CN-121237710-B - Transfer device for precise wafer marking equipment

CN121237710BCN 121237710 BCN121237710 BCN 121237710BCN-121237710-B

Abstract

The invention belongs to the technical field of wafer marking, and particularly relates to a transfer device for wafer precise marking equipment, which comprises a feeding section and a positioning marking section, wherein the feeding section comprises a feeding box table top and a feeding cartridge table top, the feeding box table top is used for feeding bare chip type wafers, the feeding cartridge table top is used for feeding wafers, a transplanting assembly used for transferring the wafers is arranged between the feeding box table top and the feeding cartridge table top, the transplanting assembly comprises a manipulator and a material taking finger at the end part of the manipulator, the positioning marking section is arranged at the tail part of the feeding section, the positioning marking section comprises a precise moving shaft and a precise platform, the precise moving shaft is used for providing transplanting power for the precise platform, the precise platform is used for adsorbing and positioning the wafers, the influence of wafer warping on the precision of laser marking can be reduced or even eliminated, and the laser marking is automatically carried out without single setting on the type of the incoming materials, so that the mixed processing of multiple types of incoming materials can be realized.

Inventors

HUANG GANG
ZHANG LAIKE
ZHOU HU

Assignees

镭神泰克科技(苏州)有限公司

Dates

Publication Date: 20260505
Application Date: 20250930

Claims (9)

1. The transfer device for the wafer precise marking equipment is characterized by comprising a feeding section and a positioning marking section, wherein the feeding section comprises a feeding box table top (A-1) and a feeding clip table top (A-2), the feeding box table top (A-1) is used for feeding bare chip type wafers, and the feeding clip table top (A-2) is used for feeding wafer type wafers; A transplanting assembly (G-1) for transferring wafers is arranged between the feeding box table top (A-1) and the feeding cartridge clamp table top (A-2), and the transplanting assembly (G-1) comprises a manipulator (G-1-1) and a material taking finger (G-1-2) at the end part of the manipulator; the positioning marking section is arranged at the tail part of the feeding section and comprises a precise movement shaft (H) and a precise platform (K), wherein the precise movement shaft (H) is used for providing transplanting power for the precise platform (K), and the precise platform (K) is used for adsorbing and positioning a wafer; The positioning marking section further comprises a fine positioning camera system (L) and a laser system (M), wherein the fine positioning camera system (L) is used for taking an image of and positioning a wafer on the precise platform (K), and the laser system (M) is used for carrying out laser high-speed ablation on the wafer positioned by the fine positioning camera system (L).
2. The transfer device for the precise wafer marking equipment according to claim 1, wherein the precise movement shaft (H) comprises a Y-axis horse (H-1) and an X-axis horse (H-2) for providing a transplanting coordinate axis for the precise platform (K), and the precise movement shaft (H) further comprises an optical positioning ruler (H-3) for monitoring the precise platform (K) in real time; A dust removing assembly (J) is arranged on the inner side of the precise movement shaft (H), and the dust removing assembly (J) comprises a rain scraping dust removing assembly (J-1).
3. The transfer device for the wafer precise marking equipment is characterized in that the precise platform (K) comprises a supporting table (K-1) for bearing a wafer, a second sucking disc (K-8) is arranged on the inner side of the supporting table (K-1), and a slewing bearing (K-2) is arranged at the bottom of the second sucking disc (K-8); The surface of the supporting table (K-1) is provided with a lifting table board (K-3), and the lifting table board (K-3) is driven by a first servo motor (K-4) to press and attach a wafer.
4. The transfer device for the precise wafer marking equipment, as set forth in claim 3, is characterized in that a pressing block (K-5) is also arranged on the surface of the supporting table (K-1) for pressing and fixing the wafer; The novel wafer cleaning device is characterized in that a second sucker (K-8) is further arranged in the supporting table (K-1) and used for adsorbing products, the supporting table (K-1) is controlled by a second servo motor (K-7), one second servo motor (K-7) is arranged at the left side and the right side of the supporting table, and an air blowing pressing block (K-6) is further arranged at the top of the supporting table (K-1) so as to blow downwards a wafer.
5. The transfer device for the precise wafer marking equipment according to claim 4, wherein the precise positioning camera system (L) comprises a lower camera system (L-1), an adjusting module (L-2) and an upper camera system (L-4), wherein the upper camera system (L-4) is mounted on a bracket and is arranged above the lower camera system (L-1), the adjusting module (L-2) is used for adjusting the lower camera system (L-1) and the upper camera system (L-4) to keep the lower camera system (L-1) and the upper camera system (L-4) coaxial, and the precise platform (K) moves between the lower camera system (L-1) and the upper camera system (L-4) when being positioned; An upper light source (L-5) is arranged at the bottom of the upper camera system (L-4), a monitoring sensor (L-6) is arranged on one side of the upper camera system (L-4), and a lower light source (L-3) corresponding to the upper light source (L-5) is arranged on the surface of the lower camera system (L-1).
6. The transfer device for the precise wafer marking equipment according to claim 5, wherein the laser system (M) comprises a laser (M-1), a laser adjusting and monitoring component (M-2) and a laser calibration adjusting component (M-3), the laser (M-1), the laser adjusting and monitoring component (M-2) and the laser calibration adjusting component (M-3) are uniformly divided into a left group and a right group, a vibrating mirror (M-4) is arranged between the tops of the left and the right laser calibration adjusting components (M-3), and a field lens (M-5) is arranged at the top of the vibrating mirror (M-4).
7. The transfer device for the precise wafer marking equipment according to claim 1, wherein the feeding material box table top (A-1) comprises a material box feeding platform (A-1-1) and a material box door opening assembly (A-1-2), the material box feeding platform (A-1-1) is used for identifying the material box, and the material box door opening assembly (A-1-2) is used for automatically dismantling the material box; The feeding box table top (A-1) also comprises an automatic positioning and edge finding device (G-2) for calling out corresponding programs according to the types of the incoming materials, the automatic positioning and edge finding device (G-2) comprises a positioning device sucker (G-2-1), The feeding material box table top (A-1) further comprises an automatic code reading assembly (F), and the automatic code reading assembly (F) comprises a first Z-axis module (F-2) and an X-axis module (F-3) which are used for controlling the code reading assembly (F-1) to move.
8. The transfer device for the wafer precise marking equipment according to claim 1, wherein the feeding cartridge clamp table top (A-2) comprises a material taking clamping jaw assembly (B), a wafer pre-positioning assembly (C) and a product conveying channel (D), a first Y-axis module (B-1) is fixedly arranged on the material taking clamping jaw assembly (B), a clamping jaw (B-2) is arranged on the surface of the first Y-axis module (B-1) and used for clamping and moving a product, the clamping jaw (B-2) is controlled by a clamping jaw cylinder (B-4), and an anti-over-pushing device (B-3) is further arranged on the clamping jaw (B-2); The wafer pre-positioning assembly (C) comprises a first sucker (C-1) and a third Z-axis module (C-4), the first sucker (C-1) is arranged on the second Z-axis module (C-2) and the second Y-axis module (C-3) to control multidirectional movement of the first Z-axis module and the second Y-axis module, the sucker assembly (C-5) is arranged at the top of the third Z-axis module (C-4), and the sucker assembly (C-5) moves a product to a material taking position through lifting of the third Z-axis module (C-4); The product conveying channel (D) comprises a first track (D-1) and a second track (D-2) which are parallel to each other, the single tail parts of the first track (D-1) and the second track (D-2) are respectively connected with a telescopic track (D-3), the product conveying channel (D) further comprises a track driving assembly (D-4) for controlling the two telescopic tracks (D-3), and the first sucker (C-1) is arranged between the two telescopic tracks (D-3).
9. The transfer device for wafer precision marking equipment according to claim 8, wherein the feeding cartridge clamp table top (A-2) further comprises a preset camera (E), the preset camera (E) comprises a positioning camera system (E-1) and a sliding table cylinder (E-2), the positioning camera system (E-1) is used for photographing and positioning, and a light source system (E-3) is arranged at the end part of the sliding table cylinder (E-2).

Description

Transfer device for precise wafer marking equipment Technical Field The invention belongs to the technical field of wafer marking, and particularly relates to a transfer device for wafer precise marking equipment. Background The wafer is stored in a conversion material box such as a closed material box/cartridge box and the like for material feeding, the wafer is placed on a specific material loading platform of equipment, the equipment detects that the wafer material is fed, and the equipment automatically and automatically performs material taking, carrying, positioning and calibrating, wafer fixing, marking work, dust removing stations, visual detection stations and the like to form and cooperate. Realizing the process of laser marking on the surface of the wafer The wafer marking device has the defects that the wafer product is very thin, so that the wafer is warped, the problem of warping cannot be solved at the marking position by laser marking, the wafer cannot be ensured to be safe when being transported and positioned and calibrated due to overlarge warping, the marking precision of the wafer cannot reach the requirement, the yield of the product is affected, the wafer product in a specific state can only be produced by the conventional device, and the mixed processing of multiple types of wafer feeding modes cannot be realized. Disclosure of Invention Aiming at the problems existing in the prior art, the invention aims to provide a transfer device for wafer precise marking equipment, which can be used for reducing or even eliminating the influence of wafer warpage on the precision of laser marking, automatically performing laser marking without single setting on the type of incoming materials, and realizing the mixed processing of multiple types of incoming material products. In order to achieve the above purpose, the present invention provides the following technical solutions: the transfer device for the wafer precise marking equipment comprises a feeding section and a positioning marking section, wherein the feeding section comprises a feeding box table top and a feeding cartridge clip table top, the feeding box table top is used for feeding bare chip type wafers, and the feeding cartridge clip table top is used for feeding wafer type wafers; A transplanting assembly for transferring wafers is arranged between the feeding box table top and the feeding cartridge clamp table top, and the transplanting assembly comprises a manipulator and a material taking finger at the end part of the manipulator; the positioning marking section is arranged at the tail part of the feeding section and comprises a precise movement shaft and a precise platform, wherein the precise movement shaft is used for providing transplanting power for the precise platform, and the precise platform is used for adsorbing and positioning a wafer; The positioning marking section further comprises a fine positioning camera system and a laser system, wherein the fine positioning camera system is used for capturing images and positioning wafers on the precise platform, and the laser system is used for performing laser high-speed ablation on the wafers positioned by the fine positioning camera system. Further, the precise movement shaft comprises a Y-axis horse and an X-axis horse for providing a transplanting coordinate axis for the precise platform, and the precise movement shaft also comprises an optical positioning ruler for monitoring the precise platform in real time; The inner side of the precise movement shaft is provided with a dust removing assembly, and the dust removing assembly comprises a rain scraping dust removing assembly. Further, the precision platform comprises a supporting table for bearing the wafer, a second sucker is arranged on the inner side of the supporting table, and a slewing bearing is arranged at the bottom of the second sucker; the lifting table surface is provided with a lifting table surface, and the lifting table surface is driven by a first servo motor to press and attach the wafer. Furthermore, a pressing block is further arranged on the surface of the supporting table and used for pressing and fixing the wafer; The tray table is characterized in that a second sucker is further arranged in the tray table and used for adsorbing products, the tray table is controlled by a second servo motor, one second servo motor is arranged left and right, and an air blowing pressing block is further arranged at the top of the tray table and used for blowing air downwards to a wafer. Further, the fine positioning camera system comprises a lower camera system, an adjusting module and an upper camera system, wherein the upper camera system is mounted on the bracket and is arranged above the lower camera system, the adjusting module is used for adjusting the lower camera system and the upper camera system to keep coaxial, and the fine platform moves between the lower camera system and the upper camera system during p