Search

CN-121374883-B - Monocrystalline silicon piece adds clamping apparatus

CN121374883BCN 121374883 BCN121374883 BCN 121374883BCN-121374883-B

Abstract

The invention discloses a monocrystalline silicon wafer processing clamp, which relates to the technical field of monocrystalline silicon processing and comprises a mounting ring sleeve, a driving gear ring, a primary clamp assembly, a guide piece, a secondary clamp assembly and a driving unit. The installation ring sleeve is used as a bearing substrate, the top of the installation ring sleeve is provided with a driving toothed ring, the inner ring is provided with a primary clamp assembly, the outer wall of the installation ring sleeve is fixedly connected with a guide piece, the guide piece is internally provided with a secondary clamp assembly, and the driving unit is internally provided with the installation ring sleeve to link the two stages of clamps. For silicon wafers with different thicknesses, a thin silicon wafer drives a driving toothed ring through a driving motor and pushes a silicon wafer clamping plate to clamp through an inclined pushing head, and a thick silicon wafer is matched with a centering arm to center and then clamped by the silicon wafer clamping arm through a driving motor and a driving ring. The clamp is integrated with the classified clamping and accurate guiding structure, has protection design, is strong in adaptability, accurate in clamping, capable of avoiding silicon wafer damage, adaptive automatic processing and improving processing efficiency and qualification rate.

Inventors

  • ZHAO SAI
  • ZHENG SEN
  • GUO XIAOYONG

Assignees

  • 江苏芯诺半导体科技有限公司

Dates

Publication Date
20260512
Application Date
20251217

Claims (5)

  1. 1. A monocrystalline silicon piece adds clamping apparatus, characterized by that, The single crystal silicon wafer clamping device comprises a mounting ring sleeve (1), wherein a driving toothed ring (2) is arranged at the top of the mounting ring sleeve (1), a plurality of groups of first-stage clamp assemblies (6) are arranged around the inner ring of the driving toothed ring (2), a plurality of groups of guide members (8) are fixedly arranged around the outer wall of the mounting ring sleeve (1), a second-stage clamp assembly (7) is arranged in each group of guide members (8), and a driving unit arranged in the mounting ring sleeve (1) drives the second-stage clamp assembly (7) to clamp a single crystal silicon wafer; The driving unit comprises a driving motor II (20), the driving motor II (20) is fixedly arranged at the bottom center of the inner wall of the mounting ring sleeve (1), the driving ring (21) is fixedly sleeved on the outer wall of the output shaft of the driving motor II (20), a fixing plate I (41) is arranged at the top center of the inner wall of the mounting ring sleeve (1) through a fixing rod I (42), and a avoidance groove II (26) is formed at the joint of the mounting ring sleeve (1) and the guide piece (8); A limiting groove (23) is formed in the guide piece (8), one end of a limiting rod II (22) is fixedly connected with the inner wall of the limiting groove (23), the other end of the limiting rod II (22) extends into the mounting ring sleeve (1) and is fixedly connected with the first fixing plate (41), a guide sliding block II (24) is movably arranged in the limiting groove (23), the guide sliding block II (24) is sleeved on the outer wall of the limiting rod II (22) in a sliding manner, one end of a first connecting rod (25) is rotationally connected with the bottom of the guide sliding block II (24), and the other end of the first connecting rod (25) penetrates through the avoidance groove II (26) and extends into the mounting ring sleeve (1) to be rotationally connected with the driving ring (21); The second-level clamp assembly (7) comprises a support frame (27), the support frame (27) is connected with the second guide slide block (24) through a second fixing rod (43), a first driving shaft (28) and a second driving shaft (29) are symmetrically arranged on two sides of the second fixing rod (43), the bottoms of the first driving shaft (28) and the second driving shaft (29) are rotationally connected with the top of the second guide slide block (24), the tops of the first driving shaft (28) and the second driving shaft (29) are movably extended into the support frame (27), and the outer wall of the extending end is fixedly sleeved with a third driving gear (40) and a second driving gear (39) respectively; The outer wall of each group of driving shafts I (28) is fixedly sleeved with the same centering arm (33), the end head of the centering arm (33) is movably provided with a centering roller (34), the outer wall of each group of driving shafts II (29) is fixedly sleeved with the same silicon wafer arm (30), the silicon wafer arm (30) is provided with two groups of avoidance grooves III (31), and the avoidance grooves III (31) of the silicon wafer arm (30) close to the end head are internally provided with elastic pressing strips (32); The fixed end of the electric push rod (38) is fixedly connected with the outer wall of the support frame (27), the output end of the electric push rod (38) is fixedly connected with the second fixed plate (36), the top of the second fixed plate (36) is fixedly provided with a U-shaped driving piece (35), two groups of driving racks (37) are symmetrically and fixedly arranged at the two ends of the U-shaped head of the U-shaped driving piece (35), and each group of driving racks (37) movably extends into the support frame (27) and is meshed with the second driving gear (39) and the third driving gear (40).
  2. 2. A single crystal silicon wafer processing jig according to claim 1, wherein, The first driving motor (5) is arranged in the mounting ring sleeve (1), an output shaft of the first driving motor (5) extends out of a top shell of the mounting ring sleeve (1) and is fixedly sleeved with the first driving gear (4), the first driving gear (4) is meshed with the driving gear ring (2), and an inner ring wall of the driving gear ring (2) extends towards the first-stage clamp assembly (6) to form the inclined pushing head (3).
  3. 3. A single crystal silicon wafer processing jig according to claim 2, wherein, The primary clamp assembly (6) comprises a primary clamp base (9), the primary clamp base (9) is mounted at the top of the mounting ring sleeve (1) through a plurality of groups of bolts (12), a first guide groove (10) and two groups of first avoidance grooves (11) are formed in the top of the primary clamp base (9), the two groups of first avoidance grooves (11) are symmetrically formed in two sides of the first guide groove (10), and the bolts (12) are mounted in the first avoidance grooves (11).
  4. 4. A single crystal silicon wafer processing jig according to claim 3, wherein, The first limiting rod (13) is fixedly arranged in the first guide groove (10), the first guide slide block (15) is movably sleeved on the outer wall of the first limiting rod (13), the first guide slide block (15) is slidably connected with the inner wall of the first guide groove (10), the reset spring (14) is sleeved on the outer wall of the first limiting rod (13), and two ends of the reset spring (14) are fixedly connected with the inner wall of the first guide groove (10) and the first guide slide block (15) respectively.
  5. 5. A single crystal silicon wafer processing jig according to claim 4, wherein, The bottom of the silicon wafer clamping plate (16) is fixedly connected with the first guide sliding block (15) and is in sliding connection with the surface of the first-stage clamp base (9), the silicon wafer clamping plate (16) extends to form an arc-shaped bulge (17) towards the direction of the outer wall of the inner ring of the driving toothed ring (2), the arc-shaped bulge (17) is abutted against the inclined pushing head (3), two groups of vacuum chuck bases (18) are symmetrically and fixedly arranged at the top of the silicon wafer clamping plate (16), and a plurality of groups of adsorption holes (19) are formed at the top of the vacuum chuck bases (18).

Description

Monocrystalline silicon piece adds clamping apparatus Technical Field The invention relates to the technical field of monocrystalline silicon processing, in particular to a monocrystalline silicon wafer processing clamp. Background The monocrystalline silicon wafer is used as a core substrate in the industries of semiconductors, photovoltaics and the like, and the accurate positioning and stable clamping are realized through the clamp in the processing process, so that the processing precision of subsequent procedures such as cutting, grinding, film coating and the like is ensured. The existing monocrystalline silicon wafer processing clamp is mainly divided into a single mechanical clamping type and a vacuum adsorption type, wherein the mechanical clamping type adopts a fixed clamping structure, a silicon wafer with specific thickness can be only matched, the adapting range is narrow, the edge of the silicon wafer is easy to crack and scratch due to improper clamping force control, the vacuum adsorption type can reduce mechanical damage, but has higher requirements on the flatness of the silicon wafer, the adsorption stability is insufficient when aiming at thicker silicon wafers, slippage is easy to occur, and concentric centering positioning is difficult to realize. Therefore, the existing clamp has the common problems of scattered structure and uncoordinated driving, and the clamp is required to be replaced or a large number of parameters are required to be adjusted when the silicon wafers with different specifications are switched, so that the operation is complex, and the high-efficiency processing requirement of an automatic production line can not be met. Accordingly, the present invention provides a monocrystalline silicon wafer processing fixture that addresses one or more of the problems set forth above. Disclosure of Invention (One) solving the technical problems Aiming at the defects of the prior art, the invention provides a monocrystalline silicon wafer processing clamp which aims at solving the problems in the background art. (II) technical scheme The invention is realized by the following technical scheme that the monocrystalline silicon wafer clamping device comprises a mounting ring sleeve, wherein a driving toothed ring is arranged at the top of the mounting ring sleeve, a plurality of groups of primary clamp assemblies are arranged around the inner ring of the driving toothed ring, a plurality of groups of guide members are fixedly arranged around the outer wall of the mounting ring sleeve, a secondary clamp assembly is arranged in each group of guide members, and a driving unit arranged in the mounting ring sleeve drives the secondary clamp assemblies to clamp monocrystalline silicon wafers. Preferably, the first driving motor is arranged in the mounting ring sleeve, an output shaft of the first driving motor extends out of the top shell of the mounting ring sleeve and is fixedly sleeved with the first driving gear, the first driving gear is meshed with the driving gear ring, and the inner ring wall of the driving gear ring extends towards the direction of the first-stage clamp assembly to form the inclined pushing head. Preferably, the primary clamp assembly comprises a primary clamp base, the primary clamp base is mounted at the top of the mounting ring sleeve through a plurality of groups of bolts, a first guide groove and two groups of first avoidance grooves are formed in the top of the primary clamp base, the two groups of first avoidance grooves are symmetrically formed in two sides of the first guide groove, and the bolts are mounted in the first avoidance grooves. Preferably, the first limiting rod is fixedly arranged in the first guide groove, the first guide sliding block is movably sleeved on the outer wall of the first limiting rod, the first guide sliding block is in sliding connection with the inner wall of the first guide groove, the reset spring is sleeved on the outer wall of the first limiting rod, and two ends of the reset spring are fixedly connected with the inner wall of the first guide groove and the first guide sliding block respectively. Preferably, the bottom of the silicon wafer clamping plate is fixedly connected with the first guide sliding block, and is in sliding connection with the surface of the first-stage clamp base, the silicon wafer clamping plate extends to form an arc-shaped bulge towards the direction of the outer wall of the inner ring of the driving toothed ring, the arc-shaped bulge is abutted against the inclined push head, two groups of vacuum chuck bases are symmetrically and fixedly arranged at the top of the silicon wafer clamping plate, and a plurality of groups of adsorption holes are formed at the top of the vacuum chuck bases. Preferably, the driving unit comprises a driving motor II, the driving motor II is fixedly arranged at the bottom center of the inner wall of the installation ring sleeve, the driving ring is fixedly sleeved on