CN-121237706-B - High-cleanliness semiconductor wafer automatic loading equipment

Abstract

The invention discloses high-cleanliness semiconductor wafer automatic loading equipment, which comprises a lifting bearing table, wherein the surface of the lifting bearing table is provided with a wafer loading box, one side of the lifting bearing table is provided with a conveying device, the conveying device can convey processed wafer workpieces, one side of the lifting bearing table is provided with a clamping structure through a transmission structure, the transmission structure can carry the clamping structure to move to the top of the conveying device and clamp and convey the wafer workpieces conveyed on the surface of the conveying device, the lifting bearing table comprises a bearing plate, and the wafer loading box is spliced at the top of the bearing plate. The invention fundamentally abandons manual operation by a full-automatic system consisting of the lifting bearing table, the transportation equipment and the clamping structure controlled by the transmission structure, solves the production bottleneck problem of low loading efficiency by mechanical automation, and lays a structural foundation for realizing the pollution-free and low-damage loading process.

Inventors

• Luo Jiehe
• FENG YI
• MA WEIBAO
• LI PINGJIANG

Assignees

• 广东协铖微电子科技有限公司

Dates

Publication Date

20260512

Application Date

20250922

Claims (6)

1. 1. An automatic loading device for high-cleanliness semiconductor wafers comprises a lifting bearing table (1); the wafer loading box (2) is carried on the surface of the lifting bearing table (1), one side of the lifting bearing table (1) is provided with a conveying device (3), the conveying device (3) can convey processed wafer workpieces, one side of the lifting bearing table (1) is provided with a clamping structure (5) through a transmission structure (4), the transmission structure (4) can carry the clamping structure (5) to move to the top of the conveying device (3) and clamp and convey the wafer workpieces conveyed on the surface of the conveying device (3), the lifting bearing table (1) comprises a bearing plate (6), the wafer loading box (2) is inserted into the top of the bearing plate (6), the bottom of the bearing plate (6) is provided with a base (7), two sides of the top of the base (7) are fixedly connected with guide rods (8), one ends of the guide rods (8) far away from the base (7) penetrate through the bearing plate (6) and extend to the top of the bearing plate (6), the top of the guide rods (8) are fixedly connected with a top cover (9), the top cover (9) of the guide rods (8) is fixedly connected with the top cover (6), the top cover (9) is connected with the top cover (10), the lifting structure (10) can control the vertical lifting of the bearing plate (6) and enable the splicing groove inside the surface wafer filling box (2) to sequentially correspond to the conveying equipment (3), the clamping structure (5) is arranged on one side of the top cover (9) through the transmission structure (4), the lifting structure (10) comprises a screw rod (11) movably connected between the top cover (9) and the base (7) through a bearing, the rotation directions of the screw rod (11) are the same, the bearing plate (6) is sleeved on the surface of the screw rod (11) and is in threaded connection with the screw rod (11), synchronous motors (12) are fixedly connected to two sides of the top cover (9), the output ends of the synchronous motors (12) penetrate through the top cover (9) and are fixedly connected with the top end of the screw rod (11), the synchronous motors (12) can drive the screw rod (11) to rotate and push the bearing plate (9) to vertically lift through threads, the clamping structure (5) comprises limit rods (13) arranged at two ends of the front side of the top cover (9), two ends of the limit rods (13) are fixedly connected with one end of the top cover (9) close to the top cover (14) which is fixedly connected with one end of the top cover (14), the inner side of the supporting plate (15) is fixedly connected with a transverse moving rod (16), two sides of the surface of the transverse moving rod (16) are both in sliding connection with an extending frame (17), one end of the extending frame (17) far away from the transverse moving rod (16) extends to the top of the conveying equipment (3), the inner side of the extending frame (17) is fixedly connected with a claw (18), the claw (18) is positioned at two sides of a wafer workpiece at the top of the conveying equipment (3), the extending frame (17) can drive the claw (18) to move oppositely on the surface of the transverse moving rod (16) and clamp the wafer workpiece after moving inwards, the transmission structure (4) can drive the transverse moving rod (16) to move horizontally, so that the claw (18) carrying the wafer workpiece reciprocates between the conveying equipment (3) and the wafer loading box (2), the inner side of the vertical plate (14) is fixedly connected with a shifting fork (22), two ends of the shifting fork (22) are all arranged to incline outwards, the middle part of the shifting fork (22) is arranged to be in a state of being opposite to the surface of the transverse moving rod (16) and clamps the wafer workpiece, the shifting fork (22) is connected with a push rod (23) in a movable mode, the bottom (23) is connected with the inner side (23) of the extending frame (23) in a movable mode, the push rod (24) is in sliding connection with the shifting fork (22), and when the transmission structure (4) controls the extension frame (17) to follow the displacement of the transverse moving rod (16), the push rod (24) at the top of the extension frame (17) slides in the shifting fork (22) and automatically controls the clamping jaw (18) to open when moving to the inclined parts at the two ends of the shifting fork (22), so that the clamping jaw (18) is separated from the clamping state of the wafer workpiece.
2. 2. The high-cleanliness semiconductor wafer automatic loading device according to claim 1, wherein the transmission structure (4) comprises a transmission motor (19) fixedly connected to the right side of the vertical plate (14), the output end of the transmission motor (19) is fixedly connected with a screw rod (20), one end of the screw rod (20), far away from the transmission motor (19), penetrates through the vertical plate (14) and is movably connected with the vertical plate (14) through a bearing, a threaded sleeve (21) is connected to the surface of the screw rod (20) in a threaded manner, the threaded sleeve (21) is sleeved on the surface of the transverse rod (16) and is fixedly connected with the transverse rod (16), and when the transmission motor (19) drives the screw rod (20) to rotate, the threaded sleeve (21) on the surface of the screw rod (20) can be used for carrying the transverse rod (16) to slide and displace on the surface of the limiting rod (13).
3. 3. The high-cleanliness semiconductor wafer automatic loading equipment according to claim 2, wherein the inner side of the extension frame (17) is movably connected with a swinging rod (25) sleeved on the surface of the transverse rod (16) through a bearing, the extension frame (17) can carry the swinging rod (25) to synchronously adjust the distance on the surface of the transverse rod (16) during sliding displacement, one side of the swinging rod (25) away from the transverse rod (16) extends to the right side of a wafer workpiece, and the swinging rod (25) can swing by taking the transverse rod (16) as an axle center and push the wafer workpiece on the inner side of the clamping jaw (18) to move leftwards continuously.
4. 4. The device for automatically loading the high-cleanliness semiconductor wafers according to claim 3, wherein the two ends of the surface of the left vertical plate (14) are fixedly connected with transmission rods (26) positioned on two sides of the screw rod (20), one end of the swinging rod (25) close to the traversing rod (16) is fixedly connected with a sleeve plate (27) sleeved on the surface of the traversing rod (16), one side of the transmission rod (26) away from the vertical plate (14) extends to the inner side of the sleeve plate (27), one side of the transmission rod (26) away from the vertical plate (14) is fixedly connected with a stress rod (28) positioned on the left side of the sleeve plate (27), the sleeve plate (27) can be contacted with the stress rod (28) when the sleeve plate (27) moves horizontally for a certain distance along with the traversing rod (16), and the stress rod (28) can squeeze the traversing sleeve plate (27) to drive the swinging rod (25) to swing around the axis of the traversing rod (16).
5. 5. The automatic high-cleanliness semiconductor wafer loading device according to claim 4, wherein limiting plates (29) are fixedly connected to four corners of the top of the bearing plate (6), and one side, far away from the bearing plate (6), of each limiting plate (29) extends to the outer side of the wafer loading box (2) and is mutually spliced with the wafer loading box (2).
6. 6. A high cleanliness half according to claim 5 a method for using an automatic loading device for a conductor wafer, the method is characterized in that: the method comprises the following steps: Preparing and taking sheets, namely arranging a wafer loading box (2) on the inner side of a limiting plate (29) at the top of a bearing plate (6) to be fixed, starting a synchronous motor (12) at the top of a lifting bearing table (1), driving a screw (11) to rotate, enabling the bearing plate (6) to vertically descend along a guide rod (8) until an empty slot at the uppermost layer of the wafer loading box (2) and a wafer conveyed by conveying equipment (3) are at the same accurate horizontal height, and simultaneously, a clamping structure (5) above the conveying belt is in a standby state, wherein a push rod (24) at the top of an extension frame (17) is positioned at an inclined part at the right end of a shifting fork (22) to enable a clamping jaw (18) to be opened, and when the conveying equipment (3) conveys a processed wafer to a preset position right below the clamping jaw (18), starting a transmission motor (19) fixed on a vertical plate (14), driving a screw (20) to rotate, driving a traversing rod (16) and the whole clamping structure (5) to move towards the wafer; After the clamping is completed, a transmission motor (19) continuously works, a driving screw rod (20) drives the whole clamping structure (5) and the wafer to horizontally move, the wafer is transferred to the right front side of the wafer loading box (2) from the upper side of the conveying equipment (3) and is accurately aligned with a target slot, in the final inserting stage, the transmission motor (19) is jogged, the pushing structure is moved forward, a push rod (24) is contacted again and slides into the inclined part at the front end of a shifting fork (22), the extension frame (17) is forced to move oppositely, a claw (18) is opened along with the push rod to initially release the wafer into the slot, meanwhile, a delicate linkage mechanism is triggered, a sleeve plate (27) at one end of the swing rod (25) is contacted with a fixed stress rod (28) in the moving process, and the swing rod (25) is forced to swing slightly after being blocked, the wafer is pushed into the bottom of the slot from the side face gently; The device is reset and circulated immediately and automatically after loading of a wafer is completed, a transmission motor (19) is reversed, a driving screw rod (20) is driven to move an empty clamping structure (5) of the released wafer back to the position above the conveying device (3) to prepare for the next operation, and meanwhile, a synchronous motor (12) of a lifting bearing table (1) is started again, and a driving screw rod (11) is driven to rotate, so that the bearing plate (6) carries the wafer loading box (2) to accurately descend by the distance of one slot.

Description

High-cleanliness semiconductor wafer automatic loading equipment Technical Field The invention relates to the technical field of semiconductor wafer processing, in particular to high-cleanliness semiconductor wafer automatic loading equipment. Background Semiconductor wafers are the substrate material for manufacturing chips, the silicon used to manufacture the wafers must be ultra-high purity electronic grade silicon, any minor impurities can cause chip failure on the whole wafer, and the wafers need to be mounted to the interior of the wafer cassette for storage by loading equipment after processing. For example, the patent application number disclosed by Chinese patent net is 201910908155.8, the patent name is high-cleanliness semiconductor wafer automatic loading equipment, which mainly comprises a sealing flashboard component, a wafer bearing table component and a frame component, wherein the frame of the high-cleanliness semiconductor wafer automatic loading equipment is fixedly connected with semiconductor process equipment, and a wafer box is placed on the wafer bearing table component and automatically enters and exits the semiconductor process equipment through the sealing flashboard component. The high-cleanliness semiconductor wafer automatic loading device plays a role in fully automatically entering and exiting in a high-cleanliness environment in the process of entering and exiting the device, so that the wafers are prevented from being polluted in the process, the process standard is improved, and the yield of finished products is improved. However, the loading mode of the existing loading device is single, the wafers on the surface of the conveyor belt are required to be pushed into the wafer box in a manual pushing mode, the time required for loading a whole box of wafers is long, the loading mode becomes a bottleneck in the production process, each wafer is manually aligned with the narrow slots with different heights in the wafer box, the time is very long, and an operator is required to concentrate on the wafer, and the wafer box is easy to fatigue. And secondly, the wafer is manually taken and pushed, pollutants such as grease, dust particles and the like on the skin are easily transferred to the surface of the wafer, and in the semiconductor and photovoltaic industries, even nano particles are enough to cause product scrapping, the wafer is very fragile, the manual operation force is uneven or the angle deviation is very easy to cause wafer bending, cracking or edge breakage. Therefore, design modifications to high-cleanliness semiconductor wafer auto-loader equipment are required. Disclosure of Invention In order to solve the problems set forth in the background art, the present invention is directed to an automatic loading device for semiconductor wafers with high cleanliness, which has the advantages of improving the loading efficiency and ensuring the wafer loading qualification rate. In order to achieve the above purpose, the invention provides the following technical scheme that the high-cleanliness semiconductor wafer automatic loading equipment comprises a lifting bearing table; The surface of lift plummer carries the wafer filling box, one side of lift plummer is provided with transportation equipment, transportation equipment can transport the wafer work piece that finishes processing, one side of lift plummer is provided with the clamping structure through transmission structure, transmission structure can carry the clamping structure displacement to transportation equipment's top and carry out the centre gripping transportation to transportation equipment surface transport's wafer work piece. As the preferable mode of the invention, the lifting bearing table comprises a bearing plate, the wafer filling box is inserted into the top of the bearing plate, the bottom of the bearing plate is provided with a base, both sides of the top of the base are fixedly connected with guide rods, one ends of the guide rods, which are far away from the base, penetrate through the bearing plate and extend to the top of the bearing plate, the top ends of the guide rods are fixedly connected with a top cover, the bearing plate is in sliding connection with the guide rods, a lifting structure is arranged between the top cover and the base, the lifting structure can control the bearing plate to vertically lift and enable inserting grooves in the wafer filling box on the surface to sequentially correspond to conveying equipment, and the clamping structure is arranged on one side of the top cover through a transmission structure. As the preferable lifting structure of the invention, the lifting structure comprises a screw rod movably connected between the top cover and the base through a bearing, the rotation directions of the screw rod are the same, the bearing plate is sleeved on the surface of the screw rod and is in threaded connection with the screw rod, the two sides of the top cover are fix