Search

CN-120815909-B - Pin forming device and method for high-voltage MOS device

CN120815909BCN 120815909 BCN120815909 BCN 120815909BCN-120815909-B

Abstract

The invention discloses a pin forming device and method for a high-voltage MOS device, comprising a cabinet, a discharging mechanism, an extrusion forming mechanism, a receiving mechanism and a control unit, wherein the top end of the cabinet is provided with an inclined plane, the discharging mechanism is arranged at the top of the inclined plane, the extrusion forming mechanism is arranged in the middle of the inclined plane, the receiving mechanism is arranged at the bottom of the inclined plane, the receiving mechanism comprises a rotating part, a material clamping part and a counting driving part, the material clamping part is arranged on the outer surface of the rotating part in a surrounding manner, the counting driving part is connected in the middle of the rotating part in a penetrating manner, the control unit is arranged at the side edge of the inclined plane, and the control unit is used for controlling the discharging of the discharging mechanism through photoelectric induction signals. According to the invention, through the arrangement of the counting driving part, under the automatic counting setting of photoelectric induction, the collection of the corresponding quantity of finished products can be carried out according to the actual requirements, so that the quantitative counting collection is realized, the error of manual counting is avoided, and the accuracy of counting collection is ensured.

Inventors

  • LI GUOQI

Assignees

  • 无锡光磊电子科技有限公司

Dates

Publication Date
20260505
Application Date
20250623

Claims (9)

  1. 1. The utility model provides a high-voltage MOS device pin forming device which characterized in that includes: the automatic feeding device comprises a cabinet (1), wherein the top end of the cabinet (1) is provided with an inclined plane, and the top of the inclined plane is provided with a discharging baffle (103); the discharging mechanism is arranged at the top of the inclined plane and is positioned above the discharging baffle (103), and the discharging mechanism is matched with the discharging baffle (103) and used for discharging the MOS device to be formed; The extrusion forming mechanism is arranged in the middle of the inclined plane and positioned below the discharging baffle (103), and is used for downwards pressing and discharging guide of pins of the MOS device after passing through the discharging baffle (103); The material collecting mechanism is arranged at the bottom of the inclined plane and comprises a rotating part, a material clamping part and a counting driving part, wherein the material clamping part is arranged on the outer surface of the rotating part in a surrounding mode, the counting driving part is connected to the middle part of the rotating part in a penetrating mode, and the counting driving part is used for driving the rotating part to rotate through counting; The count driving section includes: The travel switch (13), the travel switch (13) is arranged in the cabinet (1), and the output end of the travel switch (13) is electrically connected with the rotating part; The lower gear shaping plate (14), the lower gear shaping plate (14) is connected in the cabinet (1) in a penetrating way, a counting pull rod (1401) is fixedly connected to the top end of the lower gear shaping plate (14), the top of the counting pull rod (1401) is connected with an inclined plane in a penetrating way, a gear shaping rod (1402) is fixedly connected to the bottom end of the lower gear shaping plate (14), and the gear shaping rod (1402) is used for pressing a trigger travel switch (13) after moving downwards along with the lower gear shaping plate (14); The rotary rod (15), the rotary rod (15) is rotationally connected in the cabinet (1), one end of the rotary rod (15) is fixedly connected with a stirring gear (1501), the outer wall of the stirring gear (1501) is meshed with the tooth wall of the lower gear shaping plate (14), the other end of the rotary rod (15) is fixedly connected with a ratchet disc (1502), and the ratchet disc (1502) is meshed with the stirring gear block (602) along the anticlockwise direction for transmission; the control unit is arranged on the side edge of the inclined plane and is used for controlling the discharging of the discharging mechanism through photoelectric sensing signals.
  2. 2. The high-voltage MOS device pin forming device according to claim 1, wherein one end of the bottom of the cabinet (1) is provided with a universal wheel (101), the other end of the bottom of the cabinet (1) is provided with a supporting leg (102), the middle part of the discharging baffle (103) is provided with a discharging opening, and the discharging mechanism is used for discharging MOS devices to be formed through the discharging opening.
  3. 3. The high-voltage MOS device pin forming apparatus of claim 2, wherein the discharging mechanism comprises: the device comprises a placing rack (2), wherein the placing rack (2) is fixedly connected to the top of an inclined plane, a pushing opening is formed in the bottom of the placing rack (2), and the pushing opening, the discharging opening and the discharging guide of the extrusion forming mechanism are positioned on the same central line; The pressing rod (201) is pressed down, the pressing rod (201) is connected to the middle of the placing frame (2) in a penetrating mode, a pressing spring (202) is arranged between the middle of the pressing rod (201) and the top end of the inner wall of the placing frame (2), and the pressing rod (201) is pressed close to the top of the placing frame (2) through the pressing spring (202).
  4. 4. The high voltage MOS device pin molding apparatus of claim 3, wherein the discharging mechanism further comprises: The pushing cylinder (203) is arranged at the top of the inclined plane and is positioned at one side of the bottom of the placing rack (2), and the output end of the pushing cylinder (203) is connected with the side edge of the pushing opening in a penetrating manner along the horizontal direction; The photoelectric sensor (204), photoelectric sensor (204) set up in the top on inclined plane and be located the below of discharge opening, photoelectric sensor (204) are used for measuring the sensitization interval that passes the discharge opening, photoelectric sensor (204)'s output and the receiving terminal electric connection of control unit.
  5. 5. The high-voltage MOS device pin forming apparatus of claim 4, wherein the control unit includes a controller (7), an output end of the controller (7) is electrically connected with a driving end of the pushing cylinder (203), the controller (7) is used for output control of the extrusion forming mechanism, and an output end of the controller (7) is electrically connected with a buzzer (701).
  6. 6. The apparatus for forming pins of a high voltage MOS device of claim 5, wherein said extrusion mechanism comprises: The device comprises a support frame (3), wherein a lower air cylinder (301) is arranged at the top of the support frame (3), the output end of the lower air cylinder (301) extends to the bottom of the support frame (3), and a forming die (302) is arranged at the output end of the lower air cylinder (301); The material guiding rail (4) is aligned with the discharge opening and fixedly connected to the top end of the inclined plane, and the material guiding rail (4) is inserted below the supporting frame (3); First fender material cylinder (5) and second fender material cylinder (6), first fender material cylinder (5) and second keep off material cylinder (6) and set up along inclined plane central symmetry, the output of first fender material cylinder (5) and second fender material cylinder (6) is provided with first baffle (501) and second baffle (601) respectively, first baffle (501) and second baffle (601) are used for cutting off of guide track (4), just the guide track (4) region that first baffle (501) and second baffle (601) cut off is used for pushing down of forming die (302), the output fixedly connected with of second fender material cylinder (6) is stirred tooth piece (602), stir tooth piece (602) and alternate to be connected in rack (1), just stir tooth piece (602) and be used for stirring count drive portion.
  7. 7. The high-voltage MOS device pin forming apparatus of claim 1, wherein a rotating opening is formed in the bottom of the inclined surface, and the rotating portion comprises: the rotary belt (8), the rotary belt (8) is rotationally connected in the rotary opening, a plurality of groups of clamping parts are circumferentially arranged on the outer annular wall of the rotary belt (8), and teeth (801) are arranged on the side of the inner annular wall of the rotary belt (8); the driving rollers (11) are respectively connected to two ends of the rotating belt (8) in a penetrating mode, the outer walls of the driving rollers (11) are meshed with the teeth (801), and a supporting rotating rod (1101) is connected to the middle of the driving rollers (11) in a penetrating mode; The driving motor (12), driving motor (12) sets up in rack (1), the control end of driving motor (12) is connected with the output electricity of travel switch (13), the output of driving motor (12) is provided with shaft coupling (1201), the one end that driving motor (12) was kept away from to shaft coupling (1201) is connected with one of them support bull stick (1101) transmission.
  8. 8. The high voltage MOS device pin molding apparatus of claim 7, wherein the clamping portion comprises: The blocking blocks (9) are symmetrically arranged along the horizontal direction, one sides of the blocking blocks (9) are contacted with each other, one ends of the blocking blocks (9) which are far away from each other are fixed with the outer annular wall of the rotating belt (8), and stop rods (901) are arranged in the middle of the blocking blocks (9); The clamping blocks (10) are horizontally and symmetrically arranged in multiple groups, the clamping blocks (10) are horizontally and longitudinally symmetrical with the multiple groups of blocking blocks (9), the clamping blocks (10) are arranged in a folded angle shape, and one end of each clamping block (10) is fixedly connected with the outer annular wall of the rotating belt (8).
  9. 9. A method for processing a pin forming device of a high-voltage MOS device, comprising the pin forming device of claim 5, characterized in that the method comprises the following steps: Firstly, arranging and installing a material box for collecting a finished MOS device on the outer annular wall of a rotating part through a material clamping part; Secondly, firstly, opening a clamping space of a discharging mechanism, then arranging and placing a material box filled with MOS devices to be formed in the clamping space of the discharging mechanism along the vertical direction, at the moment, the MOS devices to be formed in the lowest material box slide downwards along an inclined plane to discharge under the action of gravity, and enter the extrusion forming mechanism through a discharging baffle (103), and judging the discharging condition of the MOS devices to be formed through photoelectric induction in the discharging process, so as to control the discharging mechanism and the whole machine equipment, wherein the discharging condition comprises: When the light shielding time interval is 2-3 s, no discharge is carried out in the bottommost material box, and the material pushing cylinder (203) is triggered to act at the moment so as to rapidly push out the bottommost material box; when the light shielding time interval is 4-6 s, the blanking transfer of the MOS device is not detected, and a buzzer (701) is triggered to continuously alarm; When the light shielding time interval is not felt to exceed 6s, immediately stopping the machine; Thirdly, shielding the MOS devices to be formed in batches in a pin pressing area of an extrusion forming mechanism, and then continuously falling along an inclined plane under the action of gravity after the MOS devices to be formed are pressed and formed by the pins; And fourthly, setting the quantity of MOS devices to be filled in each component collecting box through a counting driving part, enabling the MOS devices subjected to compression molding to enter the finished product collecting box through material guiding, triggering the pressing stroke to reach the set collecting quantity, simultaneously driving a rotating part to rotate through the counting driving part, enabling the next component collecting box to enter a material collecting position for material collection, and starting to collect a new round of finished products after resetting the quantity to be collected.

Description

Pin forming device and method for high-voltage MOS device Technical Field The invention relates to the field of semiconductor device processing equipment, in particular to a pin forming device and method for a high-voltage MOS device. Background In modern electronic devices, high-voltage MOS devices are widely used in the fields of power management, high-frequency switching, and inverters because of their superior switching characteristics and high withstand voltage capabilities. With the continuous development of technology, higher requirements are put on the performance and reliability of the high-voltage MOS device, and in the preparation process, pin forming is used as a key link, so that the overall performance and service life of the device are directly affected. In the pin forming process of the high-voltage MOS device, a dedicated pin forming device is generally required. The existing pin forming device has the functions of automatic discharging, automatic extrusion forming and automatic material collecting. The device is characterized in that the discharging mechanism, the extrusion forming mechanism and the receiving mechanism are arranged on the central line of the same inclined plane, and smooth circulation of the MOS device is realized by utilizing the gravity effect. However, the existing pin forming device has certain defects in the material receiving process. Specifically, when receiving materials, the existing equipment cannot automatically control the number of receiving boxes according to the actual quantity of receiving materials, but relies on manual counting or program control setting of a motor. The manpower-dependent mode not only wastes human resources, but also is easy to cause errors in the manual operation process, thereby affecting the quality and accuracy of quantitative material collection; the pin forming device and method for the high-voltage MOS device are provided in view of the fact that the program control is carried out so that the operation and the debugging of the device are very complicated. Disclosure of Invention The invention aims to provide a pin forming device and method for a high-voltage MOS device, which are used for solving the problems in the background technology. In order to achieve the purpose, the invention provides the following technical scheme that the pin forming device of the high-voltage MOS device comprises: The top of the cabinet is provided with an inclined plane, and the top of the inclined plane is provided with a discharging baffle; the discharging mechanism is arranged at the top of the inclined plane and is positioned above the discharging baffle, and the discharging mechanism is matched with the discharging baffle and is used for discharging the MOS device to be formed; The extrusion forming mechanism is arranged in the middle of the inclined plane and positioned below the discharging baffle, and is used for downwards pressing and discharging guiding the MOS device through the guide leg behind the discharging baffle; The material collecting mechanism is arranged at the bottom of the inclined plane and comprises a rotating part, a material clamping part and a counting driving part, wherein the material clamping part is arranged on the outer surface of the rotating part in a surrounding mode, the counting driving part is connected to the middle part of the rotating part in a penetrating mode, and the counting driving part is used for driving the rotating part to rotate through counting; the control unit is arranged on the side edge of the inclined plane and is used for controlling the discharging of the discharging mechanism through photoelectric sensing signals. Preferably, one end of the bottom of the cabinet is provided with a universal wheel, the other end of the bottom of the cabinet is provided with a supporting leg, the middle part of the discharging baffle is provided with a discharging opening, and the discharging mechanism is used for discharging the MOS device to be formed through the discharging opening. Preferably, the discharging mechanism comprises: The placing rack is fixedly connected to the top of the inclined plane, a pushing opening is formed in the bottom of the placing rack, and the pushing opening, the discharging opening and the discharging guide of the extrusion forming mechanism are positioned on the same central line; The pressing rod is connected to the middle of the rack in a penetrating mode, a pressing spring is arranged between the middle of the pressing rod and the top end of the inner wall of the rack, and the pressing rod is pressed to be close to the top of the rack through the pressing spring. Preferably, the discharging mechanism further comprises: The pushing cylinder is arranged at the top of the inclined plane and positioned at one side of the bottom of the placing frame, and the output end of the pushing cylinder is connected with the side edge of the pushing opening in a penetrating manner along th