CN-121008089-B - Quick detection method and structure for strain gauge resistor
Abstract
The invention discloses a quick detection method and structure of a strain gauge resistor, wherein the method comprises the steps of preparing a row resistance scanning line corresponding to the number of rows of a sensitive grid array and a column resistance scanning line corresponding to the number of columns of the sensitive grid array on the sensitive grid array of a first strain gauge array in a bold manner, connecting the row resistance scanning line and the column resistance scanning line into a resistance detector, controlling the resistance detector to gate the row resistance scanning line and the column resistance scanning line so as to obtain resistance corresponding to each sensitive grid, and responding to the resistance of each sensitive grid to finish detection, and carrying out laser cutting on each first lead-out wire and each second lead-out wire so as to separate each sensitive grid from the row resistance scanning line and the column resistance scanning line. The invention improves the detection efficiency of the resistance values of the plurality of sensitive gates of the common substrate.
Inventors
- HE YUXIN
- HE ZHIJUN
- LIU CHANGJUN
Assignees
- 厦门市诺盛测控技术有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20251027
Claims (9)
- 1. A method for rapidly detecting resistance of a strain gage, wherein the method is applied to the strain gage comprising a detection structure, the detection structure comprising: A first strain gauge array coarse body comprises a first extraction lead connected with a first extraction electrode of each sensitive grid of a corresponding row, a second extraction lead connected with a second extraction electrode of each sensitive grid of a corresponding column, an insulation barrier between the first strain gauge array coarse body and the second strain gauge array coarse body, and a column resistance scanning line corresponding to the column number of the sensitive grid array, wherein the first strain gauge array coarse body comprises a substrate layer and a sensitive grid layer, and the sensitive grid layer comprises a plurality of sensitive grid arrays formed by the sensitive grids arranged in an array; The detection structure is configured to gate the row resistance scanning lines and the column resistance scanning lines through the resistance detector so as to obtain resistance values corresponding to the sensitive gates; the method comprises the following steps: Step S1, preparing a row resistance scanning line corresponding to the number of rows of a sensitive grid array and a column resistance scanning line corresponding to the number of columns of the sensitive grid array on a bold sensitive grid array of a first strain gauge array, wherein the row resistance scanning line comprises a first lead-out wire connected with a first lead-out electrode of each sensitive grid of a corresponding row, and the column resistance scanning line comprises a second lead-out wire connected with a second lead-out electrode of each sensitive grid of a corresponding column; S2, connecting the row resistance scanning line and the column resistance scanning line into a resistance detector, and controlling the resistance detector to gate the row resistance scanning line and the column resistance scanning line so as to obtain the corresponding resistance value of each sensitive gate, wherein the row resistance scanning line and the column resistance scanning line connected with the gate are simultaneously used as the detected sensitive gate; and step S3, responding to the resistance value of each sensitive gate to finish detection, and carrying out laser cutting on each first lead-out wire and each second lead-out wire so as to separate each sensitive gate from the row resistance value scanning line and the column resistance value scanning line.
- 2. The method according to claim 1, wherein when the first strain gauge array is a metal foil strain gauge array, the step S1 includes: Photoetching a bold sensitive grid layer of a first strain foil array to obtain the sensitive grid array, the row resistance scanning line and the column resistance scanning line, wherein the row resistance scanning line and the column resistance scanning line are in cross connection; Photoetching the cross connection of the row resistance scanning line and the column resistance scanning line to disconnect one scanning line and further isolate the row resistance scanning line from the column resistance scanning line, preparing a first insulating layer at the cross connection to cross the complete scanning line, and preparing a first conductive pattern on the first insulating layer to connect the disconnected scanning line.
- 3. The method according to claim 1, wherein when the first strain gauge array is bold, the step S1 includes: Preparing a first metal layer on the rough sensitive grid layer of the first strain gauge array, and photoetching the first metal layer to obtain the row resistance scanning line and the column resistance scanning line, wherein the sensitive grid array in the sensitive grid layer is prepared; photoetching the cross connection of the row resistance scanning line and the column resistance scanning line to disconnect one scanning line and further isolate the row resistance scanning line from the column resistance scanning line, preparing a second insulating layer at the cross connection to cross the complete scanning line, and preparing a second conductive pattern on the second insulating layer to connect the disconnected scanning line.
- 4. The method according to claim 1, wherein in step S2, further comprising: Acquiring a first additional resistance value of the row resistance value scanning line and the column resistance value scanning line in corresponding resistance value detection according to materials, effective lengths and cross sectional areas corresponding to the row resistance value scanning line and the column resistance value scanning line which are selected, wherein the effective lengths are length parts in a loop formed by the row resistance value scanning line and the column resistance value scanning line which are selected and the corresponding sensitive gate; And obtaining a first actual resistance value of the sensitive gate according to the first additional resistance value and a first measured resistance value, wherein the first measured resistance value is a direct measured resistance value of the resistance value detector.
- 5. The method according to claim 1, wherein the line resistance scan line includes a line scan main line and the first lead-out wires, the line scan main line is connected to the first lead-out electrodes of the respective sensitive gates through the respective first lead-out wires, the column resistance scan line includes a column scan main line and the second lead-out wires, the column scan main line is connected to the second lead-out electrodes of the respective sensitive gates through the respective second lead-out wires, and wherein in the step S1, the method further comprises: Determining the magnitude relation between the resistance value R3 of the first lead-out wire corresponding to each sensitive gate and the resistance value R4 of the second lead-out wire according to the effective resistance value R1 of the row scanning trunk wire corresponding to each sensitive gate and the effective resistance value R2 of the column scanning trunk wire, so that the additional total resistance R of each sensitive gate is equal, wherein the magnitude of the resistance value R3 is adjusted by adjusting the cross-sectional area and the length of the first lead-out wire, and the magnitude of the resistance value R4 is adjusted by adjusting the cross-sectional area and the length of the second lead-out wire.
- 6. The method according to claim 1, wherein after the step S2, the method further comprises: obtaining the adjustment resistance of each sensitive gate and the target resistance according to the resistance corresponding to each sensitive gate; and adjusting the resistance value of the sensitive gate according to each adjustment resistance value.
- 7. The method of claim 6, wherein when the first strain gauge array is bold, the adjusting the resistance of the sensitive grid according to each of the adjusted resistance values comprises: And polishing the surface of the sensitive gate according to each adjustment resistance value so as to thin the sensitive gate and further adjust the resistance value.
- 8. The method of claim 6, wherein when the first strain gauge array is bold, the adjusting the resistance of the sensitive gate according to each of the adjusted resistance values includes: And carrying out laser treatment on the surface of the sensitive gate according to each resistance value, so that amorphous lattice defects and/or inactive dopant atoms formed in the laser treated area of the surface of the sensitive gate change the effective carrier concentration, thereby realizing the adjustment of the resistance value.
- 9. The method for rapidly detecting the resistance of the strain gauge according to claim 1, wherein the first strain gauge array is a rough integrated body prepared by a plurality of strain gauges together, and the strain gauges at least comprise one sensitive grid.
Description
Quick detection method and structure for strain gauge resistor Technical Field The invention relates to the field of strain gauge detection, in particular to a quick detection method and structure of a strain gauge resistor. Background The strain gauge is an element for measuring strain, which is constituted by a sensitive grating or the like. The working principle of the resistance strain gauge is based on the strain effect, namely, when a conductor or a semiconductor material is mechanically deformed under the action of external force, the resistance value of the resistance strain gauge correspondingly changes, and the phenomenon is called as the strain effect. The use of strain gages has penetrated into many areas of industry, scientific research and daily life. In structural health monitoring, the strain gauge is used for monitoring stress and deformation of bridges, buildings and airplanes, for example, more than 2000 strain gauges are deployed in a Boeing 767 aerostatic test, a material mechanics test is developed by means of high-precision data support, the safety of an automobile industry is improved by monitoring a suspension and brake system, and physiological parameters such as heart rate, blood pressure and the like are measured by means of miniature strain gauges in the biomedical field. In addition, from an electronic scale and a torque sensor to a smart phone drop test, the strain gauge becomes a core sensor for connecting a physical world and a digital world by the characteristics of small volume and high sensitivity, and the development of intelligent monitoring and automatic control is continuously promoted. Because the strain gauge has higher precision requirement, the resistance of the sensitive grid is strictly controlled in the production and preparation process, and the resistance of the sensitive grid needs to be detected after the preparation of the sensitive grid is finished so as to ensure that the sensitive grid can meet the precision requirement. In the prior art, the detection of the resistance value is generally finished by contacting the probe with the sensitive gate extraction electrode, the detection of a plurality of sensitive gates cannot be finished by probe detection, and the preparation of the strain gauge is generally that a plurality of strain gauges are manufactured on the same substrate at the same time, so that the detection efficiency of the probe is low. Disclosure of Invention In view of the above-mentioned drawbacks of the prior art, the present invention is to provide a method and a structure for rapidly detecting a strain gauge resistor, which aim to improve the detection efficiency of multiple sensitive gate resistances of a common substrate. To achieve the above object, a first aspect of the present invention discloses a method for rapidly detecting resistance of a strain gauge, the method comprising: Step S1, preparing a row resistance scanning line corresponding to the number of rows of a sensitive grid array and a column resistance scanning line corresponding to the number of columns of the sensitive grid array on a bold sensitive grid array of a first strain gauge array, wherein the row resistance scanning line comprises a first lead-out wire connected with a first lead-out electrode of each sensitive grid of a corresponding row, and the column resistance scanning line comprises a second lead-out wire connected with a second lead-out electrode of each sensitive grid of a corresponding column; S2, connecting the row resistance scanning line and the column resistance scanning line into a resistance detector, and controlling the resistance detector to gate the row resistance scanning line and the column resistance scanning line so as to obtain the corresponding resistance value of each sensitive gate, wherein the row resistance scanning line and the column resistance scanning line connected with the gate are simultaneously used as the detected sensitive gate; and step S3, responding to the resistance value of each sensitive gate to finish detection, and carrying out laser cutting on each first lead-out wire and each second lead-out wire so as to separate each sensitive gate from the row resistance value scanning line and the column resistance value scanning line. Optionally, when the first strain gauge array is bold, the step S1 includes: Photoetching a bold sensitive grid layer of a first strain foil array to obtain the sensitive grid array, the row resistance scanning line and the column resistance scanning line, wherein the row resistance scanning line and the column resistance scanning line are in cross connection; Photoetching the cross connection of the row resistance scanning line and the column resistance scanning line to disconnect one scanning line and further isolate the row resistance scanning line from the column resistance scanning line, preparing a first insulating layer at the cross connection to cross the complete scanning line, and prepa