Search

CN-120878659-B - Heat dissipation substrate and preparation method thereof

CN120878659BCN 120878659 BCN120878659 BCN 120878659BCN-120878659-B

Abstract

The application provides a heat dissipation substrate and a preparation method thereof, and relates to the technical field of manufacturing of heat dissipation substrates, wherein the heat dissipation substrate comprises a copper substrate and a heat dissipation structure; the copper substrate is used for connecting the power module, the heat dissipation structure is arranged on the copper substrate and comprises a heat dissipation aluminum plate and a plurality of heat dissipation columns, the heat dissipation aluminum plate is connected with the surface of the copper substrate, and the heat dissipation columns are arranged on the surface, far away from the copper substrate, of the heat dissipation aluminum plate. The heat-radiating substrate provided by the application has the advantages that the bonding strength between the copper substrate and the heat-radiating aluminum plate, the overall heat exchange efficiency and the long-term stability are ensured, and meanwhile, the use amount of copper materials is reduced in an aluminum-copper-saving mode, so that the problems of cost and performance balance of the IGBT heat-radiating plate are successfully solved.

Inventors

  • WANG XINYUN
  • CHEN YIBIN
  • HU SHENGBAO
  • CHEN QIBING

Assignees

  • 广州众山新材料股份有限公司

Dates

Publication Date
20260512
Application Date
20250828

Claims (8)

  1. 1. The preparation method of the heat dissipation substrate is characterized by comprising the following steps: providing a copper substrate (100); Forming a heat dissipation structure foundation on the surface of the copper substrate (100) through a casting and rolling process, wherein the copper substrate (100) and the heat dissipation structure foundation jointly form a heat dissipation substrate foundation; processing the heat-dissipating structure base to form a heat-dissipating structure (200); the heat dissipation structure (200) comprises a heat dissipation aluminum plate (210) and a plurality of heat dissipation columns (220), wherein the heat dissipation aluminum plate (210) is connected with the surface of the copper substrate (100), and the heat dissipation columns (220) are arranged on the surface, far away from the copper substrate (100), of the heat dissipation aluminum plate (210); the forming of the heat dissipation structure foundation on the surface of the copper substrate (100) through the casting and rolling process comprises the following steps: pouring an aluminum layer on the surface of the copper substrate (100); rolling the aluminum layer to form the heat dissipation structure foundation; In the process of pouring and forming the aluminum layer, the pouring speed is greater than or equal to 0.1 m/s and less than or equal to 0.3 m/s, the pouring temperature is greater than or equal to 680 ℃ and less than or equal to 700 ℃, and the pouring time is greater than or equal to 0.1 s and less than or equal to 0.3 s.
  2. 2. The method of manufacturing a heat dissipating substrate of claim 1, wherein said rolling said aluminum layer to form said heat dissipating structure foundation comprises: Rolling the surface of the copper substrate (100) away from the heat dissipation structure base by a first roller; Rolling the surface of the heat dissipation structure foundation far away from the copper substrate (100) through a second roller, wherein the surface roughness of the first roller is smaller than that of the second roller; in the process of rolling the aluminum layer, the rolling temperature is more than or equal to 160 ℃ and less than or equal to 200 ℃, the rolling pressure is more than or equal to 240 kilonewtons and less than or equal to 300 kilonewtons, and the rolling speed is more than or equal to 3 meters/minute and less than or equal to 5 meters/minute.
  3. 3. The method of manufacturing a heat dissipating substrate of claim 1, wherein said rolling said aluminum layer, after forming said heat dissipating structure base, further comprises: Annealing the heat-dissipating substrate base, wherein the annealing temperature is more than or equal to 195 ℃ and less than or equal to 205 ℃, and the annealing time is more than or equal to 415 minutes and less than or equal to 425 minutes.
  4. 4. The method of manufacturing a heat dissipating substrate of claim 1, wherein said processing said heat dissipating structure base to form a heat dissipating structure (200) comprises: Cold die forging the heat dissipation structure foundation, wherein part of the heat dissipation structure foundation forms a heat dissipation aluminum plate foundation, and the rest of the heat dissipation structure foundation forms a plurality of heat dissipation column foundations; cutting the heat dissipation column foundation; Heat treating the heat-dissipating structural foundation; Surface-treating the heat-dissipating substrate base to form the heat-dissipating substrate; the surface roughness of the heat dissipation substrate is greater than or equal to 0.6 micron and less than or equal to 1.2 micron.
  5. 5. The method of manufacturing a heat dissipating substrate according to claim 1, wherein the minimum thickness of the heat dissipating aluminum plate (210) is greater than or equal to 0.05mm and less than or equal to 3 mm.
  6. 6. The method for manufacturing a heat dissipating substrate according to claim 1, wherein the plurality of heat dissipating studs (220) are arranged in a plurality of rows and a plurality of columns, and a distance between two adjacent heat dissipating studs (220) is greater than or equal to 1.2mm and less than or equal to 1.5 mm.
  7. 7. The method of manufacturing a heat dissipating substrate of claim 6, wherein the heat dissipating studs (220) are configured as cylindrical heat dissipating studs; The diameter of the cylindrical heat dissipation column is larger than or equal to 1.5 mm and smaller than or equal to 2mm, and/or the height of the cylindrical heat dissipation column is larger than or equal to 3.5 mm and smaller than or equal to 4.5 mm.
  8. 8. The method of manufacturing a heat dissipating substrate according to any one of claims 1 to 7, wherein a metal compound layer (300) is formed between the heat dissipating aluminum plate (210) and the copper substrate (100); The thickness of the metal compound layer (300) is less than or equal to 1 micron, the peel strength of the metal compound layer (300) is greater than or equal to 60 newtons/millimeter, and the shear strength of the metal compound layer (300) is greater than or equal to 60 megapascals.

Description

Heat dissipation substrate and preparation method thereof Technical Field The application relates to the technical field of manufacturing of heat dissipation substrates, in particular to a heat dissipation substrate and a preparation method thereof. Background Currently, in IGBT high-power modules, a heat dissipation substrate plays a key role. The heat dissipation structure is not only a core heat dissipation function structure and a channel, but also directly influences the thermal performance, the reliability and the service life of the IGBT module. When the IGBT works, a large amount of heat is generated, the heat is transferred from the chip to the external environment through the high heat conduction material by the heat dissipation plate, and part of the heat dissipation plate is also used as a mechanical support to fix the IGBT module. In the prior art, the radiating substrate comprises copper, aluminum plate and transition plywood triplex, and copper and power module's surface contact, aluminum plate and external environment contact, and the adhesive is paintd to the both sides of transition plywood to bond with copper and aluminum plate respectively, so that power module's heat distributes external environment through copper, transition plywood and aluminum plate in proper order. However, after the heat dissipation substrate is used for a long time, the junction surfaces of the transition laminate, the copper plate and the aluminum plate are easily separated, and the heat dissipation effect of the heat dissipation substrate is affected. Disclosure of Invention In view of the above, the present application provides a heat dissipation substrate and a method for manufacturing the same, which can reduce manufacturing cost while ensuring bonding strength, heat dissipation efficiency and long-term stability. In order to achieve the above purpose, the application provides a heat dissipation substrate and a preparation method thereof, which adopts the following technical scheme: in one aspect, an embodiment of the present application provides a heat dissipation substrate, including a copper substrate and a heat dissipation structure; The copper substrate is used for connecting a power module; the heat dissipation structure is arranged on the copper substrate; the heat dissipation structure comprises a heat dissipation aluminum plate and a plurality of heat dissipation columns, wherein the heat dissipation aluminum plate is connected with the surface of the copper substrate, and the heat dissipation columns are arranged on the surface, away from the copper substrate, of the heat dissipation aluminum plate. In one possible implementation, the minimum thickness of the heat dissipating aluminum plate is greater than or equal to 0.05 mm and less than or equal to 3 mm. In one possible implementation manner, a plurality of heat dissipation posts are arranged in a plurality of rows and columns, and the distance between two adjacent heat dissipation posts is greater than or equal to 1.2 mm and less than or equal to 1.5 mm. In one possible implementation, the heat dissipation post is provided as a cylindrical heat dissipation post; The diameter of the cylindrical heat dissipation column is larger than or equal to 1.5 mm and smaller than or equal to 2mm, and/or the height of the cylindrical heat dissipation column is larger than or equal to 3.5 mm and smaller than or equal to 4.5 mm. In one possible implementation, a metal compound layer is formed between the heat-dissipating aluminum plate and the copper substrate; the thickness of the metal compound layer is less than or equal to 1 micrometer, the peeling strength of the metal compound layer is more than or equal to 110 newtons/millimeter, and the shearing strength of the metal compound layer is more than or equal to 60 megapascals. On the other hand, the embodiment of the application also provides a preparation method of the heat dissipation substrate, which comprises the following steps: Providing a copper substrate; Forming a heat dissipation structure foundation on the surface of the copper substrate through a casting and rolling process, wherein the copper substrate and the heat dissipation structure foundation jointly form a heat dissipation substrate foundation; processing the heat dissipation structure foundation to form a heat dissipation structure; The heat radiation structure comprises a heat radiation aluminum plate and a plurality of heat radiation columns, wherein the heat radiation aluminum plate is connected with the surface of the copper substrate, and the heat radiation columns are arranged on the surface of the copper substrate, away from the heat radiation aluminum plate. In one possible implementation manner, the forming a heat dissipation structure foundation on the surface of the copper substrate through a casting rolling process includes: pouring an aluminum layer on the surface of the copper substrate; rolling the aluminum layer to form th