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CN-121027798-B - Chip high-low temperature testing device

CN121027798BCN 121027798 BCN121027798 BCN 121027798BCN-121027798-B

Abstract

The embodiment of the application provides a chip high-low temperature testing device, and relates to the technical field of chip testing. The utility model provides a chip high low temperature testing arrangement, including the rotary drum, and the base that the rotary drum below set up, the base is open-top, the heating chamber has been offered downwards, and still be equipped with the heater that can heat in the inside of heating chamber, be located the periphery of rotary drum and evenly be fixed with the testboard, be fixed with electric putter at the periphery top of rotary drum, wherein this electric putter is located the top of testboard perpendicularly, and still be equipped with the test cylinder at electric putter's end, and the inside of test cylinder is hollow form structure setting, still be fixed with the test cover at the end of test cylinder, simultaneously still be equipped with the honeycomb duct that can lead heat in the inside of rotary drum, wherein the one end opening of honeycomb duct is contradicted in the surface of test cylinder, through rotary drum rotatory fast switch-over high temperature, low temperature test station, avoid traditional incubator whole heat inertia that rises and falls, shorten test cycle by a wide margin, promote efficiency of test.

Inventors

  • LI LIANG
  • WANG YANG

Assignees

  • 苏州芯昱安电子科技有限公司

Dates

Publication Date
20260508
Application Date
20250916

Claims (8)

  1. 1. A chip high-low temperature testing device comprises a rotary drum (2) and a base (12) arranged below the rotary drum (2), and is characterized in that the base (12) is provided with a top opening, a heating cavity (121) is downwards arranged, a heater (15) capable of heating is further arranged in the heating cavity (121), a test table (22) is uniformly fixed on the outer peripheral surface of the rotary drum (2), an electric push rod (3) is fixed on the top of the outer peripheral surface of the rotary drum (2), the electric push rod (3) is vertically arranged above the test table (22), a test barrel (4) is further arranged at the tail end of the electric push rod (3), the inside of the test barrel (4) is in a hollow structure, a test cover (41) is further fixed at the tail end of the test barrel (4), a flow guide pipe (16) capable of conducting heat is further arranged in the inside the rotary drum (2), one end opening of the flow guide pipe (16) is abutted against the outer surface of the test barrel (4), a telescopic opening (44) is downwards formed in a penetrating manner at the top of the test barrel, an electric push rod (3) is vertically arranged at the top of the outer peripheral surface of the rotary drum (2), a fan (431) capable of being displaced, a fan (431) is further arranged at the tail end of the electric push rod (431) and is further arranged at the tail end of the fan (431) and is fixedly arranged at the tail end of the fan (43) and is further arranged at the tail end of the fan (43, and a refrigerating sheet is fixed on the bottom surface of the inner cavity of the heat conducting plate (431), and meanwhile, a radiating fin is fixed on the upper surface of the heat conducting plate (431), and a magnetic block is also fixed at the edge of the upper surface of the heat conducting plate (431).
  2. 2. The device for testing high and low temperatures of chips according to claim 1, wherein the fixing hole (18) above the test bench (22) is formed in the outer circumferential surface of the rotary drum (2), one end of the flow guide pipe (16) penetrates through the fixing hole (18), the top opening of the heating cavity (121) is fixedly provided with the fixing cover (14), the supporting rod (141) extends upwards from the center of the fixing cover (14), the top of the supporting rod (141) penetrates through the second bottom plate (23) fixed at the bottom of the rotary drum (2), and the surface of the fixing cover (14) is downwards penetrated with the temperature measuring hole (144).
  3. 3. The device for testing high and low temperatures of chips as defined in claim 2, wherein the outer surface of the testing cylinder (4) opposite to the fixing hole (18) is provided with an air inlet hole (42), the outer circumferential surface of the testing cover (41) is provided with a pushing groove (45), the surface of the testing table (22) is further provided with a chip energizing groove (222), and two sides of the chip energizing groove (222) are further fixed with a first limiting strip (221), wherein the surfaces of the two opposite first limiting strips (221) are provided with limiting grooves (224).
  4. 4. The device for testing high and low temperatures of chips as defined in claim 3, wherein the outer peripheral surface of the supporting rod (141) is fixedly provided with a guide plate (145), and a telescopic hole (17) is formed in the outer peripheral surface of the rotary drum (2) above the test table (22), the telescopic hole (17) is located between the fixing hole (18) and the test table (22), and a push rod (5) capable of performing telescopic displacement is arranged in the telescopic hole (17).
  5. 5. The device of claim 4, wherein the upper surface of the test bench (22) is penetrated with a blanking groove (225), the blanking groove (225) is located between the chip power-on groove (222) and the second limit bar (223), meanwhile, one end of the push rod (5) is fixed with a push plate (51), the push plate (51) is located at the upper opening of the blanking groove (225), the other end of the push rod (5) extends to the guide plate (145), and a first spring (52) is fixed between the push rod (5) and the outer peripheral surface of the guide pipe (16).
  6. 6. The device for testing high and low temperatures of chips as defined in claim 5, wherein the surface of the fixing cover (14) is further provided with a heat conducting hole (146) downward, wherein the heat conducting hole (146) and the protruding guide plate (145) are positioned at the same angle, a turntable (147) is further fixed at the lower part of the outer peripheral surface of the supporting rod (141), and simultaneously, a friction block (148) protrudes upward from the edge of the outer peripheral surface of the turntable (147), and the friction block (148) is vertically positioned below the protrusion of the guide plate (145).
  7. 7. The chip high and low temperature test device according to claim 6, wherein a rotatable shaft II (161) is provided inside the flow guide tube (16), and fan blades (162) and crown gears (163) are respectively fixed at the top and bottom of the flow guide tube (16).
  8. 8. The device for testing high and low temperatures of chips as defined in claim 7, wherein the gear I (62) is engaged and connected to the lower portion of the crown gear (163), the other end of the first rotating shaft (6) extends to the upper portion of the turntable (147) from the outside of the first rotating shaft (6) of the circular guide tube (16) of the gear I (62), and a friction disc (61) is fixed to the free end of the first rotating shaft (6).

Description

Chip high-low temperature testing device Technical Field The invention belongs to the technical field of chip testing, and particularly relates to a chip high-low temperature testing device. Background With the development of chip technology, the application field of chips has been expanded to extreme environments such as automotive electronics, aerospace, industrial control, and 5G communication. These application scenarios require that the chip remain stable and reliable in operation over a wide temperature range. Therefore, high and low temperature testing has become an indispensable key step before chip shipment for testing the electrical characteristics, functional integrity and long-term reliability of chips under different temperature conditions. In the prior art (patent application with publication number of CN116773998A and patent name of constant high temperature chip test system), the chip test efficiency is improved, and meanwhile, the stability of the test data is further improved, so that the consistency and comparability of the data are improved. In the process of realizing the technical scheme, at least the following problems are found in the prior art. However, the above-described test apparatus has significant limitations. Most of the devices can only provide a single temperature environment for testing, and when high-temperature and low-temperature testing is needed, the operation flow is very tedious and time-consuming. In addition, the test mode based on the whole cavity temperature change cannot simulate the real temperature impact environment, and the chip may suffer some abrupt temperature changes in practical application, so that the test device cannot realize high-low temperature test. Disclosure of Invention The application aims at solving at least one of the technical problems in the prior art that the chip cannot be tested at high and low temperatures. Therefore, the application provides a chip high-low temperature testing device. The chip high-low temperature testing device comprises a rotary drum and a base arranged below the rotary drum, wherein the base is provided with a top opening, a heating cavity is downwards formed in the base, a heater capable of heating is further arranged in the heating cavity, a testing table is uniformly fixed on the outer peripheral surface of the rotary drum, an electric push rod is fixed on the top of the outer peripheral surface of the rotary drum, the electric push rod is vertically arranged above the testing table, a testing cylinder is further arranged at the tail end of the electric push rod, the inside of the testing cylinder is in a hollow structure, a testing cover is further fixed at the tail end of the testing cylinder, a flow guide pipe capable of conducting heat is further arranged in the rotary drum, and one end opening of the flow guide pipe is abutted against the outer surface of the testing cylinder. Preferably, the fixed orifices of testboard top are offered in the outer peripheral face of rotary drum, and the fixed orifices is passed to the one end of honeycomb duct, and the open-top of heating chamber is fixed with fixed lid, upwards extends from the centre of a circle of fixed lid has the bracing piece, and the bottom plate second that the bottom of rotary drum was fixed is run through at the top of this bracing piece, runs through downwards at the surface of fixed lid has the temperature measurement hole. Preferably, the air inlet hole is formed in the outer surface of the test cylinder opposite to the fixing hole, the pushing groove is formed in the outer peripheral surface of the test cover, the chip power-on groove is further formed in the surface of the test bench, the first limiting strips are fixed on the two sides of the chip power-on groove, and the limiting grooves are formed in the surfaces of the two opposite limiting strips. Preferably, the top of the test cylinder is provided with a telescopic opening in a penetrating manner, a fan cylinder capable of performing telescopic displacement is arranged at the opening of the telescopic opening, the top of the fan cylinder is fixedly connected with the tail end of the electric push rod, and a heat conducting plate is further fixed at the bottom of the fan cylinder. Preferably, the heat conducting plate is hollow in the heat conducting plate, the refrigerating sheet is fixed on the bottom surface of the inner cavity of the heat conducting plate, the radiating fins are fixed on the upper surface of the heat conducting plate, and the magnetic block is fixed at the edge of the upper surface of the heat conducting plate. Preferably, the outer peripheral surface of the supporting rod is fixedly provided with a guide plate, and meanwhile, a telescopic hole is formed in the outer peripheral surface of the rotary drum above the test table, the telescopic hole is positioned between the fixing hole and the test table, and a push rod capable of performing telescopic displacement