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CN-120657002-B - Ball grid array light-weight radio frequency assembly based on impact resistance

CN120657002BCN 120657002 BCN120657002 BCN 120657002BCN-120657002-B

Abstract

The invention provides a ball grid array light-weight radio frequency assembly based on impact resistance, and relates to the technical field of radio frequency. The radio frequency assembly comprises a base plate, side plates, supporting plates, elastic pieces, pop supporting balls, chip silicon substrates and BGA welding balls, wherein the side plates are arranged on the base plate, a plurality of supporting plates are arranged in the base plate, the elastic pieces are arranged between the supporting plates and the base plate, the two adjacent supporting plates are connected through the pop supporting balls, the chip silicon substrates are arranged on the supporting plates, and the base plate is connected with an external structure through the BGA welding balls. Through multiple structures, the stability of the radio frequency assembly is enhanced, and the shielding structure is constructed by utilizing an anti-impact mechanical structure, so that the weight and the manufacturing cost of the radio frequency assembly are reduced.

Inventors

  • JI ZONGHAI
  • LIU YONG
  • TAN JIANMEI
  • ZHANG XUJIN
  • HAN JIN
  • LIU BINGCE
  • TONG HANCHENG

Assignees

  • 中国电子科技集团公司第三十八研究所

Dates

Publication Date
20260512
Application Date
20250616

Claims (9)

  1. 1. The ball grid array light-weight radio frequency component based on impact resistance is characterized by comprising a base plate (1), side plates (2), a supporting plate (3), elastic pieces (4), pop support balls (5), chip silicon base (6) and BGA solder balls (7); The side plates (2) are arranged on the base plate (1), a plurality of support plates (3) are arranged in the base plate (1), elastic pieces (4) are arranged between the support plates (3) and the base plate (1), two adjacent support plates (3) are connected through a pop supporting ball (5), the chip silicon base (6) is arranged on the support plates (3), and the base plate (1) is connected with an external structure through BGA solder balls (7); the chip silicon substrate (6) is provided with a high Q value filter circuit; A resonant cavity is etched on the supporting plate (3); The support plate (3) comprises a composite material layer (31), a metal material layer (32) and a magnetic material layer (33), wherein the metal material layer (32) is covered on the composite material layer (31), the magnetic material layer (33) is covered on the metal material layer (32), the composite material layer (31) is an outer layer of the support plate (3), and the magnetic material layer (33) is an inner layer of the support plate (3).
  2. 2. An impact-based ball grid array light-weight radio frequency assembly according to claim 1, characterized in that on said substrate (1) grooves are etched around said BGA balls (7); The circuit board in the chip silicon base (6) is a flexible circuit board.
  3. 3. The impact-resistant ball grid array light-weight radio frequency component according to claim 1, wherein the magnetic material of the magnetic material layer (33) is permalloy, the metal material in the metal material layer (32) is copper, and the composite material in the composite material layer (31) is any one of silicon carbide-based composite material, graphene reinforced composite material, nano composite material and metal-polymer multilayer composite material.
  4. 4. The shock-resistant ball grid array light-weight radio frequency assembly according to claim 1, wherein the package space formed by the base plate (1) and the side plate (2) is internally provided with a MEMS sensor and an adaptive filter circuit.
  5. 5. The shock-resistant ball grid array light-weight radio frequency component according to claim 1, wherein the BGA solder balls (7) are made of Sn-Ag-Cu-Ti alloy materials, redundant BGA solder balls (7) are arranged in the inner part of the periphery of the BGA solder balls (7) on the substrate (1), and the arrangement pitch of the periphery of the BGA solder balls (7) is smaller than the arrangement pitch of the periphery of the redundant BGA solder balls (7).
  6. 6. An impact-resistant ball grid array light-weight radio frequency module according to claim 1, wherein said substrate (1) comprises a carbon fiber layer (11) and a metal tape (12), said carbon fiber layer (11) is made of a honeycomb carbon fiber reinforced polymer and is internally embedded with the metal tape (12).
  7. 7. The shock-resistant ball grid array light-weight radio frequency component according to claim 1, wherein the substrate (1) comprises a low-loss layer (14), the low-loss layer (14) is made of a liquid crystal polymer, and a periodic EBG structure is arranged in the substrate (1).
  8. 8. The impact-resistant ball grid array light-weight radio frequency assembly according to claim 1, wherein a runner and a graphene film are integrated in the substrate (1).
  9. 9. An impact-based ball grid array light-weight radio frequency module according to any one of claims 1-8, wherein a ground shield ring and a built-in shield ring are provided on the substrate (1); The grounding shielding ring is characterized in that double-layer grounding BGA solder balls (7) are arranged around the BGA solder balls (7) for transmitting radio frequency signals; The built-in shielding ring is a metal belt layer and a composite material layer which are arranged in the substrate (1).

Description

Ball grid array light-weight radio frequency assembly based on impact resistance Technical Field The invention relates to the technical field of radio frequency, in particular to an impact-resistant ball grid array light-weight radio frequency assembly. Background In the actual operating environment of traditional circuits, such as when an aircraft is in atmospheric turbulence and high-speed maneuvering in the aerospace field, and in the complex electromagnetic countermeasure and severe mechanical vibration scene of military equipment, the circuit is not only subjected to strong speed impact, but also faces serious electromagnetic interference challenges. The traditional radio frequency assembly adopts a metal cavity isolation scheme, and under strong impact, the equivalent weight of a circuit is increased greatly due to the large self weight, so that the stability of equipment is seriously damaged. In the manufacturing process, high-precision processing and expensive materials are needed, and the cost is high. In addition, the metal cavity is easy to introduce electromagnetic interference, and in the phase-locked frequency conversion circuit, the accurate locking of the phase-locked loop to the signal and the frequency conversion of the frequency conversion module are greatly interfered, so that the circuit performance, particularly the signal isolation, is obviously reduced. In the face of complex conditions such as strong impact, it is difficult to meet the severe requirements of modern high-performance electronic devices on circuit performance, so it is highly desirable to propose a lightweight radio frequency component based on an impact-resistant ball grid array to solve the above problems. Disclosure of Invention The invention aims to solve the problem that the stability of equipment is seriously damaged under the complex conditions of strong impact and the like of the traditional radio frequency assembly. In order to solve the problems, the invention provides an impact-resistant ball grid array light-weight radio frequency component, which comprises a base plate, side plates, a supporting plate, an elastic piece, a pop supporting ball, a chip silicon substrate and a BGA solder ball; The side plates are arranged on the base plate, a plurality of supporting plates are arranged in the base plate, elastic pieces are arranged between the supporting plates and the base plate, two adjacent supporting plates are connected through a pop supporting ball, the chip is arranged on the supporting plates in a silicon-based mode, and the base plate is connected with an external structure through BGA solder balls. Optionally, grooves are etched around the BGA solder balls on the substrate; The circuit board is a flexible circuit board. Optionally, a high-Q filter circuit is arranged on the chip silicon substrate; A resonant cavity is etched on the supporting plate; the support plate comprises a composite material layer, a metal material layer and a magnetic material layer, wherein the metal material layer is covered on the composite material layer, the magnetic material layer is covered on the metal material layer, the composite material layer is an outer layer of the support plate, and the magnetic material layer is an inner layer of the support plate. Optionally, the magnetic material of the magnetic material layer is permalloy, the metal material in the metal material layer is copper, and the composite material in the composite material layer is any one of silicon carbide-based composite material, graphene reinforced composite material, nano composite material and metal-polymer multilayer composite material. Optionally, a MEMS sensor and an adaptive filter circuit are arranged in the packaging space formed by the base plate and the side plate. Optionally, the BGA solder balls are made of Sn-Ag-Cu-Ti alloy materials, redundant BGA solder balls are arranged in the periphery of the substrate, and the arrangement pitch of the peripheral BGA solder balls is smaller than that of the inner periphery of the substrate. Optionally, the substrate comprises a carbon fiber layer and a metal belt, wherein the carbon fiber layer is made of honeycomb carbon fiber reinforced polymer, and the metal belt is embedded in the carbon fiber reinforced polymer. Optionally, the substrate includes a low-loss layer, the material of the low-loss layer is a liquid crystal polymer, and a periodic EBG structure is disposed in the substrate. Optionally, a runner and a graphene film are integrally arranged in the substrate. Optionally, a grounding shielding ring and a built-in shielding ring are arranged on the substrate; The grounding shielding ring is formed by arranging double-layer grounded BGA solder balls around the BGA solder balls for transmitting radio frequency signals; the built-in shielding ring is a metal belt layer and a composite material layer which are arranged in the substrate. The invention provides a ball grid array light-weig