CN-121123064-B - Modularized semiconductor furnace tube equipment

CN121123064BCN 121123064 BCN121123064 BCN 121123064BCN-121123064-B

Abstract

The invention relates to the technical field of semiconductor process equipment and discloses modularized design semiconductor furnace tube equipment, which comprises a shell unit and a furnace body unit, wherein the shell unit comprises a furnace bottom and a quartz tube arranged on the furnace bottom, a furnace body shell is arranged on the furnace bottom and positioned at the outer side of the quartz tube, a thermocouple sensor is arranged on the furnace body shell, the furnace body unit comprises a modularized furnace body assembly and a sealing assembly arranged on the modularized furnace body assembly, a furnace wire fixing assembly is arranged at the inner side of the modularized furnace body assembly, the modularized furnace body assembly comprises a first furnace body and a second furnace body arranged at one side of the first furnace body, and the problems that in the prior art, the furnace body is difficult to detach in the production process, partial structure is damaged, all replacement is needed, and manufacturing, installation and replacement in the production process are inconvenient, meanwhile, furnace wires are distributed unreasonably, so that heat inside the furnace body is nonuniform, and temperature consistency cannot be ensured are solved.

Inventors

WANG LIANFU
YANG CHEN
ZHONG HUA
ZHENG YUQIAN

Assignees

北京和崎精密科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250825

Claims (4)

1. The semiconductor furnace tube equipment with the modularized design is characterized by comprising a shell unit (10) and a furnace body unit (20), wherein the shell unit (10) comprises a furnace bottom (11) and a quartz tube (12) arranged on the furnace bottom (11), a furnace body shell (13) is arranged on the furnace bottom (11) and positioned on the outer side of the quartz tube (12), a furnace top (15) is arranged on the upper side of the furnace body shell (13), and a thermocouple sensor (14) is arranged on the furnace body shell (13); The furnace body unit (20) comprises a modularized furnace body assembly (21) and a sealing assembly (22) arranged on the modularized furnace body assembly (21), and a furnace wire fixing assembly (23) is arranged on the inner side of the modularized furnace body assembly (21); The modularized furnace body assembly (21) comprises a first furnace body (211) and a second furnace body (212) arranged on one side of the first furnace body (211), and a third furnace body (213) can be arranged between the first furnace body (211) and the second furnace body (212); The first furnace body (211) comprises a furnace body (2111) and a plug tenon (2112) connected to one end of the furnace body (2111), and a plug tenon groove (2113) is formed in the other end of the furnace body (2111); the sealing assembly (22) comprises a concave buckle (221) and a sealing ring (222) arranged on the inner side of the concave buckle (221), one end of the concave buckle (221) is connected with a first fixing piece (223), and the other end of the concave buckle (221) is connected with a second fixing piece (224); The first fixing piece (223) comprises a fixing rod (2231) and a fixing attaching plate (2232) fixedly connected to one end of the fixing rod (2231), and the other end of the fixing rod (2231) is provided with a thread structure and is connected with a first fixing nut (2233); The furnace wire fixing assembly (23) comprises an insulating seat part (231) and a second fixing nut (232) connected to the insulating seat part (231), and a heating furnace wire (233) is arranged on the insulating seat part (231); the insulating seat piece (231) comprises an insulating clamping ring (2311) and a clamping groove (2312) formed in the insulating clamping ring (2311), and one side of the insulating clamping ring (2311) is fixedly connected with a mounting rod (2313).
2. The semiconductor furnace tube apparatus according to claim 1, wherein the thermocouple sensors (14) are arranged on the furnace body housing (13) at equal intervals, one end of the thermocouple sensors (14) is in contact with the furnace body unit (20), and the other end is exposed outside the furnace body housing (13).
3. The semiconductor furnace tube apparatus according to claim 1, wherein the first furnace body (211) and the second furnace body (212) are connected by means of a fitting and clamping connection, and the third furnace body (213) is connected between the first furnace body (211) and the second furnace body (212) by means of a fitting and clamping connection.
4. The semiconductor furnace tube apparatus according to claim 3, wherein the second furnace body (212) has the same structure as the first furnace body (211), so that the tenon structure of the second furnace body (212) can be clamped in the insertion tenon groove (2113).

Description

Modularized semiconductor furnace tube equipment Technical Field The invention relates to the technical field of semiconductor process equipment, in particular to semiconductor furnace tube equipment with modularized design. Background The high temperature/medium temperature/low temperature processes in the semiconductor manufacturing process, such as film growth, diffusion annealing, oxidation, chemical vapor deposition, etc., all rely on semiconductor furnace tube equipment to provide a reaction chamber, and the most important of the reaction chambers is temperature control. The high temperature of the furnace body in the furnace tube equipment is kept uniform at 300-1400 ℃ generally, so that heat loss is avoided, and meanwhile, the stability of the furnace tube equipment and the process repeatability are ensured. The semiconductor furnace tube equipment in the prior art or the product is difficult to realize independent disassembly in the production process, and needs to be replaced completely after partial structures are damaged, so that the cost is high, the manufacturing, the installation and the replacement are difficult in the production process, and the accurate control of the process temperature cannot be realized. Disclosure of Invention In order to solve the problems that in the prior art, a furnace body is not easy to detach in the production process, and part of the furnace body needs to be replaced after the structure is damaged, so that the furnace wires are inconvenient to manufacture, install and replace in the production process, and meanwhile, the furnace wires are unreasonably distributed, so that the heat in the furnace body is uneven and the temperature consistency cannot be ensured, the invention provides a semiconductor furnace tube device with a modularized design, and the semiconductor furnace tube device is realized by the following technical scheme. The semiconductor furnace tube equipment with the modularized design comprises a shell unit and a furnace body unit, wherein the shell unit comprises a furnace bottom and a quartz tube arranged on the furnace bottom, a furnace body shell is arranged on the furnace bottom and positioned at the outer side of the quartz tube, a furnace top is arranged at the upper side of the furnace body shell, and a thermocouple sensor is arranged on the furnace body shell; The furnace body unit comprises a modularized furnace body assembly and a sealing assembly arranged on the modularized furnace body assembly, and a furnace wire fixing assembly is arranged on the inner side of the modularized furnace body assembly. As a preferable scheme of the modularized semiconductor furnace tube equipment, the thermocouple sensors are distributed on the furnace body shell at equal intervals, one end of each thermocouple sensor is contacted with the furnace body unit, and the other end of each thermocouple sensor is exposed outside the furnace body shell. As a preferable scheme of the modularized design semiconductor furnace tube equipment, the modularized furnace tube assembly comprises a first furnace body and a second furnace body arranged on one side of the first furnace body, and a third furnace body can be arranged between the first furnace body and the second furnace body. As a preferable scheme of the modularized semiconductor furnace tube equipment, the first furnace body and the second furnace body can be connected in a matched clamping manner, and the third furnace body can be connected between the first furnace body and the second furnace body in a matched clamping manner. As a preferable scheme of the modularized semiconductor furnace tube device, the first furnace body comprises a furnace body and a plug tenon connected to one end of the furnace body, and a plug tenon groove is formed in the other end of the furnace body. As a preferable scheme of the modularized semiconductor furnace tube equipment, the structure of the second furnace body is the same as that of the first furnace body, so that the tenon structure on the second furnace body can be clamped in the splicing tenon groove. As a preferable scheme of the semiconductor furnace tube equipment with the modularized design, the sealing assembly comprises a concave buckle and a sealing ring arranged on the inner side of the concave buckle, wherein one end of the concave buckle is connected with a first fixing piece, and the other end of the concave buckle is connected with a second fixing piece. As a preferable scheme of the modularized design semiconductor furnace tube equipment, the first fixing piece comprises a fixing rod and a fixing flitch fixedly connected to one end of the fixing rod, and the other end of the fixing rod is provided with a thread structure and is connected with a first fixing nut. As a preferable scheme of the modularized semiconductor furnace tube equipment, the furnace wire fixing assembly comprises an insulating seat piece and a second fixing nut connected to the insu