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CN-120944501-B - Epoxy adhesive for packaging semiconductor chip and preparation process thereof

CN120944501BCN 120944501 BCN120944501 BCN 120944501BCN-120944501-B

Abstract

The invention relates to the technical field of epoxy glue and discloses epoxy glue for packaging a semiconductor chip and a preparation process thereof, and the epoxy glue comprises the following operation steps of 1, adding epoxy resin and 3- (perfluoro-n-hexyl) epoxypropane into ethanol, uniformly mixing, adding 2-imidazole-1-ethylamine, reacting for 4-6 hours at 50-60 ℃ to obtain modified epoxy resin, 2, vacuumizing the modified epoxy resin, modified polyurethane, a defoaming agent and a diluting agent, stirring for 40-50 minutes at a rotating speed of 800-1200 rpm/min, sequentially adding nano zinc oxide and a curing agent, and stirring for 1-2 hours at a speed of 200-400 rpm/min.

Inventors

  • WANG YUEFENG
  • CAO SHUHAN
  • WANG SHUMING
  • JIN XIAOLIN

Assignees

  • 江苏斯瑞达材料技术股份有限公司

Dates

Publication Date
20260505
Application Date
20251010

Claims (7)

  1. 1. The preparation process of the epoxy adhesive for packaging the semiconductor chip is characterized by comprising the following operation steps of: Step 1, adding epoxy resin and 3- (perfluoro-n-hexyl) epoxypropane into ethanol, uniformly mixing, adding 2-imidazole-1-ethylamine, and reacting for 4-6 hours at 50-60 ℃ to obtain modified epoxy resin; Step 2, vacuumizing the modified epoxy resin, the modified polyurethane, the defoaming agent and the diluent, stirring for 40-50 minutes at a rotating speed of 800-1200 rpm, sequentially adding the nano zinc oxide and the curing agent, and reducing the speed to 200-400 rpm and stirring for 1-2 hours to obtain the epoxy adhesive; The preparation method of the modified polyurethane comprises the steps of (1) adding 1, 12-dodecanediol into dichloromethane, adding epoxidized silicon dioxide and triethylamine under the condition of nitrogen atmosphere and ice water bath, uniformly mixing for 10-12 hours, adding deionized water to terminate the reaction, adjusting the pH value to be neutral, filtering, washing and drying to obtain modified silicon dioxide, (2) adding the modified silicon dioxide into DMF, performing ultrasonic dispersion to obtain a modified silicon dioxide mixed solution, stirring toluene-2, 6-diisocyanate at 50-60 ℃ for 1-2 hours, introducing nitrogen, adding polyether polyol and the modified silicon dioxide mixed solution, heating to 80-85 ℃, reacting for 2-2.5 hours, adding 1H-imidazole-4, 5-dimethanol and a catalyst, continuously reacting for 1-2 hours, and drying to obtain the modified polyurethane.
  2. 2. The preparation process of the epoxy adhesive for packaging the semiconductor chip, which is characterized in that the raw materials of the modified epoxy resin comprise, by mass, 50-60 parts of epoxy resin, 10-12 parts of 3- (perfluoro-n-hexyl) epoxypropane and 6-6.5 parts of 2-imidazole-1-ethylamine.
  3. 3. The preparation process of the epoxy adhesive for packaging the semiconductor chip, which is characterized in that the epoxy adhesive comprises, by mass, 60-75 parts of modified epoxy resin, 20-25 parts of modified polyurethane, 10-15 parts of nano zinc oxide, 3-6 parts of defoamer, 2-4 parts of curing agent and 8-12 parts of diluent.
  4. 4. The process for preparing the epoxy adhesive for packaging the semiconductor chip, which is characterized in that the raw materials of the modified silicon dioxide comprise, by mass, 4-6 parts of the epoxy silicon dioxide, 1.5-2.7 parts of 1, 12-dodecanediol and 0.17-0.3 part of triethylamine.
  5. 5. The preparation process of the epoxy adhesive for packaging semiconductor chips, which is characterized in that the raw materials of the modified polyurethane comprise, by mass, 6-9 parts of toluene-2, 6-diisocyanate, 2-3 parts of polyether polyol, 5-7 parts of modified silicon dioxide mixed solution, 1.7-2.5 parts of 1H-imidazole-4, 5-dimethanol and 0.02-0.03 part of catalyst, wherein the modified silicon dioxide accounts for 10-20wt% of the modified silicon dioxide mixed solution.
  6. 6. The process for preparing the epoxy adhesive for packaging the semiconductor chip, which is disclosed in claim 1, is characterized in that the curing agent is 4,4' -diaminodiphenyl disulfide, the defoaming agent is one of a mineral oil defoaming agent and a polyether defoaming agent, and the diluent comprises one or two of ethylene glycol diglycidyl ether and polypropylene glycol diglycidyl ether.
  7. 7. The epoxy glue for packaging semiconductor chips according to any one of claims 1 to 6.

Description

Epoxy adhesive for packaging semiconductor chip and preparation process thereof Technical Field The invention relates to the technical field of epoxy glue, in particular to epoxy glue for packaging a semiconductor chip and a preparation process thereof. Background Along with the rapid development of semiconductor technology, the packaging technology of a semiconductor chip becomes more and more critical, the semiconductor chip bears important functions such as core operation, control and the like in electronic equipment, the performance of the semiconductor chip can directly influence the quality and the service life of the whole electronic equipment, and the chip packaging is an important link for protecting the chip, realizing electrical connection and providing physical support, and has high requirements on packaging materials. The epoxy adhesive is a common material in the field of semiconductor chip packaging, the epoxy resin is a thermosetting polymer, a substance with high strength, corrosion resistance and excellent insulating property can be formed after the curing reaction, the chip and the carrier material can be firmly combined by the strong adhesive force, the stable and durable electrical connection is ensured, and meanwhile, the curing process of the epoxy adhesive is relatively simple and convenient, so that great flexibility is provided for the packaging process. However, the existing epoxy glue for packaging semiconductor chips still has some problems to be improved, (1) in terms of heat conductivity, the epoxy glue needs to have good heat dissipation capability to prevent the chips from deteriorating due to overheat performance, but part of the epoxy glue has insufficient heat conductivity and cannot meet the increasingly high-power chip heat dissipation requirement, (2) in terms of chemical stability, along with the increasing complexity of the use environment of electronic equipment, the epoxy glue needs to have stronger stability to resist the corrosion of moisture, pollutants and other chemical substances and ensure the chips to work normally in various severe environments. In summary, the preparation of the epoxy adhesive for packaging the semiconductor chip has important significance. Disclosure of Invention The invention aims to provide epoxy glue for packaging a semiconductor chip and a preparation process thereof, which are used for solving the problems in the prior art. In order to achieve the above purpose, the present invention provides the following technical solutions: the preparation process of the epoxy adhesive for packaging the semiconductor chip comprises the following operation steps: Step 1, adding epoxy resin and 3- (perfluoro-n-hexyl) epoxypropane into ethanol, uniformly mixing, adding 2-imidazole-1-ethylamine, and reacting for 4-6 hours at 50-60 ℃ to obtain modified epoxy resin; And 2, vacuumizing the modified epoxy resin, the modified polyurethane, the defoaming agent and the diluent, stirring at a rotating speed of 800-1200 rpm/min for 40-50 min, sequentially adding the nano zinc oxide and the curing agent, and reducing the speed to 200-400 rpm/min and stirring for 1-2 hours to obtain the epoxy adhesive. Preferably, the raw materials of the modified epoxy resin comprise, by mass, 50-60 parts of epoxy resin, 10-12 parts of 3- (perfluoro-n-hexyl) epoxypropane and 6-6.5 parts of 2-imidazole-1-ethylamine. The optimized raw materials of the epoxy adhesive comprise, by mass, 60-75 parts of modified epoxy resin, 20-25 parts of modified polyurethane, 10-15 parts of nano zinc oxide, 3-6 parts of defoamer, 2-4 parts of curing agent and 8-12 parts of diluent. The optimized preparation method of the modified polyurethane comprises the steps of (1) adding 1, 12-dodecanediol into dichloromethane, adding epoxidized silicon dioxide and triethylamine under the condition of nitrogen gas and ice water bath, uniformly mixing for 10-12 hours, adding deionized water to terminate the reaction, adjusting the pH value to be neutral, filtering, washing and drying to obtain modified silicon dioxide, (2) adding the modified silicon dioxide into DMF, performing ultrasonic dispersion to obtain a modified silicon dioxide mixed solution, stirring toluene-2, 6-diisocyanate at 50-60 ℃ for 1-2 hours, introducing nitrogen gas, adding polyether polyol and the modified silicon dioxide mixed solution, heating to 80-85 ℃, reacting for 2-2.5 hours, adding 1H-imidazole-4, 5-dimethanol and a catalyst, continuing to react for 1-2 hours, and drying to obtain the modified polyurethane. Preferably, the raw materials of the modified silicon dioxide comprise, by mass, 4-6 parts of epoxidized silicon dioxide, 1.5-2.7 parts of 1, 12-dodecanediol and 0.17-0.3 part of triethylamine. The optimized raw materials of the modified polyurethane comprise, by mass, 6-9 parts of toluene-2, 6-diisocyanate, 2-3 parts of polyether polyol, 5-7 parts of modified silicon dioxide mixed solution, 1.7-2.5 parts of 1H-imidazole-4, 5-