CN-120854307-B - Component laminating error correction method, system and device

CN120854307BCN 120854307 BCN120854307 BCN 120854307BCN-120854307-B

Abstract

A component fitting error correction method comprises the following steps of setting an initial material level, a calibration piece and a calibration plate with a fitting position, picking up the calibration piece from the initial material level, moving the calibration piece to the fitting position according to a movement path, obtaining an X-axis fitting error value and/or a Y-axis fitting error value and/or a fitting installation angle error value of the calibration piece when the calibration piece is at the fitting position, picking up the calibration piece from the fitting position, carrying out error correction on the movement path according to the X-axis error value and/or the Y-axis error value and/or the fitting installation angle error value, and returning the calibration piece to the initial material level. In addition, the invention also provides a system and a device corresponding to the method for correcting the fitting error of the components. Compared with the prior art, the method, the system and the device for correcting the fitting error of the components can improve the efficiency of mass production and reduce the loss rate.

Inventors

ZOU WEI

Assignees

广州诺顶智能科技有限公司

Dates

Publication Date: 20260505
Application Date: 20250724

Claims (7)

1. The component attaching error correction method is characterized by comprising the following steps of: Setting an initial material level, a calibration piece and a calibration plate with a fitting position; Picking up the calibration piece from the initial material level, acquiring the actual pick-up installation angle of the calibration piece in the picked-up state of the calibration piece, comparing the actual pick-up installation angle with a standard pick-up installation angle, and judging whether the pick-up installation angle error value of the calibration piece is within a tolerance range; If so, continuously moving the calibration piece to the attaching position according to the motion path, otherwise, rotating the calibration piece around an R axis according to the pick-up installation angle error value, correcting the pick-up installation angle error of the calibration piece, and then moving the calibration piece to the attaching position according to the motion path; Acquiring an X-axis fitting error value and/or a Y-axis fitting error value and/or a fitting installation angle error value of the calibration piece at the fitting position; Picking up the calibration piece from the fitting position; performing error correction on the motion path according to the X-axis error value and/or the Y-axis error value and/or the fitting installation angle error value; And replacing the calibration piece with the initial material level.
2. The method for correcting the fitting error of a component according to claim 1, wherein obtaining the X-axis fitting error value and/or the Y-axis fitting error value and/or the fitting installation angle error value of the calibration member at the fitting position comprises the steps of: acquiring an actual attaching image of the calibration piece at the attaching position; comparing the actual fitting image with the standard fitting image, and acquiring an X-axis fitting error value and/or a Y-axis fitting error value and/or a fitting installation angle error value of the calibration piece in the fitting position.
3. The method for correcting component attachment errors according to claim 1, wherein the following steps are performed at least twice in a cycle before the calibration member is returned to the initial material level: Acquiring an actual pickup installation angle of the calibration piece when the calibration piece is in a picked-up state, and comparing the actual pickup installation angle with a standard pickup installation angle to judge whether a pickup installation angle error value of the calibration piece is within a tolerance range; If so, continuously moving the calibration piece to the attaching position according to the motion path, otherwise, rotating the calibration piece around an R axis according to the pick-up and installation angle error value, correcting the pick-up and installation angle error of the calibration piece, and continuously moving the calibration piece to the attaching position according to the motion path; Acquiring an X-axis fitting error value and/or a Y-axis fitting error value and/or a fitting installation angle error value of the calibration piece at the fitting position; Picking up the calibration piece from the fitting position; And correcting the error of the motion path of the calibration piece according to the X-axis error value and/or the Y-axis error value and/or the fitting installation angle error value.
4. The method for correcting the fitting error of the components according to claim 1, wherein a plurality of fitting positions are arranged on the calibration plate; Picking up the calibration piece from the initial material level and moving the calibration piece to each fitting position according to each movement path; Respectively obtaining an X-axis fitting error value and/or a Y-axis fitting error value and/or a fitting installation angle error value of the calibration piece at each fitting position; picking up the calibration piece from each attaching position respectively; And respectively carrying out error correction on each motion path according to the X-axis error value and/or the Y-axis error value and/or the fitting installation angle error value.
5. A component placement error correction system for performing the component placement error correction method of claim 1, comprising: the moving module is used for driving the calibration piece and comprises moving the calibration piece from the initial material level to the attaching position and moving the calibration piece from the attaching position back to the initial material level; the device comprises a moving module, a pick-up image shooting module, a bonding image shooting module and a positioning module, wherein the moving module is used for moving the calibration piece to a bonding position; The storage module is used for storing the standard picked-up image and the standard attached image; the comparison module is used for comparing the actual picked-up image with the standard picked-up image, acquiring a pick-up installation angle error value, comparing the actual laminating image with the standard laminating image, and acquiring the X-axis laminating error value, the Y-axis laminating error value and the laminating installation angle error value; The error correction module is used for carrying out error correction on the rotation of the mobile module around the R axis according to the pick-up installation angle error value, and carrying out error correction on the motion path of the mobile module according to the X-axis fitting error value and/or the Y-axis fitting error value and/or the fitting installation angle error value.
6. A device for component attachment error correction, comprising: The working platform is divided into a working area, an initial material level and a bottom shooting position on the table top; the calibration plate is positioned in the working area, and a bonding position pattern for identifying bonding positions is arranged on the plate surface; the calibration piece is provided with a position graph for identifying the positions of the X axis and the Y axis and the installation angle of rotation around the R axis; The attaching head can pick up the calibration piece from the initial material level according to a motion path, move the calibration piece to the attaching position graph and move the calibration piece from the attaching position graph to the initial material level; The first camera is used for shooting an actual attaching image when the calibration piece is positioned on the attaching position graph; The second camera is positioned at the bottom shooting position and is used for shooting an actual picked-up image when the calibration piece is positioned at the attaching head; the controller is electrically connected with the bonding head, the first camera and the second camera respectively, and can control the movement of the bonding head and shooting of the first camera and the second camera according to the component bonding error correction method of claim 1.
7. The device for correcting component mounting errors as claimed in claim 6, wherein the mounting head is provided with a mounting seat, and the first camera is located on the mounting seat and moves together with the mounting head.

Description

Component laminating error correction method, system and device Technical Field The present invention relates to the field of semiconductor packaging technology, and in particular, to a method, a system, and a device for correcting attachment errors of components. Background The attachment of components, including chips, is a critical process in semiconductor packaging to accurately and securely attach the components to a leadframe, substrate or PCB and to ensure reliable electrical connection of the components to external circuitry. Taking the chip bonding to the substrate as an example, the process comprises the following steps of S1, dispensing on the substrate, S2, adsorbing the chip through a bonding head provided with a vacuum chuck, S3, placing the chip on a corresponding position of the substrate, performing lamination positioning to enable the chip to be fully contacted with the adhesive layer, S4, heating and curing the substrate with the chip to ensure the bonding strength, and S5, performing post processes such as wire bonding, plastic packaging or flip chip reflow. With miniaturization of electronic devices, among the above processes, a process of precisely placing chips at corresponding positions of a substrate is becoming more and more important. For example, for wire bonding, there is only a 20-40 μm process window from the center of the pad to the center of the bond finger, and if the die offset is slightly greater than 10 μm, it may cause "wire bonding bias" or "wire bumping". However, the existing attaching head is usually driven by a mechanical structure, and the mechanical structure inevitably has machining errors, assembly errors and the like of parts, so that errors exist in the motion trail of the attaching head, and correction is needed. For this reason, some correction methods for the attachment position of the component have also been proposed in the prior art. The methods generally adopt the technical means of 'vision + machinery + algorithm + feedback', namely, when the components are adsorbed, the components are subjected to vision coarse positioning through a high-speed camera, the adsorption state of the components on the attaching head is obtained, and then the components are calculated and rotated through the algorithm, so that the first rotation compensation is performed. And then the bonding head moves the components to the corresponding bonding positions of the substrate, and the high-power camera is used for shooting the substrate and the components at the same time. The offset required for the component is then calculated from the captured image compared to a standard image, including the X-axis, Y-axis, and angular offset. And finally, finely adjusting the attaching head according to the required offset, so as to adjust the attaching position of the component and enable the attaching position of the component to meet the expectations. However, the working efficiency is low when the component fitting correction method is adopted, the requirement of mass and high-speed production cannot be met, the component is easy to damage, and the production cost of electronic products is greatly improved. Disclosure of Invention Based on the above, the invention aims to overcome the defects or shortcomings in the prior art and provide a method for correcting the fitting error of components. The technical scheme adopted by the invention is as follows: a method for correcting component fitting errors comprises the following steps: Setting an initial material level, a calibration piece and a calibration plate with a fitting position; Picking up the calibration piece from the initial material level and moving the calibration piece to the fitting position according to a movement path; Acquiring an X-axis fitting error value and/or a Y-axis fitting error value and/or a fitting installation angle error value of the calibration piece at the fitting position; Picking up the calibration piece from the fitting position; performing error correction on the motion path according to the X-axis error value and/or the Y-axis error value and/or the fitting installation angle error value; And replacing the calibration piece with the initial material level. Compared with the prior art, the component fitting error correction method adopts the calibration piece to replace components, the calibration plate to replace a printed circuit board, and the motion path error of the fitting head is adjusted in advance, so that the work of repeatedly correcting the motion path error can be avoided in a long section of mass production, and the actual production efficiency is improved. In addition, during correction, the calibration piece replaces components, the calibration plate replaces the printed circuit board, so that the loss of actual components can be reduced, and the cost is saved. In one embodiment, the method for obtaining the X-axis fitting error value and/or the Y-axis fitting error value and/or the fi