CN-121025941-B - Building embedded part state monitoring method based on magnetic induction communication

Abstract

The invention discloses a building embedded part state monitoring method based on magnetic induction communication, which relates to the technical field of building embedded part monitoring and solves the problem of insufficient safety monitoring of the whole life cycle of embedded parts in modern building engineering, and the method can be used for rapidly positioning displacement points through cross checking of distance and included angle in multi-axis monitoring of three groups of chips for scenes with high requirements on monitoring dimension such as large-scale buildings, important structure embedded parts and the like, so as to meet the requirement of all-dimensional monitoring; for small-sized components, space limitation or cost control scenes, the deflection angle test is realized by the single chip through the automatic rotating mechanism, additional hardware is not needed, displacement identification can be completed only through algorithm optimization, hardware deployment cost is reduced, the application range of the method is widened, and the embedded part monitoring requirements of different types of buildings such as houses, bridges and high-rise buildings can be flexibly adapted.

Inventors

• TAN TAO

Assignees

• 北京靖宏云泰科技有限公司

Dates

Publication Date

20260512

Application Date

20250917

Claims (6)

1. 1. The method for monitoring the state of the building embedded part based on the magnetic induction communication is characterized by comprising the following steps of: Step one, according to the test data generated between the Hall chip and the magnet, confirming different magnetic field intensities related to different magnet distances, confirming different monitoring voltages related to different magnetic field intensities, and generating an evaluation standard related to the test data based on a confirmation result; Checking and comparing the monitored voltage monitored in real time with a preset voltage, identifying whether the building embedded part of the building embedded part is abnormal in displacement according to the comparison process, and generating a displacement abnormal signal based on the identification result; Step three, based on the generated displacement abnormal signals, identifying the number of Hall chip sensors in a scene of the building embedded part, if the number is three, confirming displacement points according to the voltage characteristics and the evaluation standards of three groups of Hall chip sensors, if the number is one, confirming the monitoring voltage change characteristics generated in the rotation process by controlling the rotation of the Hall chip sensors, comparing the confirmed monitoring voltage change characteristics with the evaluation standards, confirming the displacement points, and generating displacement vectors according to the displacement points for display; When the number of the Hall chip sensors is three: randomly selecting a group of Hall chip sensors as main sensors, confirming the monitoring voltage V i associated with the main sensors at the current moment, confirming the monitoring voltage range associated with the monitoring voltage V i from the evaluation standard, confirming the magnet distance associated with the corresponding monitoring voltage V i from different monitoring voltage ranges, wherein different calibrated included angles exist in different magnet distances, sorting the associated magnet distances according to a mode of small to large values, and confirming a magnet distance sequence; Starting from the first magnet distance of the confirmed magnet distance sequence, confirming the circle of the magnet based on the included angle related to the corresponding magnet distance, sequentially selecting magnet position points from the circle, confirming the related distances L1 and L2 between the magnet position points and different position points based on the position points of the other two groups of Hall chip sensors, synchronously confirming the included angle related to the related distances, confirming the monitoring voltages related to the related distances L1 and L2 from the evaluation standard, and identifying whether the confirmed monitoring voltages are consistent with the voltage values monitored by the corresponding Hall chip sensors or not: If the positions of the first magnet and the second magnet are inconsistent, other magnet position points are continuously selected from the circles to be confirmed, if the positions of the first magnet and the second magnet are inconsistent, the positions of the first magnet and the second magnet are confirmed by adopting the same confirmation mode of the positions of the first magnet and the second magnet, the positions of the first magnet and the second magnet are confirmed, and the positions of the first magnet and the second magnet are confirmed sequentially, and the first magnet and the second magnet are confirmed until the positions of the first magnet and the second magnet are confirmed; If the positions are consistent, the selected magnet position points are directly marked as displacement points.
2. 2. The method for monitoring the state of a building embedded part based on magnetic induction communication according to claim 1, wherein in the first step, the specific mode of generating the evaluation standard based on the confirmation result is as follows: The control magnet controls the magnet to move according to a preset displacement direction, confirms the magnet distance related to the magnet distance from the Hall chip, confirms the monitoring voltage related to the corresponding magnet distance, confirms the monitoring voltage related to the same magnet distance under different included angles, and generates the monitoring voltage range related to the corresponding magnet distance; Sequencing according to the mode that the magnet distance is small to large, synchronously sequencing the related monitoring voltage ranges, taking the magnet distance as a transverse coordinate axis, taking the monitoring voltage as a vertical coordinate axis, confirming a group of two-dimensional coordinate systems, calibrating different monitoring voltage ranges related to different magnet distances in the two-dimensional coordinate systems, and generating an evaluation standard.
3. 3. The method for monitoring the state of a building embedded part based on magnetic induction communication according to claim 1, wherein in the second step, the specific mode of generating the displacement abnormal signal according to the identification result is as follows: and calibrating the real-time monitoring voltage as V i , wherein i represents the corresponding moment, comparing and checking the monitoring voltage V i with a preset voltage Vb, and directly generating a displacement abnormal signal if |V i -vb|is not less than Y1, wherein Y1 is a preset value.
4. 4. The method for monitoring a state of a building embedded part based on magnetic induction communication according to claim 3, wherein if |v i -vb| < Y1, the monitoring is continued, wherein Y1 is a preset value.
5. 5. The method for monitoring the state of a building embedded part based on magnetic induction communication according to claim 1, wherein in the third step: when the number of the Hall chip sensors is one: According to the monitoring voltage V i associated with the Hall chip sensor at the current moment, confirming the monitoring voltage range associated with the monitoring voltage V i from the evaluation standard, confirming the magnet distance associated with the corresponding monitoring voltage V i from different monitoring voltage ranges, sequencing a plurality of associated magnet distances according to a mode of small to large values, and confirming a magnet distance sequence; Controlling a Hall chip sensor to perform deflection angle test, wherein the deflection angle associated in the deflection process is a preset angle, finishing the deflection process, monitoring the monitoring voltage change data associated in the deflection process, taking the starting point in the original deflection angle test process as an initial point, and generating a voltage change data curve associated in the rotation test process; confirming an included angle A1 related to the first magnet distance of the magnet distance sequence, adopting (A1+rotation angle) =A2, confirming a change angle A2, identifying the voltage between the first magnet distance and the included angles A1-A2, generating a voltage standard curve, comparing the voltage change data curve with the voltage standard curve, placing the two groups of curves in the same two-dimensional coordinate system, aligning and overlapping initial points of the two groups of curves, confirming voltage difference values between corresponding points on different curves at the same vertical position, wherein the voltage difference value is more than or equal to 0, carrying out variance processing on the confirmed voltage difference values, confirming calibration variance, and taking the confirmed calibration variance as a calibration feature related to the magnet distance; and sequentially confirming the calibration features related to other magnet distances in the same way, selecting the minimum value from the confirmed different calibration features, taking the magnet distance related to the minimum value as a determined distance, and confirming the displacement point based on the included angle related to the determined distance.
6. 6. The method for monitoring the state of a building embedded part based on magnetic induction communication according to claim 5, wherein the third step further comprises the step of generating a displacement vector associated with the building embedded part according to the initial position point set by the building embedded part and the confirmed displacement point.

Description

Building embedded part state monitoring method based on magnetic induction communication Technical Field The invention relates to the technical field of building embedded part monitoring, in particular to a building embedded part state monitoring method based on magnetic induction communication. Background The embedded parts are used as key parts for connecting main body members and auxiliary facilities (such as pipelines, curtain walls, equipment foundations and the like) in the building structure, and the installation precision and long-term stability of the embedded parts directly determine the safety and functional reliability of the integral structure of the building. In the construction and long-term operation and maintenance processes, the embedded part is easily influenced by factors such as foundation settlement, temperature stress, vibration load, concrete shrinkage creep and the like to generate micro displacement or offset, if the displacement is not found and processed in time, long-term accumulation can cause connection looseness of the embedded part and a structural main body and unbalanced stress conduction, thereby causing potential safety hazards such as falling off of auxiliary facilities and local cracking of the structure, and even threatening the overall stability of the building in severe cases, so that the method has important engineering significance for real-time and accurate monitoring of the displacement state of the building embedded part. The traditional building embedded part monitoring method mainly relies on two types of technical paths of manual inspection and single sensor monitoring, but has obvious limitations: Firstly, manual inspection relies on staff to periodically detect through a ruler, a visual instrument or a simple instrument (such as a dial indicator), so that a great deal of labor cost is consumed, the manual inspection is limited by the periodic monitoring characteristic, the instantaneous displacement or the tiny accumulated displacement of the embedded part is difficult to capture, the problem of hidden danger discovery hysteresis is easy to occur, meanwhile, the subjectivity of manual operation and environmental interference (such as narrow building inner space and insufficient light) can also cause fluctuation of the accuracy of monitoring data, and the high-accuracy monitoring requirement cannot be met. The existing single sensor monitoring technology mainly adopts a strain gauge, an acceleration sensor or a common electromagnetic sensor, wherein the strain gauge can only monitor stress change of an embedded part and cannot directly correlate displacement, the acceleration sensor needs to acquire displacement data through integral calculation and is prone to result deviation caused by accumulated errors, the common electromagnetic sensor can indirectly reflect displacement through magnetic field change but does not consider the coupling relation of distance, included angle and voltage, the displacement state is judged only based on single distance or voltage parameters, the influence of electromagnetic interference of environment or installation angle deviation is prone to cause fuzzy positioning of displacement points, and particularly in complex building scenes, accurate displacement identification in a three-dimensional space is difficult to realize. In summary, a technical scheme capable of considering monitoring precision, scene suitability, operation convenience and early warning timeliness is needed in the field of monitoring of the embedded parts of the current building, so that the problems of strong manual dependence, insufficient precision, poor scene suitability, delayed hidden danger discovery and the like in the traditional method are solved, and the requirements of modern building engineering on the safety monitoring of the whole life cycle of the embedded parts are met. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a method for monitoring the state of a building embedded part based on magnetic induction communication, which solves the problem of insufficient safety monitoring of the whole life cycle of the embedded part in modern building engineering. The invention aims to realize the aim by adopting the following technical scheme that the method for monitoring the state of the building embedded part based on magnetic induction communication comprises the following steps: step one, according to the test data generated between the Hall chip and the magnet, confirming different magnetic field intensities related to different magnet distances, confirming different monitoring voltages related to different magnetic field intensities, and generating an evaluation standard related to the test data based on a confirmation result, wherein the specific mode is as follows: The control magnet controls the magnet to move according to a preset displacement direction, confirms the magnet distance related to the m