the air cylinder; the solder paste tank is slidably arranged on the surface of the fixing frame; The eccentric rod is rotatably arranged on the surface of the fixing frame; one side of the connecting rod is rotatably arranged on the surface of the eccentric rod, and the other side of the connecting rod is rotatably arranged on the circumferential surface of the solder paste tank; the paste brushing plate is fixedly arranged at the bottom of the solder paste tank; The rack is fixedly arranged on the inner wall of the fixing frame; the gear is rotatably arranged at the top of the solder paste tank and meshed with the toothed bar frame; the stirring rod is fixedly arranged at the bottom of the gear; the placing rack is rotatably arranged on the surface of the underframe; the threaded rod is rotatably arranged on the inner wall of the placing frame; And the clamping plate is arranged on the circumferential surface of the threaded rod in a threaded manner, the PCB is placed on the placing frame, and the clamping plate is driven to clamp the upper side and the lower side of the PCB through rotation of the threaded rod. According to the technical scheme, brush cream board and tin cream jar intercommunication, the bottom of brush cream board is provided with the brush, rotates with driving the connecting rod through motor drive eccentric rod, and the connecting rod rotates and makes the tin cream jar slide back and forth, and the tin cream jar slides and drives the brush cream board and remove, through pouring into the tin cream into the brush cream board for the tin cream depends on the brush, and makes the surface cover tin cream of PCB board through back and forth movement. According to the technical scheme, the coating device further comprises a shovel blade and a rotating rod, the shovel blade is fixedly arranged at the rear side of the paste brushing plate, the rotating rod is rotatably arranged on the inner wall of the underframe, and the rotating rod is in transmission