CN-121054496-B - Plastic packaging jig for CSP (chip scale package) product
Abstract
The utility model provides a be used for CSP product plastic envelope tool, lower tool assembly includes bottom tool and support thereof, bottom tool passes through mounting plate and installs on the support, bottom tool adopts a mould two-chamber structure for hold two CSP packages simultaneously, bottom tool is equipped with the material and places the platform, the minor face both ends of placing the platform are equipped with the material and press the limit mechanism, the material is placed one side of the long limit of platform and is also equipped with the material and press the limit mechanism for carry out location all around and fixed to the CSP package, a vertex angle of placing the platform is equipped with positioning mechanism for fix a position the CSP package. The lower jig assembly adopts a one-die two-cavity structure, so that two CSP packages can be processed simultaneously in a single operation, the production efficiency is improved, and the bottom jig is fixed on the bracket through the mounting bottom plate, so that the stability and rigidity of the whole structure are ensured.
Inventors
- Tan Shenyixing
- TAN XIANJUN
Assignees
- 乐安博特半导体有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20250908
Claims (7)
- 1. Be used for CSP product plastic envelope tool, its characterized in that includes: The CSP packaging machine comprises a lower jig assembly (1), an upper jig assembly (2) and an upper and lower mechanism (3), wherein the lower jig assembly (1) comprises a bottom jig (10) and a bracket thereof, the bottom jig (10) is installed on the bracket through a mounting bottom plate (10-01), the bottom jig (10) adopts a two-cavity structure for accommodating two CSP packages simultaneously, the bottom jig (10) is provided with a material placing table (10-02), two ends of a short side of the material placing table (10-02) are provided with material edge pressing mechanisms (10-03), one side of a long side of the material placing table (10-02) is also provided with a material edge pressing mechanism (10-03) for positioning and fixing the periphery of the CSP packages, and one vertex angle of the material placing table (10-02) is provided with a positioning mechanism (10-04) for positioning the CSP packages; The positioning mechanism (10-04) is connected to the mounting bottom plate (10-01) through a mounting plate (10-04-01), the mounting plate (10-04-01) is provided with an adjusting mechanism (10-04-02), the adjusting mechanism (10-04-02) is used for adjusting the position of the positioning mechanism (10-04), the adjusting mechanism (10-04-02) is connected to a power cylinder (10-04-03), and the power cylinder (10-04-03) is connected to a second pressing block (10-04-04); The upper jig assembly (2) comprises a positioning plate (2-01) and a pressing plate (2-02), wherein the positioning plate (2-01) is arranged in the upper jig assembly (2), the pressing plate (2-02) is arranged in the upper jig assembly (2), a plurality of through holes are formed between the lower jig assembly (1) and the upper jig assembly (2), the through holes are formed between the lower jig assembly (1) and the upper jig assembly (2), a plurality of vent holes are formed between the pressing plate (2-02) and the positioning plate (2-01), and the vent holes are formed between the pressing plate (2-02) and the positioning plate (2-01); The feeding and discharging mechanism (3) is arranged between the lower jig assembly (1) and the upper jig assembly (2), the feeding and discharging mechanism (3) comprises a feeding and discharging structure (3-02), the feeding and discharging structure (3-02) is arranged in the feeding and discharging mechanism (3), the feeding and discharging structure (3-02) is provided with a CCD component, the CCD component is arranged in the feeding and discharging structure (3-02), the feeding and discharging mechanism (3) is provided with a duplex module (3-01), and the duplex module (3-01) is arranged in the feeding and discharging mechanism (3).
- 2. The plastic packaging jig for CSP products according to claim 1, wherein said material beading mechanism (10-03) is connected to a bracket of said lower jig assembly (1) through a mounting vertical plate (10-03-01), said material beading mechanism (10-03) is provided with a size adjusting component (10-03-02), said size adjusting component (10-03-02) is used for adjusting the position of said material beading mechanism (10-03), said size adjusting component (10-03-02) is connected to a first press block (10-03-04), said first press block (10-03-04) is moved up and down and is moved in a telescopic manner by a cylinder power component (10-03-05), and said cylinder power component (10-03-05) is mounted on a telescopic power component (10-03-06).
- 3. The plastic packaging jig for CSP products according to claim 1, wherein the bracket of the lower jig assembly (1) is a rectangular frame structure, the bracket is provided with a plurality of mounting holes for fixing the mounting base plate (10-01), the mounting base plate (10-01) is made of metal, the bottom jig (10) is an integral casting piece, and a plurality of processing surfaces are arranged on the surface of the bottom jig (10) so as to adapt to different process requirements.
- 4. The plastic packaging jig for the CSP product according to claim 1, wherein the material placement table (10-02) is of a rectangular platform structure, a plurality of positioning grooves are provided on the surface of the material placement table (10-02) for carrying the CSP package, a guiding structure is provided on the edge of the material placement table (10-02) for guiding the CSP package to enter and be taken out, and the material placement table (10-02) is made of aluminum alloy and has good thermal conductivity and mechanical strength.
- 5. The plastic packaging jig for CSP products according to claim 2, wherein a first pressing block (10-03-04) in the material edge pressing mechanism (10-03) is made of elastic materials and can adapt to products with different thicknesses, anti-slip lines are arranged on the surface of the first pressing block (10-03-04) to prevent the products from being displaced in the pressing process, and a buffer pad is arranged between the first pressing block (10-03-04) and the cylinder power assembly (10-03-05) to reduce the influence of impact force on the products.
- 6. The CSP product plastic package jig according to claim 1, wherein the second pressing block (10-04-04) of the positioning mechanism (10-04) is of an adjustable structure, the power cylinder (10-04-03) is a linear cylinder, and can provide a stable clamping force, and the mounting plate (10-04-01) is a horizontal mounting plate for supporting the positioning mechanism (10-04) and ensuring its position stability.
- 7. The plastic packaging jig for CSP products according to claim 1, wherein the feeding and discharging mechanism (3) is powered by a duplex module (3-01), and the duplex module (3-01) can synchronously control the movement of the material taking structure (3-02).
Description
Plastic packaging jig for CSP (chip scale package) product Technical Field The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a plastic package jig for CSP products. Background With the continuous development of semiconductor technology, the chip size is smaller and smaller, the pin pitch is narrower and narrower, and the conventional plastic packaging process cannot meet the requirements. CSP (ChipScalePackage) packaging technology has been developed, and the chip is directly packaged on the substrate without pins, so that the chip has the advantages of small size, light weight, low power consumption and the like. However, the existing CSP packaging plastic packaging process also has the following technical problems: Firstly, the prior art generally adopts a single-mode structure, namely only one CSP package body can be processed at a time, so that the utilization rate of equipment is low, the output in unit time is limited, and the current market demand of large-scale and continuous production is difficult to meet. In addition, the traditional jig lacks flexibility in the installation and debugging process, is difficult to adapt to the CSP products of different sizes or structures rapidly, and increases the time of changing the model and the cost of manual intervention. Secondly, the traditional jig depends on a simple mechanical pressing plate or a fixing clamp, lacks of the positioning and flexible clamping capability on the periphery of the CSP package body, and is easy to cause the deviation or deformation of a workpiece in the plastic packaging process. Although some equipment is provided with pneumatic clamps, the pneumatic clamp is not provided with an effective size adjusting mechanism and a buffer device, and cannot adapt to products with different thicknesses, and the products are easy to damage or poor in packaging due to uneven clamping force. Furthermore, conventionally, the jig structure often has no special through hole or ventilation channel, so that residual gas cannot be effectively discharged in the plastic packaging process, and air bubbles and cavity defects are caused, which affect the packaging reliability. Meanwhile, due to the fact that the heat conduction path is not smooth, the plastic packaging material is heated unevenly in the curing process, and the consistency of packaging quality is further reduced. Disclosure of Invention Aiming at the situation, in order to overcome the defects in the prior art, the invention provides a plastic packaging jig for CSP products, so as to at least partially solve the technical problems. The technical scheme adopted by the invention is as follows: the invention provides a plastic package jig for CSP products, which comprises the following components: Lower tool assembly, go up tool assembly and last unloading mechanism, lower tool assembly includes bottom tool and support thereof, bottom tool passes through mounting plate and installs on the support, bottom tool adopts a mould two-chamber structure for hold two CSP packages simultaneously, bottom tool is equipped with the material and places the platform, the minor face both ends of material and place the platform are equipped with material blank holder mechanism, the material is placed one side of bench length limit and is also equipped with material blank holder mechanism for fix a position around the CSP package, a vertex angle of material is placed the platform and is equipped with positioning mechanism for fix a position the CSP package. In one embodiment of the invention, the material edge pressing mechanism is connected to the bracket of the lower jig assembly through a mounting vertical plate, the material edge pressing mechanism is provided with a size adjusting component, the size adjusting component is used for adjusting the position of the material edge pressing mechanism, the size adjusting component is connected to a first pressing block, the first pressing block realizes up-and-down movement and telescopic action through a cylinder power component, and the cylinder power component is mounted on the telescopic power component. In one embodiment of the invention, the positioning mechanism is connected to the mounting plate by a mounting plate, the mounting plate being provided with an adjustment mechanism for adjusting the position of the positioning mechanism, the adjustment mechanism being connected to a power cylinder, the power cylinder being connected to a second press block. In one embodiment of the present invention, the upper jig assembly includes a positioning plate and a pressing plate, the positioning plate is disposed in the upper jig assembly, the pressing plate is disposed in the upper jig assembly, a plurality of through holes are disposed between the lower jig assembly and the upper jig assembly, the through holes are disposed between the lower jig assembly and the upper jig assembly, a plurality of ventilation