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CN-120809651-B - Wafer transfer device

CN120809651BCN 120809651 BCN120809651 BCN 120809651BCN-120809651-B

Abstract

The invention provides a wafer transfer device, which belongs to the field of semiconductor processing equipment, and particularly comprises a positioning assembly, wherein the positioning assembly can be connected with a wafer and is used for driving the wafer to move, the positioning assembly comprises a main fork arm, a flat pull assembly and a negative pressure vacuumizing device, a gas flow channel is arranged in the main fork arm, the negative pressure vacuumizing device is connected with the gas flow channel and is used for generating suction force at a through hole so that the flat pull assembly adsorbs and positions the wafer, compared with the prior art, when the fork head is moved to the position that the wafer is positioned in a positioning opening and the wafer is contacted with a positioning plate, the negative pressure vacuumizing device works, a flat cylinder drives the positioning plate to move and then adsorbs the wafer, and a limiting bar is matched with a clamping plate while the positioning plate moves, so that the clamping plate exerts certain auxiliary clamping force on the wafer due to the fact that the wafer is positioned mainly through the adsorption force, the clamping force is relatively small, and the wafer can be stable and the clamping deformation can be avoided.

Inventors

  • WEI MENG
  • WANG YANG
  • ZHANG JIANAN

Assignees

  • 芯达半导体设备(苏州)有限公司

Dates

Publication Date
20260508
Application Date
20250908

Claims (7)

  1. 1. A wafer transfer device, comprising: a work table (1); the positioning assembly can be connected with the wafer and is used for driving the wafer to move; The positioning assembly includes: A main fork arm (3) provided with a gas flow channel (6) inside; the fork head (4) is butted at the end part of the main fork arm (3); A positioning opening (5) arranged on the fork head (4); the flat pulling assembly is connected to the fork head (4) and one end of the flat pulling assembly is positioned in the gas flow channel (6), and the other end of the flat pulling assembly is positioned in the positioning opening (5); the through-flow opening (15) is arranged on the flat pull assembly, so that gas can enter the gas flow channel (6) after passing through the through-flow opening (15); The negative pressure vacuumizing device (9) is connected with the gas flow channel (6) and is used for generating suction force at the position of the through flow port (15) so that the wafer is adsorbed and positioned by the flat pulling assembly; the flat pull assembly includes: the flat cylinder (11) is movably connected with the fork head (4); a baffle plate (12) fixed at the inner end of the flat cylinder (11) and positioned in the gas flow channel (6); the positioning plate (14) is fixed at the outer end of the flat cylinder (11) and positioned in the positioning opening (5), and the flow through opening (15) is arranged on the positioning plate (14); A notch (13) arranged on the flat cylinder (11) to enable the gas to flow out of the notch (13) and then enter the gas flow channel (6); a clamping plate (16) hinged to the end of the positioning plate (14) for applying a clamping force to the wafer; The clamping plate (16) is matched with a limiting strip (17), the limiting strip (17) is arranged in the positioning opening (5), and the clamping plate (16) can swing inwards through the limiting strip (17) in the process that the flat cylinder (11) moves towards the inside of the gas flow channel (6).
  2. 2. Wafer transfer device according to claim 1, characterized in that the fork head (4) is provided with an adsorption channel (7), the flat cylinder (11) is penetrated by the adsorption channel (7), and the flat cylinder (11) can move axially in the adsorption channel (7).
  3. 3. The wafer transfer device according to claim 1, wherein a torsion spring is connected between the clamping plate (16) and the positioning plate (14), and a restoring force is applied to the clamping plate (16) by the torsion spring, and an adhesive layer is provided on the clamping plate (16).
  4. 4. The wafer transfer device according to claim 1, wherein the positioning assembly is connected with a detecting assembly, and the detecting assembly can synchronously move, the detecting assembly is arranged on the workbench (1), and when the positioning assembly drives the detecting assembly to move, the wafer on the positioning assembly is detected through the detecting assembly.
  5. 5. The wafer transfer device of claim 4, wherein the detection assembly comprises: a detection disc (22) positioned below the fork head (4); A light emitting element (23) mounted on the detection plate (22) and capable of emitting light to the wafer on the fork head (4); And the photoelectric conversion disc (24) is positioned above the wafer and connected with the fork head (4).
  6. 6. Wafer transfer device according to claim 5, characterized in that the table (1) is provided with a linear groove (19), a mating rail (20) is arranged in the linear groove (19), the detection disc (22) can move along the length direction of the mating rail (20), and the light emitting element (23) can perform circular motion when the detection disc (22) moves.
  7. 7. The wafer transfer device of claim 6, wherein the detection assembly further comprises: the translation seat (21) is connected with the detection disc (22) and the matching rail (20) and can drive the detection disc (22) to move; the gear transmission assembly is arranged on the translation seat (21); the gear transmission assembly is connected with a rack (33) in a matched mode, and the rack (33) is positioned in the linear groove (19); in the process that the translation seat (21) drives the detection disc (22) to move linearly, the detection disc (22) is rotated through the gear transmission assembly.

Description

Wafer transfer device Technical Field The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer transfer device. Background Wafer processing is a midstream manufacturing link of the whole semiconductor industry chain, and is required to be placed on a processing table, then etched, and after the etching is finished, the wafer is required to be taken down from the processing table for etching and transferred to other positions. In the prior art, a wafer is generally clamped by a manipulator, then the wafer is transported by the movement of the manipulator, however, when the wafer is clamped by the manipulator, the wafer is only subjected to the clamping force of the manipulator, if the wafer is required to be ensured not to be separated from the manipulator in the transportation process, certain requirements exist on the clamping force, particularly when the thickness of the wafer is smaller, the wafer is easy to deform after being subjected to the clamping force, and the wafer is required to be corrected later, so that the processing efficiency is affected. Disclosure of Invention The invention aims to provide a wafer transfer device which can stably transfer a wafer and reduce stress deformation. The wafer transfer device comprises a positioning assembly, wherein the positioning assembly can be connected with a wafer and used for driving the wafer to move, the positioning assembly comprises a main fork arm, a fork head, a positioning opening, a flat pulling assembly and a negative pressure vacuumizing device, a gas flow channel is arranged in the main fork arm, the fork head is in butt joint with the end part of the main fork arm, the positioning opening is arranged on the fork head, the flat pulling assembly is connected to the fork head, one end of the flat pulling assembly is located in the gas flow channel, the other end of the flat pulling assembly is located in the positioning opening, a through-flow opening is arranged on the flat pulling assembly, gas can enter the gas flow channel after passing through the through-flow opening, and the negative pressure vacuumizing device is connected with the gas flow channel and used for enabling the through-flow opening to generate suction force so that the flat pulling assembly can absorb and position the wafer. The flat pulling assembly comprises a flat barrel, a baffle plate and a positioning plate, wherein the flat barrel is movably connected with the fork head, the baffle plate is fixed at the inner end of the flat barrel and is positioned in the gas flow channel, the positioning plate is fixed at the outer end of the flat barrel and is positioned in the positioning opening, the through-flow opening is arranged on the positioning plate, and the notch is arranged on the flat barrel, so that gas can flow out of the notch and then enter the gas flow channel. Further, the fork head is provided with an adsorption channel, the flat cylinder body passes through the adsorption channel, and the flat cylinder body can axially move in the adsorption channel. Further, the flat pull assembly further comprises: And the clamping plate is hinged at the end part of the positioning plate and is used for applying clamping force to the wafer. Further, the clamping plate is matched with a limiting strip, the limiting strip is arranged in the positioning opening, and the clamping plate can swing inwards through the limiting strip in the process that the flat cylinder moves towards the inside of the air flow channel. Further, a torsion spring is connected between the clamping plate and the positioning plate, restoring force is applied to the clamping plate through the torsion spring, and an adhesive layer is arranged on the clamping plate. Further, the locating component is connected with the detecting component, and the detecting component and the locating component can synchronously move, and when the locating component drives the detecting component to move, the wafer on the locating component is detected through the detecting component. Further, the detection assembly comprises a detection disc, a light emitting element and a photoelectric conversion disc, wherein the detection disc is positioned below the fork head, the light emitting element is arranged on the detection disc and can emit light to a wafer on the fork head, and the photoelectric conversion disc is positioned above the wafer and is connected with the fork head. Further, be provided with the straight line groove on the workstation, be provided with the cooperation rail in the straight line groove, detect the dish and can follow the length direction removal of cooperation rail, detect when the dish removes, can make light emission component do circular motion. The detection device further comprises a translation seat and a gear transmission assembly, wherein the translation seat is connected with the detection disc and the matching rail and can drive the de